鍍膜真空術(shù)語全集

1、鍍膜真空術(shù)語全集中英文對照5.分壓真空計(jì)分壓分析器5-1.射頻質(zhì)譜儀radio frequency mass spectrometer: 5-2.四極質(zhì)譜儀四級(jí)濾質(zhì)器quadrupole mass spectrometer； quadrupole mass filer : 5-3.單極質(zhì)譜儀 momopole mass spectrometer： 5-4.雙聚焦質(zhì)譜儀 double focusing mass spec trometer： 5-5.磁偏轉(zhuǎn)質(zhì)譜儀 magn etic deflect ion mass spectrometer： 5-6.余擺線聚焦質(zhì) 譜儀 trochoidal f

2、ocusing mass spectrometer： 5-7.盤旋質(zhì)譜儀 omegatron mass spectrome ter：5-8.飛行時(shí)間質(zhì)譜儀time of flight mass spectrometer：6.真空計(jì)校準(zhǔn)6-1.標(biāo)準(zhǔn)真空計(jì) reference gauges: 6-2.校準(zhǔn)系統(tǒng) system of calibration : 6-3.校準(zhǔn)系數(shù) K calibratio n coefficient : 6-4.壓縮計(jì)法 meleod gauge method: 6-5.膨脹法 expansion method： 6 -6.流導(dǎo)法 flow method: 4.1.真空

3、系統(tǒng) vacuum system 1-1.真空機(jī)組 pump system:1-2.有油真空機(jī)組 pump system used oil :1-3.無油真空機(jī)組 oil free pump system 1-4.連續(xù)處理真空設(shè)備continuous treatment vacuum plant:1-5.閘門式真空系統(tǒng) vacuum system with an air-lock :1-6.壓差真空系統(tǒng) differentially pumped vacuum system:1-7.進(jìn)氣系統(tǒng)gas admittanee system: 2.真空系統(tǒng)特性參量 2-1.抽氣裝置的抽速 volume

4、 flo w rate of a pumping unit : 2-2.扌由氣裝置的扌由氣量 throughput of a pumping unit : 2 -3.真空系統(tǒng)的放氣速率 degassing(outgassing) throughput of a vacuum system:2-4.真空系統(tǒng)的漏氣速率leak throughput of a vacuum system: 2-5.真空容器的升壓速率 rate of pressure rise of a vacuum chamber: 2-6.極限壓力 ultimate pressure: 2-7.剩余壓力 residual pre

5、ssure: 2-8.剩余氣體譜 residual gas spectrum: 2-9.根底壓力 base pressu re:2-10.工作壓力 working pressure: 2-11.粗抽時(shí)間 roughing time : 2-12.抽氣時(shí)間 pump-down time: 2-13.真空系統(tǒng)時(shí)間常數(shù) time constant of a vacuum system: 2-14.真 空系統(tǒng)進(jìn)氣時(shí)間 venting time:3.真空容器3-1.真空容器；真空室 vacuum chamber:3-2.圭寸離真空裝置 sealed vacuum device:3-3.真空鐘罩vacuu

6、m bell jar:3-4.真空容器底板vacuum base plate: 3-5.真空岐管vacuum manifold : 3-6.前級(jí)真空容器貯氣罐 backing reservoir:3-7.真空保護(hù)層 outer chamber: 3-8.真空閘室 vacuum air lock: 3-9.真空冷凝器；蒸汽冷凝器 device for con de nsing vapor: 4.真空封接和真空引入線4-1.永久性真空圭寸接 perma nent seal : 4.2.玻璃分級(jí)過渡圭寸接 graded seal : 4-3.壓縮玻 璃金屬圭寸接 *pression glass -t

7、o-metal seal:4-4.匹配式玻璃金屬圭寸接 matched glass-to-metal seal: 4-5.陶瓷金屬圭寸接ceramic-to-metal seal: 4-6.半永久性真空圭寸接 semi-per manent seal :4-7.可拆卸的真空圭寸接 demountable joint :4-8.液體真空圭寸接liquid seal 4-9.熔融金屬真空圭寸接 molten metal seal: 4-10.研磨面搭接圭寸接 ground and lapped s eal: 4-11.真空法蘭連接 vacuum flange connection: 4-12.真空

