PCBA檢驗規(guī)范

1、P CBA檢驗規(guī)范編 號:版 本：V1.0生效日期:文檔說明頁1 .修訂情況表修訂歷史版本說明作者審核批準(zhǔn)生效日期2 .術(shù)語表術(shù)語表名稱說明650% W 或D50% P 拒收DefectSide overha ng (D) is greater tha n 50% component term in ati on width (W) or 50% land width (P) whichever is less零件偏移 D50% W 或D50% P 拒收L日TDefectAny end overha ng (B)零件超出pad拒收DefectComponent in reserved to l

2、acquer to go to circuit to form ashort circuit零件在有保護(hù)漆之線路上造成短路拒收Acce ptableEnd joint width (C) is minimum 50% of component term in ati on width (W) or 50% land width (P) whichever is less零件焊點(diǎn)寬度 C50%W or C50% P 允收PCBA檢驗規(guī)范-6 -PCBA檢驗規(guī)范-7 -DefectDefectAcce ptableMaximum fillet height (E) may overha ng th

3、e lend or extend onto the of the end cap metallization, but not exte nd further onto the component body錫高超過金屬端，但未延伸至零件本體允收Solder fillet exte nds onto the component body錫延伸到零件本體上拒收DefectMinimum fillet high (F) is less tha n 25% term in ati on high (H), or fillet high (F) is less than 0.5mmHigh voltag

4、e cap acita nee mi nimum fillet high (F) is less than 50% term in ation high (H), or fillet high (F) is less tha n 0.75mm爬錫高度 F25% H 或F0.5mm 拒收高壓電容爬錫高度F50% H 或F50% W or 50% P .拒收Any end overha ng (B) 零件超出pad拒收Acce ptableEnd joint width (C) is minimum 50% component diameter (W) or land width (P ),whi

5、chever is less零件連接直徑寬度 C仝50% W or 50% P 允收W W1PCBA檢驗規(guī)范-9 -Accep tableMinimum fillet heitht(F) is solder thick ness(G) plus 25% diameter(W) of the component end cap焊錫高度F仝25%(G+W) 允收Accep tableEnd overla p(J) betwee n the component term in ati on and the land is minimum 50% the length of thecomponent

6、term in atio n(T)零件末端與PAD重疊部分J仝50%T允收DefectEnd overlap(J) component 零件末端與PADis less than 50%of the length of重疊部分J50%T拒收Accep tableSide joint len gth(D) is minimum 50% len gth of component term in atio n(T) or land len gth(S), whichever is less側(cè)面焊點(diǎn)長度 D仝50%T or 50%S 允收DefectSolder fillet exte nds onto

7、 the component body錫延伸到零件本體上拒收I I一F FPCBA檢驗規(guī)范-10 -1-1-3 Leadless chip(W)零件末端焊點(diǎn)寬度C50% W拒收(C) is less tha n 50% castellation widthDefectMi nimum side joi nt len gth (D) is less tha n 50% mi nimum fillet height (F) or land length external to package (S),whichever is less零件末端焊點(diǎn)長度D50% S 或50% F拒收DefectMi

8、nimum fillet height (F) is 25% castellation height (H) 焊錫高度 F25% H 拒收DefectAny end overha ng (B) 零件超出pad 拒收G GDefectEnd joint widthPCBA檢驗規(guī)范-11 -DefectDefectMi nimum fillet height (F) is 25% castellation height (H) 焊錫高度F50% W 拒收4 4wPCBA檢驗規(guī)范-12 -DefectMi nimum end joint width (C) is less 50% lead Widt

9、h (W) 焊點(diǎn)寬度C50% W 拒收pipiI ID D護(hù):代y y 玉DefectSide joint len gth(D) is less than 80% of lead len gth (L) 焊錫長度D4/5 L 拒收DefectSolder touches the body or end seal of high-lead con figurati on component 焊錫延伸至零件本體上或封裝末端Acce ptable爬錫高度：Fillet接觸到正面吃錫面DefectSolder touches p ackage body錫延伸到零件本體上拒收OK拒收允收NjNjFill

