PCB基板厚度(包括芯板及半固化片)匯總

1、PCB 板材厚度規(guī)格：0.5mm, 0.7mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.6mm, 2.0mm, 2.4mm,3.2mm, 6.4mmPCB 板上銅箔的厚度規(guī)格：18um, 25um, 35um, 70um 和 105um：l 16AIM762SL7ft2KAJ&38H? nril344.55Ei77.J43板厚一般分為含銅和不含銅兩種厚度 一.含銅厚度:Me配洞配科髓構Li1 X left1Jl/lMXIX 2116H7II7X H2Mn?i2XM2/17x waH/HIX的l/t7 ”袖鄧1 1冥村tii/iiTX762A1/21 X tU2/2

2、7x763a1 X 1306K*LVIllitis X 762bT/rIl-illr |宀ISilHHKJX M訓3:1.71/1X ?fi；KL/lItMLK-JciZHtlk.iHaH/H2 1L1Ijx%2lulltOXTAJfl,12J02iZIU 7h2Xl/l2)|6*2X76*ft42ll6川IOVTCKIMII0W)*? 7代lOlurllll11 XTf,2K2/3| 舁喇H+J 7ft2H+l1iNkutnII Tgl/l4 7ft壇s76*PIi：xT6jxl/l2 -體期+i(d、*血IM1I12 - 76MIL1I1 - 2S+：llfi+2 - -f-242/1I2

3、X7UILJUinmm 7&2Sl/lF ?(-2h11*1113- 762SH41 r76JKIS軌1片、7ftLI12Ul3XXt21Sl/l,r 7CChlull? TftaH/H“ 叱x1LTIJ-tkk17XTfi：3t2/217X7&2R不含銅厚度fell岷料苗構2a os。ixioe皿亦窮笊$F：1 - 1000 itl - lowrx raz w ?r覃度-4Ot102iJllft ：1 3311JUx W6 1 2113 ia 1271:1X2116卜IGBDo.ISOTOL152t：ixi5Q9uoeo7OLITOl：I -fi28 ft)oe&+-

4、21：6ao.FOQP22XUK兇OLZTOL3S4110.2SQ!L：1GE*：I 16*iDta - 2:512ZMTaHSL：2 1SO6；：211ft* 1060*2116L3a 33F：慶:1刪U(tIMP362X：fLELS0L38:x-zese160 4065- 41t：3xs28；t：SX2110ITa栢L：:e2&+ioe&+-ia v：2 - 7i2eIHc. 46raIfV)dweCLSii .-機日占29攘】酣8*1K1Q30*苗 戒,K：6S821a $3223 - 7638珀也甜1X7&2S24asir：3xX A：2116+2 *39*21

5、1SasQ.Ml .:3* =28；：21+2x：e+2n6wa催Ida?*! - 6+138027Q.WLOeOTj x T6S*1D8O測a Ti*i m1:1- 628代：2托 N300.781 K7SJ831o.TOOLBO1 4X：6281 foot = 12 inch = 304.8 mm linch = 25.4 mm 1 mil=0.0254 mm1 in ch=1000 mil1OZ=28.375g 1 OZ 銅箔其真正厚度為 1.38mil 或 35m一、芯板、半固化片規(guī)格：1. 生益芯板常見規(guī)格：0.1mm (含銅厚)0.2mm5.12 0.3mm9.060.4mm12.

6、99 0.5mm16.93 0.6mm20.87 0.7mm24.8 0.8mm28.740.9mm36.611mm44.49 1.2mm52.36 1.5mm56.3 1.6mm60.24 2mm75.98 2.4mm91.732. 半固化片：10803.0mil 21164.2mil 76287.0mil 3.流膠厚:10802.5mil 76286.5mil 0.14mm=2*1080 0.21mm=2*2116 0.24mm=7628+10800.36mm=2*76280.4mm=2*7628+1080二、常用半固化片在不同銅厚、不同圖形厚度變化：3.1.CcjKr/g rklGtxl

7、/ndCopper/Mna)Gnd/signalSignal/signal7628737.06.86.76.621164,64.44.24.03.833133.93.83.73.53.310802.82,6152.4*土7628H7.67.37 J7.0692!IH4+94.74+54,34.13313H4 A4.03.93.73.5I018H2,92J2,62.52.37628C7 J6.86.66.56.433I3C5.73.63.53,23.12.Cper/gndGnd/gndCopper/sjgaalSignal/signul76287 1氐86P66-56J21164.5434.19

8、3.733138173.6加3,2OSO2.K2,62.52,4r 1B7628117.47J6.96.86.72I16H4hR4,6444.24.03313H4.03,93+83.63.4EOISH2,92.72.62.5工3762BC6.96.66.4636.23313C3.63.53,43.23.04.Ciipper/gndGrd/gndCopper/signaJGnd/signalSignal/signaJ7626.86,5636J6.021164.24,03點3,53333133.53.4333J2.810802+6?.42JL97628 H7.16.8&66.46321 I

9、fH4.54.3P 4J3.83,63313!1J.73.63.53.33.02.72.52,42.07628C6.66.36.15.95.83313C33123.12,92.6Coppc芝rxJGiid/ndGiKi/ignulSignaVsigrwl76286.56.26.05.75-621164.03.83.23.033133.33.2 j32.82.510802.4222IS1.67628H6居6.56.36.05.92I16H*34.13.93.53333I3H3A133.02.7I01SH25231.91.77628C636.05.85.55-4沐1 X3.13.02.92.62.

10、3注：Gnd 為 65%以上的大銅箔，H 為高樹脂含量，C 為低樹脂含量S0401 粘結片壓合厚度（100%殘銅率）厠脂含壓合厚度“ m/ 20 “ m壓合厚度Mil106713512.00.41080L613722.80.41080A643803.10.41080H683923.60.42116L5031154.50.62116A5231214.80.62116H5631355.30.633135531024.00.67628L4131887.40.87628A4331987.80.87628M4632138.40.87628H5032359.30.81506A45土31626.40.815

11、O6H4831756.90.8樹脂含壓合厚度“ m/ 20 “ m壓合厚度Mil106713502.00.41080L613712.8 0.41080A643783.10.41080H68土3903.50.42116L5031134.40.62116A5231204.70.62116H5631335.20.633135531004.00.67628L4131857.30.87628A4331957.70.87628M4632108.30.87628H5032309.10.81506A4531606.30.81506H4931756.90.8樹脂含壓合厚度“ m/ 20 “ m壓合厚度Mil106713491.90.41080L623722.80.41080A653793.10.41080H68土3883.60.42116L5131144.50.62116A5331204.70.62116H56土31305.10.633135631004.00.67628L4231877.40.87628A4431967.70.87628M4632058.10.87628H5032278.90.81506A4531566.10.815O6H4831686.60.8規(guī)樹脂含壓合厚度“ m/ 20 “ m壓合厚度Mil106713471.90.41080L633712.80.41080A663783.