中英文對(duì)照PCB生產(chǎn)流程常用術(shù)語(yǔ)

1、A. 開料(Cut Lamination) a-1 裁板(Sheets Cutti ng) a-2 原物料發(fā)料(Panel)(Shear material to Size)B. 鉆孔(Drilling)b-1內(nèi)鉆(Inner Layer Drilling )b-2一次孔(Outer Layer Drilling )b-3二次孔(2nd Drilling)b-4雷射鉆孔(Laser Drilling )(Laser Ablation )b-5盲(埋)孔鉆孔(Blind & Buried Hole Drilling)C. 干膜制程(Photo Process(D/F)c-1前處理(Pretreat

2、ment)c-2壓膜(Dry Film Lamination)c-3曝光(Exposure)c-4顯影(Developing)c-5蝕銅(Etching)c-6去膜(Stripping)c-7初檢(Touch-up)c-8化學(xué)前處理,化學(xué)研磨(Chemical Milling )c-9選擇性浸金壓膜(Selective Gold Dry Film Lamination)c-10 顯影(Developing )c-11 去膜(Stripping )Develop ing , Etch ing & Stripp ing ( DES )D. 壓合 Lam in ati ond-1黑化(Black O

3、xide Treatment)d-2微蝕(Microetching)d-3鉚釘組合(eyelet )d-4疊板(Lay up)d-5壓合(Lamination)d-6后處理(Post Treatment)d-7黑氧化(Black Oxide Removal )d-8銃靶(spot face)d-9去溢膠(resin flush removal)E. 減銅(Copper Reducti on)e-1 薄化銅(Copper Reduction)F. 電鍍(Horizontal Electrolytic Plating)f-1水平電鍍(Horizontal Electro-Plating) (Pan

4、el Plating)f-2錫鉛電鍍(Tin-Lead Plati ng ) (Pattern Plat in g)f-3低于 1 mil ( Less tha n 1 mil Thick ness )f-4咼于 1 mil ( More than 1 mil Thick ness)f-5砂帶研磨(Belt Sanding)f-6剝錫鉛(Tin-Lead Stripping)f-7微切片(Microsection)G. 塞孔(Plug Hole)g-1 印刷(Ink Print ) g-2 預(yù)烤(Precure)g-3表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(綠漆/綠

5、油):(Solder Mask)h-1 C 面印刷(Printing Top Side)h-2 S 面印刷(Printing Bottom Side)h-3 靜電噴涂(Spray Coati ng)h-4 前處理(Pretreatment)h-5 預(yù)烤(Precure)h-6 曝光(Exposure)h-7 顯影(Develop)h-8 后烘烤(Postcure)h-9 UV 烘烤(UV Cure)h-10 文字印刷(Printing of Lege nd )h-11 噴砂(Pumice)(Wet Blasting)h-12 印可剝離防焊(Peelable Solder Mask)I .鍍金

6、Gold platingi-1金手指鍍鎳金(Gold Fin ger )i-2 電鍍軟金(Soft Ni/Au Plating) i-3 浸鎳金(Immersion Ni/Au) (Electroless Ni/Au)J.噴錫(Hot Air Solder Leveling) j-1 水平噴錫(Horizontal Hot Air Solder Leveling)j-2 垂直噴錫(Vertical Hot Air Solder Leveling)j-3 超級(jí)焊錫(Super Solder )j-4.印焊錫突點(diǎn)(Solder Bump)K.成型(Profile)(Form)k-1 撈型(N/C

7、Routing ) (Milling)k-2 模具沖(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V 型槽(V-Cut)(V-Scoring)k-5 金手指斜邊(Beveli ng of G/F)L. 開短路測(cè)試(Electrical Testi ng) (Co nti nuity & In sulation Testi ng)l-1 AOI光學(xué)檢查(AOI Inspection)l-2 VRS 目檢(Verified & Repaired)l-3泛用型治具測(cè)試(Universal Tester)l-4 專用治具測(cè)試(Dedicated Tester)l-5

8、 飛針測(cè)試(Flying Probe)M.終檢(Final Visual Inspection)m-1 壓板翹(Warpage Remove)m-2 X-OUT 印刷(X-Out Marking) m-3 包裝及出貨(Packing & shipping) m-4 目檢(Visual Inspection) m-5 清洗及烘烤(Final Clean & Baking)m-6 護(hù)銅劑(ENTEK Cu-106A)(OSP)m-7 離子殘余量測(cè)試(Ionic Contamination Test )(Cleanliness Test)m-8 冷熱沖擊試驗(yàn)(Thermal cycli ng Tes

9、ti ng)m-9 焊錫性試驗(yàn)(Solderability Testi ng )N.雷射鉆孔(Laser Ablation)N-1 雷射鉆 Tooling 孔(Laser ablation Tooling Hole)N-2 雷射曝光對(duì)位孔(Laser Ablation Registration Hole)N-3 雷射 Mask 制作(Laser Mask)N-4 雷射鉆孔(Laser Ablation)N-5 AOI 檢查及 VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetc

10、hi ng)N-7 除膠渣(Desmear)N-8 微蝕(Microetching )流程簡(jiǎn)介：開料 Cut Lamination鉆孔 Drilling干膜制程 Photo Process(D/F)壓合 Lam in ati on減銅 Copper Reduct ion電鍍 Horiz on tal Electrolytic Plating塞孔 Plug Hole防焊(綠漆 / 綠油)SolderMask鍍金 Gold plating 噴錫 Hot Air Solder Leveling 成型 Profile開短路測(cè)試 ElectricalTesting 終檢 Final Visual Ins

11、pectionpcb電路板又稱印制電路板、印刷線路板，簡(jiǎn)稱印制板，英文簡(jiǎn)稱PCB(printed circuit board )或 PWB(printed wiring board)，以絕緣板為基材，切成一定尺寸，其上至少附有一個(gè)導(dǎo)電圖形，并布有孔(如元件孔、緊固孔、金屬化孔等)，用來代替以往裝置電子元器件的底盤，并實(shí)現(xiàn)電子元器件之間的相互連接。由于這種板是采用電子 印刷術(shù)制作的，故被稱為“印刷”電路板。習(xí)慣稱“印制線路板”為“印制電路”是不確 切的，因?yàn)樵谟≈瓢迳喜]有“印制元件”而僅有布線。以下是pcb電路板制作流程 詳解:目前的電路板，主要由以下組成線路與圖面(Pattern):線路是做

12、為原件之間導(dǎo)通的工具，在設(shè)計(jì)上會(huì)另外設(shè)計(jì)大銅面作 為接地及電源層。線路與圖面是同時(shí)做出的。介電層(Dielectric):用來保持線路及各層之間的絕緣性，俗稱為基材。孔(Through hole / via):導(dǎo)通孔可使兩層次以上的線路彼此導(dǎo)通，較大的導(dǎo)通孔則做為零件插件用，另外有非導(dǎo)通孔 (nPTH)通常用來作為表面貼裝定位，組裝時(shí)固定螺絲用。防焊油墨(Solder resistant /Solder Mask):并非全部的銅面都要吃錫上零件，因此非吃錫的區(qū)域，會(huì)印一層隔絕銅面吃錫的物質(zhì)(通常為環(huán)氧樹脂)，避免非吃錫的線路間短路。根據(jù)不同的工藝，分為綠油、紅油、藍(lán)油。絲印(Legend /Marking/Silk screen):此為非必要之構(gòu)成，主要的功