10、-仃卡疔福乍征叩：皓曲Firt住曰孑卞肝fl耳菸向PCBA檢驗規(guī)范-13 -PCBA檢驗規(guī)范-14 -Ao Gotxi Bobbin had to dama刑 by iron.B拒收DefectSolder is already over the B portion, and bobbin had Bee n damaged by iron .Bobbin被烙鐵燙傷GoodBNonnal帝常AAcce ptableTran sformer high voltage pin portion ,but ex sp ecial case)變壓器高壓Pins solder is over the A

11、cornerno function pin (for all inverters,吃錫度已達(dá)到A處（第一彎角處）except允收GoodtT-tT-Acce ptableSolder is over sp ecial case)吃錫度超出B處允收the B portion(forall inverters,exceptJw tJ J J J 5 5I I DefectMinimum heel filletthick ness (T) 焊錫高度 F50% Wheight (F) is less than 25% lead拒收is greater than 50% lead width/拒收”.一

12、= =p”p” 甲.f fPCBA檢驗規(guī)范-15 -PCBA檢驗規(guī)范-16 -亙尋DefectSide joint len gth (D) is less than 80% lead len gth焊錫長度D小于4/5引腳長度拒收DefectDefectMinimum end joint width (C) is less than 50% leadwidth/diameter (W)焊錫寬度C50% W拒收DefectSolder touches the p ackage or end seal焊錫延伸至零件本體上或封裝末端拒收DefectMinimum side joint height

13、(Q) is less than solder thickness (G) plus 50% diameter (W) of round lead or 50% thick ness of lead at joint side (T) for coined lead焊錫高度 QG+50% W or Q50% W拒收PCBA檢驗規(guī)范-17 -Acce ptableMi nimum end joi nt width (C) is 50% lead width (W) 焊錫寬度C仝50%W 允收DefectSide joi nt fillet (D) less than 150% lead widt

14、h焊錫寬度(D)小于150%引腳寬度(W) 拒收DefectSolder fillet touches p ackage body焊錫延伸至零件本體上拒收KK1-1-7 I 形引腳(Butt/I Joints)DefectDefectAny toe overha ng (B)側(cè)邊突出拒收End joi nt width (C) is less than 75% lead width (W) 焊錫寬度C75%W拒收DefectSolder touches p ackage body焊錫延伸至零件本體上拒收4 4PCBA檢驗規(guī)范-18 -DefectFillet height (F) is les

15、s than 0.5mm0.02 inch 焊錫高度(F)小于0.5mm 拒收1-1-8 向內(nèi) L 型引腳(Inward formed L-shaped ribbon leads)*- CI I- -X X1-1-9BGA 零件(Area array/Ball grid array )More tha n 50% overha ng偏移50% 拒收DefectEnd joint width(C) is less than 50% lead with(W)Side overha ng(A) is greater than 50%WMi nimum fillet height(F) is less

16、 than 25% E焊錫寬度偏移寬度焊錫高度C50%WF I I .1.1 I I ( ( ( ( d d H H I I t t I In n - - - 4 4 * * 4*4* * * : ” 一V V 幽： r r .1.1 t t - n n flfl *1*1*1*1 I I 111111 L LT T k k副 * *-1!*-1! w w 釦 * 46 和曹I I I I * * I I*0V V * * V V-DefectSolder bridge錫橋拒收Dark spots in X-Ray view the bridge betwee n solder joints在

17、X-Ray下焊點(diǎn)間橋接或拒收Solder open錫散開拒收Miss ing solder漏錫拒收Solder ball(S) that bridge more than 25% of the dista nee betwee n the leads錫珠超出焊點(diǎn)間距25% 拒收1 11-2 焊點(diǎn)異常(Soldering abnormal)DefectFracture solder connection錫裂拒收PCBA檢驗規(guī)范-21 -PCBA檢驗規(guī)范-22 -23712371HKHK I I- -T T1-2-2翻件(Mou nting up side dow n)Acce ptableEle

18、me nt of chip component with exp osed dep osited electrical Eleme nt is moun ted toward board能導(dǎo)通允收1-2-3墓碑(Tombstone)Defect1-2-1 側(cè)立(Mounting on side)DefectChip resista nee moun ti ng on side電阻側(cè)立拒收Acce ptableChip capacitanee & Inductanee minimum type is less than 1206, moun ti ng on side and no more t

