質(zhì)量專業(yè)英語詞匯.docx

質(zhì)量專業(yè)英語大全零件材料類的專有名詞CPU: central processing unit(中央處理器)IC: Integrated circuit(集成電路)Memory IC: Memory Integrated circuit（記憶集成電路）RAM: Random Access Memory（隨機存取內(nèi)存）DRAM: Dynamic Random Access Memory（動態(tài)隨機存取內(nèi)存）SRAM: Staic Random Access Memory（靜態(tài)隨機內(nèi)存）ROM: Read-only Memory（只讀存儲器）EPROM:Electrical Programmable Read-only Memory（電可抹只讀存諸器）EEPROM: Electrical Erasbale Programmable Read-only Memory（電可抹可編程只讀存儲器）CMOS: Complementary Metal-Oxide-Semiconductor（互補金屬氧化物半導體）BIOS: Basic Input Output System（基本輸入輸出系統(tǒng)）Transistor：晶體管LED:發(fā)光二極管Resistor：電阻Variator：可變電阻Capacitor:電容Capacitor array：排容Diode：二極管Transistor：三極體Transformer：變壓器（ADP）Oscillator：頻率振蕩器（0sc）Crystal：石英振蕩器XTAL/OSC:振蕩產(chǎn)生器（X）Relay：延時器Sensor：感應器Bead core：磁珠Filter:濾波器Flat Cable：排線Inductor：電感Buzzer：蜂鳴器Socket：插座Slot：插槽Fuse：熔斷器Current：電流表Solder iron：電烙鐵Magnifying glass：放大鏡Caliper：游標卡尺Driver：螺絲起子Oven：烤箱TFT:液晶顯示器Oscilloscope：示波器Connector：連接器PCB:printed circuit board（印刷電路板）PCBA: printed circuit board assembly（電路板成品）PP:并行接口HDD:硬盤FDD:軟盤PSU:power supply unit（電源供應器）SPEC:規(guī)格Attach:附件Case: 機箱，蓋子Cover：上蓋Base：下蓋Bazel：面板（panel）Bracket：支架，鐵片Lable：貼紙Guide：手冊Manual：手冊，指南Card：網(wǎng)卡Switch：交換機Hub：集線器Router：路由器Sample：樣品Gap：間隙Sponge：海綿Pallet：棧板Foam：保利龍Fiber：光纖Disk：磁盤片PROG:程序Barcode：條形碼System：系統(tǒng)System Barcode：系統(tǒng)條形碼M/B:mother board：主板CD-ROM:光驅(qū)FAN:風扇Cable：線材Audio：音效K/B:Keyboard（鍵盤）Mouse：鼠標Riser card：轉(zhuǎn)接卡Card reader：讀卡器Screw：螺絲Thermal pad：散熱墊Heat sink：散熱片Rubber：橡膠墊Rubber foot：腳墊Bag：袋子Washer：墊圈Sleeve：袖套Config：機構(gòu)Label hi-pot：高壓標簽Firmware label：燒錄標簽Metal cover：金屬蓋子Plastic cover：塑料蓋子Tape for packing：包裝帶Bar code：條形碼Tray：托盤Collecto：集線夾Holder：固定器,L鐵Connecter：連接器IDE:集成電路設(shè)備，智能磁盤設(shè)備SCSI:小型計算機系統(tǒng)接口Gasket：導電泡棉AGP:加速圖形接口PCI:周邊組件擴展接口LAN:局域網(wǎng)USB:通用串形總線架構(gòu)Slim：小型化COM:串型通訊端口LPT:打印口，并行口Power cord：電源線I/O:輸入，輸出Speaker：揚聲器EPE:泡棉Carton：紙箱Button：按鍵，按鈕Foot stand：腳架部門名稱的專有名詞QS:Quality system質(zhì)量系統(tǒng)CS:Customer Sevice 客戶服務QC:Quality control質(zhì)量管理IQC:Incoming quality control 進料檢驗LQC:Line Quality Control 生產(chǎn)線質(zhì)量控制IPQC:In process quality control 制程檢驗FQC:Final quality control 最終檢驗OQC:Outgoing quality control 出貨檢驗QA:Quality assurance 質(zhì)量保證SQA:Source(supplier) Quality Assurance 供貨商質(zhì)量保證(VQA)CQA：Customer Quality Assurance客戶質(zhì)量保證PQArocess Quality Assurance 制程質(zhì)量保證QE:Quality engineer 質(zhì)量工程CE:component engineering零件工程EE:equipment engineering設(shè)備工程ME:manufacturing engineering制造工程TE:testing engineering測試工程PPEroduct Engineer 產(chǎn)品工程IE:Industrial engineer 工業(yè)工程ADM: Administration Department行政部RMA:客戶退回維修CSDI:檢修PC:producing control生管MC:mater control物管GAD: General Affairs Dept總務部A/D: Accountant /Finance Dept會計LAB: Laboratory實驗室DOE:實驗設(shè)計HR:人資PMC:企劃RD:研發(fā)W/H:倉庫SI:客驗PD: Product Department生產(chǎn)部PA:采購(PUR: Purchaing Dept)SMT:Surface mount technology 表面粘著技術(shù)MFG:Manufacturing 制造MIS:Management information system 資迅管理系統(tǒng)DCC:document control center 文件管制中心廠內(nèi)作業(yè)中的專有名詞QT:Quality target質(zhì)量目標QP:Quality