SMT制程check list

1、SMT Check List(LF) / Modle Name: / Provide to SMT plant(For SMT)Item項項次次 Content內(nèi)內(nèi)容容1PR notice(試產(chǎn)通知)2Assy material(打件材料)all material with part No.&LF lable(綠色標(biāo)簽)shortage list(缺件表)3Screen printing(鋼網(wǎng))optical mark point match PCB(光學(xué)定位點是否OK)thickness0.15 or 0.12(鋼網(wǎng)厚度)special pad(開鋼網(wǎng)需注意之特殊Pad)4Assy draw

2、ing veracity(圖面之正確性)component pin assignment clear(是否注明元件方向) part list(BOM)smd&dip location (零件位置正確性)special requirment(有無特殊要求)5Part list report(元件坐標(biāo)檔用于程式)6PCB panel for prepare program(提供連片給SMT作程式)7Reflow & flow temp. test sketch map(測試點示意圖)input direction reasonable(進爐方向)test point(測試點)8Pre-PR mee

3、ting(試產(chǎn)說明會)9Test program& fixture(測試程式與測試治具)10Confidential consideration(機密性考量)11Other IssuesNo.Issue descriptionSMT Check List(LF) / Modle Name: Pheonix CCD board WS2 / SMD in process check list(貼貼片片時時的的檢檢查查清清單單)Item項項次次 Content內(nèi)內(nèi)容容1Production line type(所用之產(chǎn)線)2LF Production line(是否為無鉛產(chǎn)線) 3Special r

4、equirment implement(特殊要求之導(dǎo)入)4Auto loader status(自動送板狀況)5Auto screen printing (自動刷錫)solder paste(錫膏) screen printing match or not(鋼網(wǎng)與PCB之匹配度)6Auto surface mounted(自動貼片)special process(特殊處理)special component can not auto mounted(不能自動貼片之元件)7Mounting time/pcs(單片所需之時間)8First board confirm(首件確認(rèn))R&D confir

5、m(RD確認(rèn))QC confirm(品管確認(rèn))9In Nitrogen/reflow(充氮氣)10Reflow(回流焊)reflow direction reasonable(進爐方向之合理性)panel distortion check(連片變形程度檢查)11Reflow profile(溫度曲線圖)12Other IssuesNo.Issue descriptionaIC7混料7805和7812混在一起SMT Check List(LF) / Modle Name: Pheonix CCD board WS2 / DIP in process check listItem項項次次 Cont

6、ent內(nèi)內(nèi)容容1Special requirment check(特殊要求)2Interference check(是否干涉)3Flow profile(溫度曲線)4Flowed panel check(過爐后的檢查)panel distortion check(連片變形)吃錫狀況檢查component check(元件外觀檢查)5Soldering iron temp. record(手工焊烙鐵頭溫度記錄)見Sheet 6Solder brand(DIP)錫絲品牌成份M705 Sn3Ag-0.5Cu 0.6mm7Solder station(烙鐵臺)8V-cut 合理性9Test stati

7、on issue(測試)10Other issueNo.Issue descriptiona Handwork 鐵片來料變形,造成CCD浮高b CCD浮高檢驗標(biāo)準(zhǔn)之導(dǎo)入c 因CN1后焊故先貼防焊劑(Hi-temppeelable solder mask sm-120)d 當(dāng)CN2插上后反轉(zhuǎn)PCB元件不會掉。e拉焊CCD時將附近的零件拉掉(如WS2-268 R21)Note(注注意意事事項項)Status狀狀況況Remark備備注注OKNGwill be implemented into ES stage(將于ES階段導(dǎo)入)NOpanel catercorner(開在PCB兩個對角)OK0.15

8、 or 0.12OK沒有特別要求是0.15YesIC7 pin2 pad should be netted(此Pad需開成網(wǎng)狀鋼網(wǎng))NGSW1 , IC8NGR76 should be 5.6k, not 0ohmNGa.R15&R17 value exchange error b.R55&C59 should be rotated 90 degreeNOOKOKOKOKYesOKNGIgnore C&J issueNOSolutionCheckNote(注注意意事事項項)Status狀狀況況Remark備備注注OKS7 SiemensYesNoNG操作工失誤一個空連片折斷Lead free

9、/ Ag3.0/Cu0.5/SnOKOK如紅膠制程NoYesSW1 surface need special 吸嘴因表面不是平面OKOKOKNoOKOKOKYesSolutionCheck廠商改善SMT Check List(LF) / Modle Name: Pheonix CCD board WS2 / SMD in process check list(貼貼片片時時的的檢檢查查清清單單)Note(注注意意事事項項)Status狀狀況況Remark備備注注NONGCN1超出板邊需增加板邊寬度OKNG連片太大過爐之后變形,應(yīng)改為原來的一半OKOKOKNG太深造成過爐之后變形OKYesSolu

10、tionCheckSorting & Rework; IQC inspectionbefore implementOK檢驗標(biāo)準(zhǔn)1.0的塞規(guī)檢驗平整度A4紙條或塞規(guī)003去檢驗OKOKNG作業(yè)改善NGSMT Check List(LF) / Modle Name: Pheonix CCD board WS2 / DIP in process check listCCD board reflow profileHS board flow profileCCD reflow sketch mapPhoenix CCD board Dip solder station temp. recordItem

11、LocationDescriptionSoldering iron Temp.1IC1ILX181KStationA:376StationB:3722C10,C30,C37100UF/16V3723C8100UF/25V3744C11470UF/6.3V3775J1CON23736JH1Header283777FLS1Filter3748Repair stationFinal check372130404000100檢驗結(jié)果如下1.Total 130pcs2.平面度0.1以下經(jīng)全檢有15pcs變形不良3.1pcs 漏攻牙4. 1pcs 表面電鍍不良發(fā)白5. 表面刮傷劃傷碰傷不良率100%Inv

12、erter & Lamp1. NEC inverter 焊接不夠飽滿剪腳剩太長2. 板面黑漆CCD board試產(chǎn)情況input 350pcs(5X70)qty/pcsremark未打鏍絲未焊CCD在制161SMT倉庫ok品171IC浮高不良12SMT工程作治具5for smt sample1Total:350HS board試產(chǎn)情況Input 336pcs(42X8)qty/pcsremarkok 品331報廢2CN1吸錫不良3PHOENIX CCD Board WS2 ReportITEMDATEIN OUT YIELD RATE DEFECTION SMD2004年4月7日350350100%DIP2004年4月8日170170100%1st Assy TEST2004年4月8日17015892.90%CCD overtopDIP2004年4月13日130130100%2nd Assy TEST 2004年4月13日130130100%4/12 121pcs47pcs UndoCAUSESpacer dist