19、ha n five(5) chip on each assembly are moun ted side ways電容,電感類零件小于1206(含)以下，且單面少于5pcs允收Chip componentsta ndingon their term inalen d(Tombst one)墓碑拒收1-2-4 共平面(Coplanarity)1 1川丄2PCBA檢驗規(guī)范-23 -1-2-5 錫未完全熔化(Reflow not com plete)DefectIncompI ete reflow of solder p aste錫未完全熔化拒收1-2-6 空焊(Nonwetting)DefectO

20、ne lead or series of leads on component is out alig nment and fails to make proper con tact with the landPCBA檢驗規(guī)范-24 -pad正常接觸DefectSolder has not wetted to the land or term in atio n空焊拒收零件的一個或多個引腳變形，不能與 拒收PCBA檢驗規(guī)范-25 -1-2-7 冷焊(Dewetting. Disturbed solder)Defect1-2-8 錫裂(Fractured solder)DefectFractur

21、ed or crack solder焊錫斷裂或破裂拒收Characterized by stress lines from movement in the connection while solidifyi ng冷焊拒收rere L L神I話、4 4PCBA檢驗規(guī)范-26 -1-2-9針孔 /吹孔(Pinholes/Blowholes)1-2-10錫橋(短路)Solder bridge(short)DefectBlowholes, pin holes, voids, etc焊錫連接出現(xiàn)氣泡，氣泡，空白，流出物等 拒收Acce ptable焊點(diǎn)上緊臨零件腳的氣孔/針孔,一個焊點(diǎn)只允許有一個，且

22、其大小須小于零件 腳面積的1/4 允收Acce ptable焊點(diǎn)上未緊臨零件腳的氣孔 /針孔，一個 焊點(diǎn)容許有不超過兩個（含）,且其大小須 小于零件腳面積的1/4 允收DefectA solder connection across con ductors that should not be join ed錫橋(短路)拒收隼7PCBA檢驗規(guī)范-27 -/右-A1-2-11 錫珠(Solder ball)DefectSolder ball dislodge非附著性錫珠拒收Entrapped or encapsulated solder balls that are exceed 0.2mm i

23、n diameter附著性錫珠但錫珠直徑大小為0.2mm(含)以上變壓器高壓端及高壓電容旁有附著性錫珠拒收Solder ball attached on high voltage side of tran sformer or around high voltage cap acitorMore than 5 solder balls (diameter less than 0.2mm) per 600mm 2錫珠直徑大小為0.2mm以下但錫珠數(shù)量多于5顆/ 6平方公分(含) 拒收PS:錫珠以靜電毛刷刷不掉者，判為附著性錫珠1-2-12 錫渣(Solder splash)Acce ptable

24、On the same PAD, solder bridge(short) across con ductors同PAD上兩焊點(diǎn)短路 允收On the same trace(Visualization)but not same PAD,solder bridge(short) across con ductors目視同線路不同PAD短路 允收IflflPCBA檢驗規(guī)范-28 -%-%1-3 零件損壞(Component damage)1-3-1 裂縫與缺口 (Cracks and chip-outs)0.2mm以下但錫渣數(shù)量多于 5顆/ 6 拒收沾錫直徑大于 0.7MM 拒收DefectSol

25、der sp lashes that are exceed 0.2mm in len gth錫渣長度最長邊0.2mm (含)以上 拒收Solder splashes attached on high voltage side of tran sformer or around high voltage cap acitor變壓器高壓端及高壓電容旁有錫渣拒收More than 5 solder splashes (diameter less than0.2mm) per 600mm 2錫渣直徑大小為平方公分(含)PCB銅箔PADPCBA檢驗規(guī)范-29 -Defect1-3-2金屬鍍層(Metal

26、lization)Acce ptableCracks or chip-outs not greater than dimensions L50%,W25%, T25%缺口的尺寸 L50%, W25%, T25% 可接受Any n ick or chip-out that expo ses the electrodes任何電極上的裂縫或缺口拒收Cracks, n icks or any type of damage bodied components玻璃組件本體上的裂縫、刻痕或任何損傷拒收Any chi p-o uts in resistive eleme nts任何電阻質(zhì)的缺口拒收Any cr

