SM缺陷及防范措施概述

SMTdefectsandcountermeasureSMT缺陷及防范措施2023/4/301IdentifySMTdefectsIdentifytheSMTdefectsaccordingtoIPC-A-610(Rev:D)根據(jù)IPC-A-610(Rev:D)確定缺陷．

Thisstandardisacollectionofvisualqualityacceptabilityrequirementsforelectronicassemblies.IPC-A-610是關(guān)于電子組裝外觀質(zhì)量驗收條件要求的文件．2023/4/302Majorcontributortodefects

缺陷的主要分布Source:MPM’sAuser’sguidetomorePreciseSMTprinting2023/4/303Knowthecommondefect

了解常見缺陷類型Analysizethepossiblecause

分析可能的原因Countermeasureforthedefects

基于以上原因采取的對策

LearningObjectives

學習目的2023/4/304?

Chip

components

standing

on

a

terminal

end

(tombstoning).片式元件末端翹起（墓碑）Tombstoning/立碑2023/4/305Countermeasure/對策Mechanism:Surfacetensionincomponentterminalisuneveninreflow.原理:在回流過程中零件兩末端的表面張力不均衡.1.Componentterminalheatdistributedunevenly零件兩末端受熱分布不均衡.Insufficientsoaktime:Reflowprofileoptimization.

保溫區(qū)時間太短:優(yōu)化回流曲線參數(shù).2.PCBPaddesignissue(thepadsdistanceistoobig):improvePCBpaddesign.PCB焊盤設(shè)計問題(焊盤間距太大):改善PCB焊盤設(shè)計.Tombstoning/立碑2023/4/306Countermeasure/對策

3.Componentterminaloxidizationorcontamination:SolderabilitytestifnecessaryandRTVthedefectmaterial.

元件末端氧化或者受污染:根據(jù)情況做可焊性實驗并且退還缺陷物料.4.Printingmisalignment:adjustprintingmachineparameters.絲印偏位:校正絲印機的參數(shù).5.Placementmisalignment:OptimizetheP&Pmachineparameters.

貼片偏位:優(yōu)化貼片機的參數(shù).6.Stencilaperturedesignissue:studyandimprovetheaperturedesign.

鋼網(wǎng)開孔的設(shè)計問題:研究并且改善開孔設(shè)計.

Tombstoning/立碑2023/4/307?Asolderconnectionacrossconductorsthatwasjoined.焊錫在導(dǎo)體間非正常連接.?

Solder

has

bridged

to

adjacent

non-common

conductor

orcomponent.焊錫橋連到相鄰的非導(dǎo)體或元件.Solderbridge/橋聯(lián)2023/4/308Countermeasure/對策

1.Screenprintingissue/絲印問題:a)PasteheightoutofUCL:Adjusttheprintertocontrolthepasteheight.錫膏高度超出控制上線:校正絲印機,控制錫膏高度.b)Pasteprintingmisalignmentorbridging:Finetuneprintingmachine./錫膏印刷偏位或者橋聯(lián):優(yōu)化絲印機.c)Icicleprinting:Finetuneprintingmachineorchangetolowerviscositypaste.絲印拉尖:優(yōu)化絲印機或者使用低粘性的錫膏.d)Solderpastecollapse:changetohigherviscositypaste./錫膏塌陷:使用高粘性的錫膏.e)Nonstandardstencilapertureopening:Studyandimprovetheaperture./不標準的鋼網(wǎng)開孔:研究并改善開孔.Solderbridge/橋聯(lián)Icicleprinting絲印拉尖Pastecollapse錫膏塌陷Bridging橋聯(lián)Misalignment印刷偏位2023/4/309Countermeasure/對策2.Pick&Placement/貼片a)Componentplacingmisalignment:FinetunetheP&Pmachine.元件貼片偏位:優(yōu)化貼片機的參數(shù).b)Highpressureforplacement:reducepressuretopropervalue.

貼片壓力過大:減少壓力到適當?shù)膮?shù).3.Wavesoldering/波峰焊a)Lowconveyorramp:Raisetheconveyorrampperactualstatus.傳送帶角度過小:根據(jù)實際情況加大傳送帶角度b)Lessfluxonboard:Increasethefluxsprayvolumeonboardbeforegoingthroughwavesoldering.板上的助焊劑較少:波峰焊接之前加大助焊劑的噴射量Solderbridge/

橋聯(lián)2023/4/3010Componentdamaged(Nicks,cracks,orstressfractures)/元件損壞Nicks,cracks,orstressfractures.缺口，裂紋，壓痕2023/4/3011Countermeasure/對策1.Rawmaterialdamaged:purgethebatchmaterial./來料損壞:清除這批來料.2.DamagedduringSMTprocess(Fixtureormachinetouchit):Investigateandtakecorrectiveactionsfornonstandardoperation.

