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1、20082222 12008 2TOTAL CORROSION CONTROL30(41)#20082230(41)#200822212003TG 172.41008-7818(2008)01 -0042-0230(41)#20082230(41)#200822The Effect of the Lithium Zinc Phosphate on the Corrosion Resistance of CoatingHE Jin-hua, ZHANG Xin, GAO Yan-minJiangsu Provincial Key Laboratory of Advanced Welding Te

2、chnology,Jiangsu University of Scieiwe and Technology. Zhenjiang 212003. ChinaAbstract: The coating was often composed by resins, fillings. solvent and additives, in which the resins and fillings were the most important. When the resins were determined, the fillings would be the main factor to the p

3、erformaiice of the coating The key to the performance of anticorrosive coating was the kind of fillings and dosagc. This article had studied the effect of the different contents of phosphate ziix? to the performance of anticorrosive coating. and discussed the anticorrosion mechanism of the lithium z

4、inc phosphateKey words: lithium zinc phosphate: anticorrosive coating: anticorrosion mechanism1|2|1.1SiO2-DETA1.23 5ABA-15minSiO”15min 20min(1981-)2565%10010 m1.3250lOh10%NaClEIS250lOh253%NaCI301.5EG&GEG&GPARC 283&1O2522.1200A55%10%BC2015%30%DE30215%30%5%10%30%15%15%2.2fOOOO40000 - -T-不含

5、悅咳N:IWWXE30000c Ua20000 10000T訂A00200004000) OOCX» 80000100000 120000 14000lr/ < Q OB :)23% NaCI1.430(41)43200822Ni-P2Ni-PNaClH2SO43Ni-P3.5wt.%NaCI29d50125mV41200822#200822125mV5Ni-P3.5%NaCl0.5hNi-PNaCl29d3Ni-P1Ni-P11.37%1 Fan JLYan D J. Current study of R&D of W-Cu composite nuterials i

6、n China and abroadJ.powder metallurgy industry ,2003,13(2):9-13.( 卩1 .2»X)3J3(2):9-I4)2 YangC. Study ol Ni-Peleclroless plating on W-Cu powder alloy aixl ifs anti-corrosion mechanismD.Wuhan: Wuhan university.2(X)6:1-4.(【D|:.2006:1-4)L Baskaran. T.S.N. Sankara Naravaiiaii. Effect of accelerators

7、 and stabilizers on the formation and characteristics of electroless Ni-P depositsJ|. materials chemistry and physics 99(2006):117-1264 Gemian R M. Technological harriers and opportunities in Powder injeclion molding(J.Powder Metall IntJ993,25(4): 165-169.5 Kim J C. Ryu S S. Lee H and Moon 1 H. Meta

8、l Injection Molding of Nanostnicturcd W-Cu Composite Powder!J|.The International Journal of Powder Metallurgy, 1999,35(4):47-55.6 Moon 1 H. Kim E P and Petzow G. Full densification of Loosely packed W-cu composite powders| J.Powder Metallurgy.19VK.4K1(71Lec G G.Ha G H. and Kim B K. Synthesis of high

9、 density ultrafine W/ Cu composite alloy by methanol lhermo chemical processJ.Powder Metallurgy,2000,43( 1 ):79-82.(8JYang C. Gan F X. Shen W. Study of electroless Ni-P plating on W-Cu alloj by constant potential! J (.materials protect ion.2006,39(5 )4 #200822#200822(43)【4(1| WANG Cheng-hai The Effect of Pigment B lends on the Surface StwcluivandChcmiMry o(CoMing§J World Pulp and Paper 2007 26 121-25(2| Cl

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