27、acks or stress fractures任何裂縫或壓痕拒收wL 41*41*eadeadLP- 尹如丁 E .一PCBA檢驗規(guī)范-32 -ClCl茁、茁、-I/-/- ItHlItHl2-3-2 通孔的外圍焊點(diǎn)-正面(PTH-circumferential wetting-primary side)DefectLess tha n 180wett ing on lead or barrel引腳和孔壁焊接不足 180 拒收| -JI2-3-3 通孔的外圍焊點(diǎn)-背面(PTH-circumferential wetting-secondary side)DefectMinimum 270 f

28、illet and wett ing (lead, barrel and匚termination area)屛廠引腳和孔壁焊接不足270拒收2-3-4 包焊(Lead not discernible)DefectFillet con vex, lead not discer ni ble due to excess solder, p rovidi ng visual evide nee of the lead in the hole can be determ ined on the p rimary side由于焊錫過多導(dǎo)致包焊拒收DefectLead not discer nible d

29、ue to bent lead由于引腳彎曲導(dǎo)致包焊拒收.r570*570* * 4 4PCBA檢驗規(guī)范-33 -VfeiBli2-3-6 陷入焊錫的絕緣層 (Meniscus in solder)拒收2-3-7 焊接后的引腳剪切 (Lead cutting after soldering)Defect2-4 插件外觀(Appearanee)2-4-1 定位-水平(Orientation-Horizontal)2-3-5引腳折彎處的焊錫(Solder in lead bent)DefectSolder in bend area comes in con tact with theComponen

30、t body or end seal引腳折彎處的焊錫接觸組件本體或密封端Acce ptableExhibit good wett ing and lead coati ng meni scus is notdiscer nible with in connection on sec on dary side背面焊點(diǎn)需完整，不可空/冷焊且零件腳Coati ng不超出背 面焊點(diǎn)允收Evide nee of fracture betwee n lead and solder fillet錫裂拒收DefectComponent is not as sp ecified(wr ong part)零件插錯

31、件 拒收Component not moun ted I correct holes零件插錯洞 拒收Polarized component moun ted backwards零件極性反拒收Multileaded component not orie nted correctly零件方向錯誤 拒收h h3 電 wPCBA檢驗規(guī)范-34 -Defect拒收DefectComponents required to be moun ted above the boardsurface D1.6mm or H2.1mm零件浮起 D1.6mm 或H2.1mm 拒收DefectPolarized comp

32、onen t is moun ted backwards零件極性反拒收Acce ptableThe height of the component body above the H is 0.4mm to 3.2mm零件高度 H不得超出0.4mm3.2mm 拒收The an gle 0 of the componen t lead does not greater the45o零件傾斜度不大于45度允收Title of the component exceeds max component height limits or lead protrusion does not meet accep

33、tance requireme nt 組件傾斜超出高度上限或引腳未出2-4-4 引腳跨越導(dǎo)線(Leads crossi ng con ductors)2-4-2 定位-垂直(Orientation-Vertical)2-4-3 DIP & SIPPCBA檢驗規(guī)范-35 -2-4-5 引腳成形(Leads forming)Acce ptableSleeve does not exte nd into solder connection絕緣套管不可碰到焊點(diǎn)DefectSp litt ing an d/or un raveli ng of sleev ing絕緣套管裂開或斷裂拒收A componen

34、t lead cross ing an electrically non com mon con ductor with a cleara nee of less tha n 0.5mm with nosep arati ng in sulator (lead sleevi ng or surface coati ng) 零件腳與線路距離小于0.5mm 拒收Acce ptableLeads for through-hole mounting extend at least one lead diameter or thickness but not less than 0.8mm form t

35、he body, solder bead, or lead weld零件本體、球狀連接部分或引腳焊接部分到零件引腳折彎處的距離 L仝0.8mm 允收DefectDamage or fracture of component body to lead seal零件的本體或引腳封裝處有損傷或裂痕拒收-11-11卜DefectLead forming as a right an gle引腳成形成直角拒收PCBA檢驗規(guī)范-36 -介2-4-6 IC 損傷(IC damage)DefectChip out en ters into the seal密封處有缺口拒收Chip out exposes the