policy目標方針QI:Quality improvement質(zhì)量改善CRITICAL DEFECT:嚴重缺點（CR）MAJOR DEFECT:主要缺點（MA）MINOR DEFECT:次要缺點（MI）MAX:Maximum最大值MIN:Minimum最小值DIAiameter直徑DIMimension尺寸LCL:Lower control limit管制下限UCL:Upper control limit管制上限EMI:電磁干擾ESD:靜電防護EPA:靜電保護區(qū)域ECN:工程變更ECO:Engineering change order工程改動要求（客戶）ECR:工程變更需求單CPI:Continuous Process Improvement 連續(xù)工序改善Compatibility：兼容性Marking：標記DWGrawing圖面Standardization：標準化Consensus：一致Code：代碼ZD:Zero defect零缺點Tolerance：公差Subject matter：主要事項Auditor：審核員BOM:Bill of material物料清單Rework：重工ID：identification識別,鑒別,證明PILOT RUN: (試投產(chǎn))FAI:首件檢查FPIR：First Piece Inspection Report首件檢查報告FAA:首件確認SPC：統(tǒng)計制程管制CP: capability index（準確度）CPK: capability index of process(制程能力)PMP:制程管理計劃（生產(chǎn)管制計劃）MPI:制程分析DASefects Analysis System 缺陷分析系統(tǒng)PPB：十億分之一Flux：助焊劑P/N:料號L/N：Lot Number批號Version：版本Quantity：數(shù)量Valid date：有效日期MIL-STD：Military-Standard軍用標準ICT: In Circuit Test (線路測試)ATE：Automatic Test Equipment自動測試設(shè)備MO: Manafacture Order生產(chǎn)單T/U: Touch Up (錫面修補)I/N:手插件P/T:初測F/T: Function Test (功能測試-終測)AS組立P/K:包裝TQM:Total quality control全面質(zhì)量管理MDA:manufacturing defect analysis制程不良分析(ICT)RUN-IN:老化實驗HI-pot：高壓測試FMI：Frequency Modulation Inspect高頻測試DPPM: Defect Part Per Million(不良率的一種表達方式：百萬分之一) 1000PPM即為0.1%Corrective Action: (CAR改善對策)ACC：允收REJ:拒收S/S：Sample size抽樣檢驗樣本大小SI-SIV：Special I-Special IV特殊抽樣水平等級CON：Concession / Waive特采ISO:國際標準化組織ISA：Industry Standard Architecture工業(yè)標準體制結(jié)構(gòu)OBA:開箱稽核FIFO:先進先出PDCA:管理循環(huán)Plan do check action計劃，執(zhí)行，檢查，總結(jié)WIP:在制品（半成品）S/O: Sales Order (業(yè)務訂單)P/O: Purchase Order (采購訂單)P/R: Purchase Request (請購單)AQL:acceptable quality level允收質(zhì)量水平LQL;Limiting quality level最低質(zhì)量水平QVL:qualified vendor list合格供貨商名冊AVL ：認可的供貨商清單(Approved Vendor List)QCD: Quality cost delivery（質(zhì)量，交期，成本）MPM:Manufacturing project management制造項目管理KPI:Key performance indicate重要績效指標MVT:Manufacturing Verification Test制造驗證試產(chǎn)Q/R/S：Quality/Reliability/Service質(zhì)量/可靠度/服務STL:ship to line（料到上線）NTF:No trouble found誤判CIP:capacity improvement plan（產(chǎn)能改善計劃）MRB:material review board（物料審核小組）MRB:Material reject bill退貨單JIT:just in time（實時管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整頓，清掃，清潔，修養(yǎng)）SOP:standard operation process（標準作業(yè)程序）SIP:Specification inspection process制程檢驗規(guī)格TOP: Test Operation Process (測試作業(yè)流程)WI: working instruction（作業(yè)指導書）SMD:surface mounting device（表面粘著原件）FAR:failure aualysis report故障分析報告CAR:Corrective action report改善報告BPR： 企業(yè)流程再造 (Business Process Reengineering)ISAR ：首批樣品認可(Initial Sample Approval Request)-JIT：實時管理 (Just In Time)QCC ：品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面質(zhì)量環(huán)境管理)PD: Production Department (制造)LOG: Logistics (后勤支持)Shipping: (進出口)AOQ：Average Output Quality平均出貨質(zhì)量AOQL：Average Output Quality Level平均出貨質(zhì)量水平FMEA：failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程變更會議)CSA：Customer Simulate Analysis客戶模擬分析SQMS：Supplier Quality Management System供貨商質(zhì)量管理系統(tǒng)QIT: Quality Improvement Team 質(zhì)量改善小組QIP：Quality Improvement