在SMT流程中損壞(夾具和設(shè)備接觸):調(diào)查分析并且對不規(guī)范的操作作出矯正行動.3.Fastcoolingrateonreflowprocess:Controlthecoolingratetobelow4degreepersecond.

在回流過程中冷卻速率過快:控制冷卻速度使斜率保持在每秒4度以下.Typicalreflowprofile/回流曲線典例:PreheatstageSoakstageReflowstagePeaktemp.Cooldown<4oC/sComponentdamaged(Nicks,cracks,orstressfractures)/元件損壞2023/4/3012Misalignment偏位2023/4/3013Countermeasure/對策1.P&Pmachinefunctionunstable:FinetunetheP&Pmachine.

貼片機性能不穩(wěn)定:優(yōu)化貼片機性能參數(shù).a)FinetuneX,Ydata/調(diào)整X,Y坐標b)Optimizepickandplacementparameters./校正吸料和貼片的參數(shù).

2.Componentterminationoxidization:Solderabilitytestifnecessary.Purgethefailedmaterial/元件末端氧化:可焊性實驗,清除不合格的來料.

3.Operatortouchthecomponentpriortoreflow:Standardizetheoperatorhandling(documentcontrol)/在回流爐前目檢操作員碰到貼片元件:標準化操作員操作(文件控制)4.Airflowrateinthereflowovenissohighthatthecomponentsaremoved.回流爐內(nèi)空氣流量太高以致吹偏了元件.Misalignment偏位2023/4/3014Componentleadlifted元件引腳翹高One

leadorseriesofleadsoncomponentisoutofalign-ment

and

fails

to

make

contact

with

the

land.元件一個或多個引腳變形不能與焊盤正常接觸．2023/4/3015Componentleadlifted元件引腳翹高Countermeasure/對策1.Componentleadbentbeforeplacement:Sortthedefectivepartandreturnittovendor.貼片前元件引腳變形:挑選出缺陷元件,退回供應(yīng)商．2.Manualplacementtheloosepart:Inspectthepartbeforepassittoreflow.手放散料:回流前目檢．2023/4/3016Solderball錫珠Solderballsarespheresofsolderthatremainafterthesolderingprocess.Solderballsviolateminimumelectricalclearance.焊錫球是焊接后形成的呈球狀焊錫.

Solderfinesaretypicallysmallballsoftheoriginalsolderpastemetalscreensizethathavesplatteredaroundtheconnectionduringthereflowprocess.焊錫殘渣是在回流中形成的小的球狀或不規(guī)則狀焊錫球.2023/4/3017Solderball錫珠

Countermeasure/對策1.StencilAperturedonotfocustopad:improvestencilapertureopening.

鋼網(wǎng)開孔沒有對準焊盤中心:改善鋼網(wǎng)開孔.2.Printingmisalignment:Finetuneprintmachine.

絲印偏位:調(diào)整絲印機狀態(tài).3.Excesspaste:Cpkcontrol.多錫:Cpk控制.4.DampPCB:BakethePCBbeforeloadingittoSMT.PCB焊盤受潮:SMT組裝流程之前烘烤PCB.6.Stencilpolluted:cleanthestencil.鋼網(wǎng)臟污:清洗鋼網(wǎng).7.Profilerampupistoofast:Optimizereflowprofile.

回流曲線升溫速度過快:優(yōu)化回流曲線.8.Pasteoxidized:exchangewithfreshsolderpaste.錫膏氧化:更換新錫膏.9.Chipwaveorsolderwaveheightistoohighcausedexcesssoldertotopside:adjustthewavesolderingheighttoproperlevel(wavesolder).

波峰高度設(shè)置的太高致使多余的焊錫到頂面:校正波峰焊設(shè)置到適當?shù)母叨?/p>

(波峰焊接).2023/4/3018Non-Wetting,Dewetting/虛焊，半潤濕

?

Solder

has

not

wetted

to

the

land

or

termination

where

solderisrequired.

虛焊:需要焊接的引腳焊盤不潤濕．?Solder

coverage

does

no

meet

requirements

for

the

termination

type.

?

Dewettingasaconditionresultswhenmoltensoldercoatsasurfaceandthenrecedestoleaveirregularly-shapedmoundsofsolderthatareseparatedbyareasthatarecoveredwithathinfilmofsolderandwiththebasismetalorsurfacefinishnotexposed.

半潤濕:熔化的焊錫浸潤表面后收縮,留下一焊錫薄層覆蓋部分區(qū)域,焊錫形狀不規(guī)則.2023/4/3019Non-Wetting,Dewetting/虛焊，半潤濕1.Poorsolderabilityofcomponentorpad./元件或焊盤可焊性太低Rootcause:a)OlddatecomponentorPCB./陳舊元件或PCB板b)ContaminationoroxidationoncomponentorPCB.元件或焊盤污染或氧化Action:Purgethematerialforfurtherdisposition.

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