36、 lead in an area not normally exposedIC腳連接處破損 拒收There are cracks leadi ng from the chip out.缺口造成芯片外露拒收2-4-7軸向引腳和玻璃封裝體損傷(Axial lead and glass body/seal damage)Acce ptableVisible chip in surface coati ng of component body and internal functional eleme nt is not exp osed 組件表面有損傷，但未暴露出組件內(nèi)部材質(zhì)允收DefectThe

37、in sulati ng cover is damaged to the exte nt that theinternal functionaleleme ntis exp osedor thecomponent sha pe is deformed組件表面的絕緣層受到損傷，造成組件內(nèi)部材質(zhì)外露 件嚴(yán)重形變拒收DefectCrack in glass in sulator/seal玻璃封裝上的殘缺引起的裂痕延伸至引腳的密封處 收Cracked or damaged glass bead玻璃體破裂拒收Defect，或組Fractured lead weld, solder bead or com

38、ponent lead零件焊接處裂縫或錫珠body拒收2-4-8 徑向又引腳損傷Radial (two lead) damageDefectLead is damaged more tha n 10% of the lead diameterLead deformed零件引腳損傷超過引腳半徑10%或引腳變形 拒收 & &區(qū)A-： if-if- r r r r , , - - a容PCBA檢驗規(guī)范-37 -2-5 點(diǎn)膠(Adhesive bonding)Acce ptableMinor surface scratches, cuts or chips expose the component s

39、ubstrate or active area 零件表面有損傷但未暴露出零件內(nèi)部材質(zhì)Structural in tegrity is not comp romised零件的結(jié)構(gòu)完整性未受到破壞DefectActive area is exp osedorcompro mised零件內(nèi)部材質(zhì)外露或零件嚴(yán)重形變that do not拒收允收structuralin tegrity is拒收Defect拒收0.8mm 拒收Less tha n 25% of the circumfere nee or equivale nt amount of board surface is wetted and

40、adhered to by the adhesive點(diǎn)膠范圍小于周長25% 拒收On a horiz on tallymoun tedcomponent, adhesiveadheres to less tha n 25% component diameter水平安裝零件粘著小于25%直徑拒收On a vertically moun ted component, adhesive adheres to less tha n 50% of the component len gth垂直安裝零件粘著小于50%長度拒收2-6 DIP零件高翹IC（插入 PCB）, SOCKET, ARRAY 高翹 電

41、阻，電容，電感高翹1.6mm 拒收IC插入SOCKET 未壓至底高翹0.5mmSlot, header 高翹1.0mm 拒收Switch, Connector, speaker高翹0.5mm 拒收無絕緣包裝之導(dǎo)線,跳線（含本體）高翹2.2mm 拒收3 PCB3-1 Marki ng/PCBA檢驗規(guī)范-38 -3-2 外觀(Surface appearanee)DefectMiss ing or illegible characters in the markingsMarki ng字符缺損或模糊造成字體無法辨識拒收Open areas of characters are filled and

42、not legible, or are likely to be con fused with ano ther nu mber or letterMark ing字符筆畫缺損、間斷或沾污致使字體無法辨識 拒收Lines forming a character are missing, broken or smeared to the exte nt that the character is not legible or is likely to be con fused with ano ther characterMarki ng字符內(nèi)容錯誤 拒收The depth of the mar

43、ki ng adversely affects the fun ctio n of the partMarki ng重影造成無法辨識拒收DefectDiscernibleresidue from cleanable fluxes, or anyactivated flux residues on electrical con tact surfaces 有需清洗焊劑的殘留物，或者在焊點(diǎn)有助焊劑殘留物拒收ininfl*DefectDirt and p articulate matter on assembly, eg, dirt, li nt, dross, metallic p article