Plan質(zhì)量改善計劃CIP：Continual Improvement Plan持續(xù)改善計劃M.Q.F.S: Material Quality Feedback Sheet (來料質(zhì)量回饋單)SCAR: Supplier Corrective Action Report (供貨商改善對策報告)8D Sheet: 8 Disciplines sheet ( 8D單)PDCA：PDCA (Plan-Do-Check-Action) (管理循環(huán))MPQ: Material Packing Quantity (物料最小包裝量)DSCN: Delivery Schedule Change Notice (交期變更通知)QAPS: Quality Assurance Process Sheet (質(zhì)量工程表)DRP ：運銷資源計劃 (Distribution Resource Planning)DSS：決策支持系統(tǒng) (Decision Support System)EC ：電子商務 (Electronic Commerce)EDI ：電子數(shù)據(jù)交換 (Electronic Data Interchange)EIS ：主管決策系統(tǒng) (Excutive Information System) ：企業(yè)資源規(guī)劃 (Enterprise Resource Planning)FMS ：彈性制造系統(tǒng) (Flexible Manufacture System)KM ：知識管理 (Knowledge Management)4L ：逐批訂購法 (Lot-for-Lot)LTC ：最小總成本法 (Least Total Cost)LUC ：最小單位成本 (Least Unit Cost)MES ：制造執(zhí)行系統(tǒng) (Manufacturing Execution System)MPS ：主生產(chǎn)排程 (Master Production Schedule)MRP ：物料需求規(guī)劃 (Material Requirement Planning)MRP：制造資源計劃 (Manufacturing Resource Planning)OEM ：委托代工 (Original Equipment Manufacture)ODM ：委托設(shè)計與制造 (Original Design & Manufacture)OLAP：在線分析處理 (On-Line Analytical Processing)OLTP：在線交易處理 (On-Line Transaction Processing)OPT ：最佳生產(chǎn)技術(shù) (Optimized Production Technology)PDCA：PDCA管理循環(huán) (Plan-Do-Check-Action)PDM：產(chǎn)品數(shù)據(jù)管理系統(tǒng) (Product Data Management)RCCP：粗略產(chǎn)能規(guī)劃 (Rough Cut Capacity Planning)SCM ：供應鏈管理 (Supply Chain Management)SFC ：現(xiàn)場控制 (Shop Floor Control)TOC：限制理論 (Theory of Constraints)TQC ：全面質(zhì)量管理 (Total Quality Control)FYI/R:for your information/reference僅供參考ASAP:盡快S/T:Standard time標準時間TPM:total production maintenance：全面生產(chǎn)保養(yǎng)ESD Wrist strap：靜電環(huán)IT:information technology信息技術(shù)，信息科學CEO：Chief Executive Officer執(zhí)行總裁COO：Chief Operaring Officer首席業(yè)務總裁SWOT：Strength,Weakness,Opportunity,Threat優(yōu)勢弱點機會威脅Competence：專業(yè)能力Communication：有效溝通Cooperation：統(tǒng)御融合Vibration Testing：振動測試IDP：Individual Development Plan個人發(fā)展計劃MRP：Material Requirement Planning物料需求計劃MATS：Material材料LRR：Lot Rejeet Rate批退率ATIN：Attention知會3C：Computer ,Communication , Consumer electronic消費性電子5W1H：When , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement人,機器,材料,方法,測量4MIE: Man,Material,Machine,Method,Environment人力,物力,財務,技術(shù),時間(資源)7M1I: Manpower , Machine , Material , Method, Market , Management , Money , Information人力， 機器， 材料， 方法, 市場， 管理， 資金， 信息1 Accuracy 準確度2 Action 行動3 Activity 活動4 Analysis Covariance 協(xié)方差分析5 Analysis of Variance 方差分析6 Approved 承認7 Attribute 計數(shù)值8 Average 平均數(shù)9 Balance sheet 資產(chǎn)負債對照表10 Binomial 二項分配11 Brainstorming Techniques 腦力風暴法12 Cause and Effect Matrix 因果圖(魚骨圖)13 CL:Center Line 中心線14 Check Sheets 檢查表15 Complaint 投訴16 Conformity 合格（符合）17 Control 控制18 Control chart 控制(管制)圖19 Correction 糾正20 Correlation Methods 相關(guān)分析法21 CPI: continuouse Process Improvement 連續(xù)工序改善22 Cross Tabulation Tables 交叉表23 CS: Customer Sevice 客（戶）服（務）中心24 DSA: Defects Analysis System 缺陷分析系統(tǒng)25 Data 數(shù)據(jù) Description:品名26 DCC: Document Control Center 文控中心27 Decision 