8、密圭寸墊 vacuum-tight ga sket: 4-13.真空密圭寸圈ring gasket: 4-14.真空平密圭寸墊flat gasket: 4-15.真空引入線f eedthrough leadthrough: 4-16.真空軸密圭寸 shaft seal: 4-17.真空窗 vacuum window : 4 -18.觀察窗 viewing window : 5.真空閥門 5-1.真空閥門的特性 characteristic of vacuum valves:.真空閥門的流導(dǎo) conductanee of vacuum valves:.真空閥門的閥座漏氣率 leak rate o

9、f the vacuum seat:5-2.真空調(diào)節(jié)閥 regulating valve:5-3.微調(diào)閥 micro-adjustable valve:5-4.充氣閥 charge valve:5-5.進(jìn)氣閥 gas admittanee valve :5-6.真空截止閥 break valve:5-7.前級(jí)真空閥 backing valve: 5-8.旁通閥 by-pass valve : 5-9.主真空閥 ma in vacuum valve:5-10.低真空閥 low vacuum valve:5-11.高真空閥 high vacuum valve:5-12.超高真空閥；UHV 閥 ul

10、tra-high vacuum valve : 5-13.手動(dòng)閥manually operated valve : 5-14.氣動(dòng)閥 pneumatically operated valve : 5-15.電磁閥 elec tromagnetically operated valve:5-16.電動(dòng)閥 valve with electrically motorized operation: 5-17.擋板閥 baffle valve : 5-18.翻板閥 flap valve: 5-19.插板閥 gate valve: 5-20. 蝶閥butterfly valve:6.真空管路6-1.粗抽管

11、路roughing line : 6-2.前級(jí)真空管路backing line : 6-3.旁通管路；By-Pass管路 by-pass line : 6-4.抽氣圭寸口接頭 pumping stem: 6 -5.真空限流件 limiting conductanee:6-6.過濾器 filter: 5.1.一般術(shù)語 11 真空鍍膜 vacuum coat in g:1-2 基片 substrate:1-3 試驗(yàn)基片 testi ng substrate: 1-4鍍膜材料 coati ng material:1-5 蒸發(fā)材料 evaporation material:1-6 濺射材料 sputt

12、ering material: 1-7 膜層材料(膜層 材質(zhì))film material: 1-8 蒸發(fā)速率 evaporation rate: 1 -9 濺射速率 sputtering rate:1-10 沉積速率 deposition rate:1-11 鍍膜角度 coating angle: 2.工藝 2-1 真空蒸膜 vacuum evaporation coating : (1).同時(shí)蒸發(fā) simultaneous eva poration :(2).蒸發(fā)場蒸發(fā) evaporation field evaporation： (3).反響性真空蒸發(fā) reactivevacuum eva

13、poration：(4).蒸發(fā)器中的反響性真空蒸發(fā) reactive vacuum evaporation in evaporator:(5).直接加熱的蒸發(fā) direct heating evaporation:(6).感應(yīng)加熱蒸發(fā) inducedheating evaporation：(7).電子 束蒸發(fā) electron beam evaporation： 二工激光束蒸發(fā) laser beam evaporati on : (9).間接加熱的蒸發(fā) in direct heat ing evaporati on： (10).閃蒸 flas h evaportion : 2-2 真空濺射 v

14、acuum sputtering: (1).反響性真空濺射 reactive vacuum sputtering:(2).偏壓濺射 bias sputtering:(3).直流二級(jí)濺射 direct current diode sputtering :(4).非對稱性交流濺射 asymmtric alternate current sputtering:(5).高頻二極濺射high frequency diode sputtering:(6).熱陰極直流濺射三極型濺射 hot cathode direct current sputtering: (7).熱陰極高頻濺射三極型濺射hot cath

15、ode high frequency sputtering :；.離子束濺射 ion beam sputtering:(9).輝光放電清洗 glow discharge cleaning:2-3 物理氣相沉積 PVD physical vapor deposition :2-4 化學(xué)氣相沉積 CVD chemical vapor deposition : 2-5 磁控濺射 magnetron sputtering: 2-6 等離子體化學(xué)氣相沉 積；PCVD plasma chemistry vapor deposition :2-7 空心陰極離子鍍 HCD hollow cathode dis

16、charge deposition :2-8 電弧離子鍍 arc discharge deposition :3.專用部件 3-1鍍膜室 coati ng chamber: 3-2 蒸發(fā)器裝置 evaporator device: 3-3 蒸發(fā)器 evaporator: 3 -4直接加熱式蒸發(fā)器 evaporator by direct heat: 3-5間接加熱式蒸發(fā)器 evaporator by i ndirect heat:3-7 濺射裝置 sputtering device: 3-8 靶 target:3-10 時(shí)控?fù)醢?timing shutter: 3-11 掩膜 mask:3-1