44、s, etc 表面沾污殘留顆粒物質(zhì)、 屬于產(chǎn)品物質(zhì)之異物DefectTran sformer 高壓端拒收療斗 .Ad纖維絲、殘渣、金屬顆粒等不 拒收20MM 內(nèi)露銅直徑超過0.5MMAcce ptable其余位置露銅直徑不超過2MM且不造成短路允收DefectWhite residue on PWB surface白色殘留物于PCB表面 拒收White residues on or around the soldered term in ati on白色殘留物于焊點(diǎn)四周拒收Metallic areas exhibit erystall ine white depo sitPCBA檢驗規(guī)范-39

45、 -PCBA檢驗規(guī)范-40 -DefectFlux residue in hibits visual insp ecti on助焊劑殘留造成焦黑拒收DefectEvide nee of corrosi on有明顯腐蝕現(xiàn)象 拒收-11一畀7 ；TITOTITO66 i i 3!3!1 r ：k k _白色結(jié)晶狀于金屬表面拒收3-2-1 腐蝕(Corrosion)3-3-2 燒焦(Burn)PCBA檢驗規(guī)范-41 -DefectBurns which p hysically damage surface or the assembly燒焦 拒收3-2-3印刷電路及焊點(diǎn)損傷 (Conductor/L

46、and damage)DefectReduct ion in width of prin ted con ductor by more tha n 20% 印刷電路寬度減少大于20% 拒收Reduct ion in width of len gth of lands by more tha n 20% 焊點(diǎn)長度或?qū)挾葴p少大于20% 拒收DefectPCB板彎超過板長1.5% 拒收3-3 焊錫性(Solderability)DefectSolder projection violates assembly maximum heightrequireme nts錫尖高于零件 拒收DefectSep

47、 arati onbetwee n con ductor, PAD or land andlamin ate surface is greater tha n on pad thick ness髓PCBA檢驗規(guī)范-42 -PAD剝離 拒收PCBA檢驗規(guī)范-43 -4 Connector. Pin &金手指(Golden finger)Sc.DefectCon tact is above in sulatorPin 超出 connector拒收Con tacts are twisted or otherwise deformedPin歪曲或變形拒收Land is damaged焊點(diǎn)損傷拒收Con

48、 tact is broke n接觸簧片斷裂Gap betwee nsp ecified接觸簧片下陷拒收con tact shoulder and land is greater拒收CDCDDefectBack edge of conn ector is not flush to PCB A0.8mm, orB0.4mm長軸高翹(A)大于0.8mm or短軸高翹(B)大于0.4mm 拒收Conn ector not con tact with PCBConnector未接觸PCB拒收DefectAny functional annu lar ring which is lifted more

49、tha n 75% of the width (W)Pin腳底部翹起或龜裂寬度大于75% W 拒收屈沖Ml：朋川花陽阿卩* *1 i ilfJ JPCBA檢驗規(guī)范-44 -拒收DefectPin is bent out of alig nment. (Pin is bent off cen ter greater than 50% pin thick ness.)Pin腳傾斜度超出一個直徑DefectPin visibly twistedPin腳扭曲 拒收DefectPin height is out of tolera nee as to Sp ecificati onPin腳凸出或下陷超過

50、 0.5mm 拒收DefectDamaged pin as a result of han dli ng or in serti onPin腳尖端電鍍脫落拒收MushroomedPin腳尖端呈暈狀拒收Be ntPCBA檢驗規(guī)范-45 -Pin腳彎曲拒收PCBA檢驗規(guī)范-46 -金手指外觀檢驗品質(zhì)要求DefectDamaged PIN(Ex po sed basis metal)Pin腳損傷/露銅拒收DefectSolder or any other metal tha n gold in the critical con tact area of the fin gers金手指金屬接觸面有焊錫

51、，沾污,沾膠,氧化,露底材，殘留銅 屑拒收Scratch ing and expo sed basis material or scratch ing but not exposed basis material quantity fin ger qua ntity each side刮傷露底材或刮傷未露底材在單面超過 收Con cave dots in the 80% from edge0.2mm for Mini P CI or exceed 0.4mm for P CI, and above two dots凹陷點(diǎn)離金手指板邊80%內(nèi)，Mini PCI超過0.2mm, PCI超過0.4m