決策、判定28 Defects per unit 單位缺點數(shù)29 Description 描述30 Device 裝置31 Do 執(zhí)行32 DOE: Design of Experiments 實驗設(shè)計33 Element 元素34 Engineering recbnology 工程技35 Environmental 環(huán)境36 Equipment 設(shè)備37 Estimated accumulative frequency 計算估計累計數(shù)38 E Equipment Variation 設(shè)備變異39 External Failure 外部失效,外部缺陷40 FA: Failure Analysis 失效分析41 Fact control 事實管理42 Fatigue 疲勞43 FMEA: Failure Mode and Effect Analysis失效模式與效果分析44 FP First-Pass Yield （第一次通過）合格率45 FQA: Final Quality Assurance 最終質(zhì)量保證46 FQC: Final Quality control 最終質(zhì)量控制47 Gauge system 測量系統(tǒng)48 Grade 等級49 Histogram 直方圖50 Improvement 改善51 Initial review 先期審查52 Inspection 檢驗53 Internal Failure 內(nèi)部失效、內(nèi)部缺陷54 IPQC: In Process Quality Control 制程質(zhì)量控制55 IQC: Incomming Quality Control 來料質(zhì)量控制56 IS International Organization for Standardization 國際標準化組織57 LCL: Lower Control limit 管制下限58 LQC: Line Quality Control 生產(chǎn)線質(zhì)量控制59 LSL: Lower Size Limit 規(guī)格下限60 Machine 機械61 Manage 管理62 Materials 物料63 Measurement 測量64 Median 中位數(shù)65 MSA: Measurement System Analysis 測量系統(tǒng)分析66 Occurrence 發(fā)生率67 Operation Instruction 作業(yè)指導書68 Organization 組織69 Parto 柏拉圖70 PPMarts per Million （百萬分之）不良率71 Plan 計劃72 Policy 方針73 Population 群體74 PQA: Process Quality Assurance 制程質(zhì)量保證75 Practice 實務(踐)76 Prevention 預防77 Probability 機率78 Probability density function 機率密度函數(shù)79 Procedure 流程80 Process 過程81 Process capability analysis 制程能力分析（圖）82 Process control and Process capability制程管制與制程能力83 Product 產(chǎn)品84 Production 生產(chǎn)85 Projects 項目86 QA: Quality Assurance 質(zhì)量保證87 QC: Quality Control 質(zhì)量控制88 QE: Quality Engineering 質(zhì)量工程89 QFD: Quality Function Desgin 質(zhì)量機能展開(法)90 Quality 品質(zhì)91 Quality manual 品質(zhì)手冊92 Quality policy 質(zhì)量政策(質(zhì)量方針)93 Random experiment 隨機試驗94 Random numbers 隨機數(shù)95 R:Range 全距（極差）96 Reject 拒收97 Repair 返修98 Repeatusility 再現(xiàn)性99 Reproducibility 再生性100 Requirement 要求101 Responsibilities 職責102 Review 評審103 Reword 返工104 Rolled yield 直通率105 RPN: Risk Priority Number 風險系數(shù)106 Sample 抽樣,樣本107 Sample space 樣本空間108 Sampling with replacement 放回抽樣109 Sampling without replacement 不放回抽樣110 Scatter diagram 散布圖分析111 Scrap 報廢112 Simple random sampling 簡單隨機取樣113 Size 規(guī)格114 SL: Size Line 規(guī)格中心線115 Stratified random sampling 分層隨機抽樣116 SOP: Standard Operation Procedure 標準作業(yè)書117 SPC: Statistical Process Control 統(tǒng)計制程管制118 Specification 規(guī)范119 SQA: Source(Supplier) Quality Assurance 供貨商質(zhì)量保證120 Stage sampling 分段隨機抽樣121 Standard Deviation 標準差122 Sum of squares 平方和123 Taguchi-method 田口(試驗)方法124 Theory 原理125 TQC: Total Quality Control 全面質(zhì)量控制126 TQM: Total Quality Management 全面質(zhì)量管理127 Traceablity 追溯128 Training 培訓129 UCL: Upper Control Limit 管制（控制）上限130 USL: Upper Size Limit 規(guī)格上限131 Validation 確認132 Variable 計量值133 Verification 驗證134 Version 版本135 VOC: Voice of Customer 客戶需求136 VOE: Voice of Engineer 工程需求137 Inventory stock report:庫存清單報告138 Sales order report:出貨報告QC quality control 品質(zhì)管理人員FQC final quality