17、2 基片支架 substrate holder:3-13 夾緊裝置 clamp: 3-14換向裝置 reversing device:3-15 基片加熱裝置 substrate heating device :3-16 基片冷卻裝置substrate coldi ng device: 4.真空鍍膜設(shè)備 4-1真空鍍膜設(shè)備 vacuum coati ng pl ant:(1).真空蒸發(fā)鍍膜設(shè)備 vacuum evaporation coati ng pla nt:(2).真空濺射鍍膜設(shè)備vacuum sputteri ng coat ing pla nt: 4-2 連續(xù)鍍膜設(shè)備 con ti n

18、u ous coati ng pla nt:4-3 半連續(xù)鍍膜設(shè)備 semi- continuous coating plant 6. 1.漏孔 1-1 漏孔 leaks: 1-2 通道漏孔 channel leak:1-3 薄膜漏孔 membrane leak:1-4 分子漏孔 molecular leak:1-5 粘滯漏孔 vixcous leak:1-6 校準(zhǔn)漏孔 calibrated leak:1-7 標(biāo)準(zhǔn)漏孔 reference leak :1-8虛漏 virtual leak：1-9 漏率 leak rate: 1-10 標(biāo)準(zhǔn)空氣漏率 standard air leak rate:

19、 1-11等值標(biāo)準(zhǔn)空氣漏率 equivale nt sta ndard air leak rate:1-12探索示漏氣體： 2.本底 2-1 本底 background: 2-2 探索氣體本底 search gas background : 2-3 漂移 drift: 2 -4噪聲noise:3.檢漏儀 3-1檢漏儀leak detector:3-2高頻火花檢漏儀 H.F. spark leak detector：3-3 鹵素檢漏儀 halide leak detector：3-4 氦質(zhì)譜檢漏儀 helium mass spectrometer leak detector： 3-5 檢漏儀的最

20、小可檢漏率minimum detectable rate of leak detector:4.檢漏 4-1 氣泡檢漏 leak detection by bubbles:4-2 氨檢漏 leak detection byammonia: 4-3 升壓檢漏 leak detect ion of rise pressure:4-4 放射性同位素檢漏radioactive isotope leak detecti on: 4-5 熒光檢漏 fluoresce nee leak detect ion 7.1.一般術(shù)語1-1 真空枯燥 vacuum drying :1-2 冷凍枯燥 freeze dr

21、ying :1-3 物料 material:1-4待枯燥物料 material to be dried :1-5 枯燥物料 dried material :1-6 濕氣 moisture ； humidity :1-7 自 由濕氣 free moisture :1-8 結(jié)合濕氣 bound moisture:1-9 分濕氣 partial moisture: 1-10含濕量 moisture content: 1-11 初始含濕量 initial moisture content: 1 -12 最終含濕量 final residual moisture:1-13 濕度 degree of mo

22、isture ,degree of humidity :1-14 枯燥物質(zhì) dry matter :1-15 枯燥物質(zhì)含量 content of dry matter: 2.枯燥工藝 2-1 枯燥階段 stages of dryi ng :(1).預(yù)枯燥 prelim in ary dry:(2). 一次枯燥廣義primary drying(in general):(3). 一次枯燥冷凍枯燥primary drying(freeze-drying):(4).二次枯燥 seco ndary dryi ng :2-2.(1).接觸枯燥 con tact dryi ng :(2).輻射枯燥 dryi

23、ng by radiati on :(3).微波枯燥 microwave drying :(4).氣相枯燥 vapor phase drying: (5).靜態(tài)枯燥 static drying :(6).動(dòng)態(tài)枯燥 dynamic drying :2-3 枯燥時(shí)間 drying time: 2-4 停留時(shí)間 length of stay(in the drying chamber): 2-5 循環(huán)時(shí)間 cycle time : 2 -6 枯燥率 dessication ratio :2-7 去濕速率 mass flow rate of humidity :2-8 單位面積去濕速率 mass fl

24、ow rate of humidity per surface area: 2-9 枯燥速度 drying speed : 2 -10 枯燥過程 drying process: 2-11 加熱溫度 heating temperature: 2-12 枯燥溫度 temp erature of the material being dried :2-13 枯燥損失 loss of material during the dryingprocess : 2-14 飛塵 lift off (particles):2-15 堆層厚度 thickness of the material:3.冷凍枯燥 3-