52、m且單面超過2處以上 拒收Solder dots in the 80% from edge of board, exceed0.2mm for Mini P CI or exceed 0.4mm for P CI, and above two dots沾錫點(diǎn)離金手指板邊80%內(nèi)，Mini PCI超過0.2mm, PCI超過0.4mm且單面超過2處以上 拒收Solder p olluted of gold fin ger in the 80% from edge of board, exceed 0.2mm for Mini PCI or exceed 0.4mm forP CI, and ab

53、ove two dots沾污離金手指板邊 80%內(nèi),Mini PCI超過0.2mm, PCI超過0.4mm且單面超過2處以上 拒收Oxidized in the gold fin ger金手指有氧化現(xiàn)象拒收Expo sed basis material in the gold fin ger金手指露底材 拒收exceed 1/5 gold1/5金手指數(shù)拒of board, exceedPCBA檢驗規(guī)范-47 -draw in the gold fin ger but notCopper left or p ulled in the edge of gold fin ger金手指端點(diǎn)有殘留銅屑或

54、拉離拒收Glue p olluted in the gold fin ger金手指有殘膠拒收Ap erture in the one gold fin ger exceed 20% or above one dot each side缺口在單一金手指面積超過20%或每面超過兩處(含兩處)拒收Convex in the side of gold fin ger is equal to the decreaseof gap about wire. If the gap decrease 20%側(cè)向突出視同線路間距的減少，線路間距減少超過20%拒收Acce ptableThe marks of in

55、 sert and5其它（含螺絲及跳線）5-1螺絲expo sed basis material金手指插拔痕未露底材Rep aired p roducts should be smooth color are acce pt修護(hù)品應(yīng)平整但有色差允收允收but differentDefect. . - - -益1 1、_ aa. . .Hardware(1)c on tact with con ductive p ath(2)螺絲與導(dǎo)電線路接觸拒收DefectHardware fabricate aperture on to have ready to make fabricate questi

56、 on螺絲組裝孔上有多余的錫，將造成組裝問題spare tin ,tobe拒收PCBA檢驗規(guī)范-48 -PCBA檢驗規(guī)范-49 -DefectLock washer aga inst nonm etal/lam in ate墊片傷到主基板拒收Flat washer miss ing無墊片拒收DefectHardware missi ng or improp erly in stalled螺絲墊片陷落螺絲孔拒收QDefectLock washer not comp ressed螺絲墊片高翹拒收DefectWire not wrapped around screw body線未環(huán)繞螺絲 拒收Wir

57、e is overla pped線重疊拒收Solid wire wrapped in wrong directio n線方向錯誤 拒收Stranded wire wrapped in wrong direction (tightening the screw unwinds the twisted wire)線超出螺絲 拒收In sulati on in the con tact area塑料部份鎖入螺絲拒收PCBA檢驗規(guī)范-50 -PCBA檢驗規(guī)范-51 -DefectDefect拒收DefectHardware has burrs or frayed edges螺絲滑牙拒收Wire rou

58、ted un der or over components跳線跨越零件拒收The wire is loose and can extend above the height of adjace nt components whe n p ulled taut跳線未固定且超過鄰近零件高度拒收DefectIn sulati on is in the solder焊點(diǎn)中夾雜塑料部分拒收Wire overhangs the land and/or violates minimum electrical cleara nee跳線(cable線)末端超出零件引腳范圍DefectSolder connect

59、ion len gth is less tha n 50% of land width(L)焊接長度小于 50% L (P AD)拒收5-2跳線b b i i -*4-*4 = = E-E- r r r r fcfc I I rF4irF4i b-b- *： R R u u 弊 l-jl-j T TVaJfc-b/Lti. m -闔隔:;二 峪 n n -JUJU狎鼻“匚尸lulu r r I IPCBA檢驗規(guī)范-52 -Defect拒收Acce ptableMinimum len gth of the solder conn ecti on is 75% of thelen gth (L)(

60、from toe to knee of lead)The wire end does not extend past the top of the component body跳線與零件腳之焊接長度需75%且未超出L 允收DefectWire or component connection DL 跳線與零件連接 D大于L 拒收Charred in sulati on線材絕緣部分燒焦拒收In sulati on damaged exposing wire線材絕緣部分損壞拒收DefectBirdcaging has caused wire strands to extend beyond the