25、1 冷凍 freezing : (1).靜態(tài)冷凍 static freezing : (2).動(dòng)態(tài)冷凍 dynamic fre ezing: (3).離心冷凍 centrifugal freezing : (4).滾動(dòng)冷凍 shell freezing : (5).旋轉(zhuǎn)冷凍 s pin-freezing : (6).真空旋轉(zhuǎn)冷凍 vacuum spin-freezing : (7).噴霧冷凍 spray freezing :.氣流冷凍 air blast freezing :3-2 冷凍速率 rate of freezing :3-3 冷凍物料 frozen material: 3-4 冰核

26、ice core:3-5 枯燥物料外殼 envelope of dried matter: 3-6 升華外表 sublimation front:3-7融化位置freezer burn:4.真空枯燥設(shè)備；真空冷凍枯燥設(shè)備4-1真空枯燥設(shè)備和真空冷凍枯燥設(shè)備vacuum drying plant and vacuum freeze drying plant: 4-2 真空枯燥器和冷凍枯燥器vacuum drying chamber and freeze drying chamber: 4-3加熱外表heating surface:4-4物品裝載面shelf :4-5枯燥器的處理能力 throug

27、hput (of the vacuum drying chamber): 4-6 單位面積枯燥器處理能力throughput pershelf area: 4-7 冰冷凝器 ice con de nser: 4-8 冰冷凝器的負(fù)載 load of the ice condens er: 4-9冰冷凝器的額定負(fù)載 rated load of the ice con de nser 8. 1.一般術(shù)語 1-1試樣 sample : (1).外表層 surface layer：(2).真實(shí)外表 true surface: (3).有效外表積 effective surface area: (4).宏

28、觀外表； 幾何外表macroscopic surface area; geometric surfacearea: (5).外表粒子密度 surface particle den sity: (6).單分子層 mo no layer:.外表單分子層粒子密度 mono layer den sity:乞工：.覆蓋系數(shù) coverage ratio:1-2激發(fā) excitation:(1).一次粒子 primary particle :(2).一次粒子通量 primary particle flux :.一次粒子通量密度 density of primary particle flux :(4).一

29、次粒子負(fù)荷 primary particle load: (5).一次粒子積分負(fù)荷integral load of primary particle : (6).一次粒子的入射能量 e nergy of the incident primary particle :(7).激發(fā)體積 excited volume: $三：.激發(fā)面積 excited area: (9).激發(fā)深度 excited death： (10).二次粒子 secondary particles: (11).二 次粒子通量 sec on dary particle flux :(12).二次粒子發(fā)射能 energy of t

30、he emitted sec ondary particles:(13).發(fā)射體積 emitting volume:(14).發(fā)射面積 emitting area:(15).發(fā)射深度 emitting depth: (16).信息深度 information depth: (17).平均信息深度 mean inf ormation depth:1-3 入射角 angle of incidenee:1-4 發(fā)射角 angle of emission:1-5觀測角 observation:1-6 分析外表積 analyzed surface area:1-7 產(chǎn)額 yield :1-8 夕卜表層微

31、小損傷分析 minimum damage surface analysis:1-9夕卜表層無損傷分析 non-destructive surface analysis: 1-10 斷面深度分析 profile analysis in depth; depth profile an alysis :1-11 可觀測面積 observable area:1-12 可觀測立體角 observable solid angle:1-13承受立體角；觀測立體角angle of acceptanee:1-14角分辨能力angular resolving power:1-15 發(fā)光度 luminosity :

32、1-16 二次粒子探測比 detection ratio of secondary particles:1-17 夕卜表分析儀的探測極限 detect ion limit of an apparatus for surface analysis:1-18 夕卜表層分析儀靈敏度 sensitivity of an apparatus for surface analysis:119 夕卜表層分析儀質(zhì)量分辨能力mass resolving power of an apparatus for surface analysis:1-20 夕卜表層分析儀能量分辨能力energy resolving power of an apparatus for surface analysis:1-21 本底壓力 base pressure 1-22 工作壓力 working pressure:2.分析方法 2-1 二次離子質(zhì)譜術(shù)； SIMS secondary ion mass spectroscopy:(1).靜態(tài)二次離子質(zhì)譜術(shù)；靜態(tài) SI