液晶面板LCM模組生產(chǎn)流程簡介

1、1 Chi Mei Optoelectronics Page2制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei

2、 Optoelectronics Page31st -外觀檢查 (Appearance Inspection)作法 : 以目視檢查 目的：篩檢LCD后流外觀不良的Panel, 如缺角、玻璃刮傷、殘膠、CF玻璃突出等注意事項：取放面板時易造 成玻璃缺角需特別小心；取放 擦拭面板時需戴靜電環(huán)并極力 避免碰觸到X、Y側(cè)端子部分， 以免產(chǎn)生靜電不良 Chi Mei Optoelectronics Page4制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈

3、Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page52nd -涂導電膠 (Conductive Resin Dispense)作法 : 在面板X、Y側(cè)端子部分涂 上導電膠目的：增強面板防止靜電破壞的能力注意事項：取放面板時易造成玻 璃缺角需特別小心；取放 面板時需戴靜

4、電環(huán)并極力 避免碰觸到X、Y側(cè)端子 部分，以免產(chǎn)生靜電不良 Chi Mei Optoelectronics Page6制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPa

5、cking包裝Ware House.入庫 Chi Mei Optoelectronics Page73rd - 磨邊 (Beveling)重點：將面板X、Y側(cè)端子部玻璃邊磨平目的：將面板X、Y側(cè)端子部玻璃 邊磨平避免玻璃棱角刮傷人 員、部 品，并藉以消除玻 璃邊內(nèi)在應力避免玻璃受應 力而產(chǎn)生裂痕、缺角，并將 short bar 磨除注意事項：X、Y側(cè)端子部玻璃邊 磨平是高溫高摩擦的動作 ，需注意磨邊時機器噴水是 否正常，避免產(chǎn)生靜電不良 Chi Mei Optoelectronics Page8制程重點解說.Appearance Inspection外觀檢查Conductive Resin D

6、ispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page94th - 異物括除 (Cullet Remove)作法：用刮刀刮除玻璃面板上的異物目的：刮刀刮除玻璃面板上的異物，避

7、免偏光板貼付時異物留存于面板與偏光板間造成不良注意事項：刮刀作動在面板上必須與面板平行接觸，作動范圍需涵蓋整個面板 Chi Mei Optoelectronics Page10制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整A

8、ging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page115th - 洗凈 (Wet Clean)作法：用洗凈液將面板洗凈目的：用洗凈液將面板上之異 物沖洗干凈 Chi Mei Optoelectronics Page12制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓

9、著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page136th - 貼偏光板 (Polarizer)作法：將上下偏光板貼付于面板 上下兩側(cè)目的：為使產(chǎn)品光學(影像)顯示正常，面板需與上下偏光板貼合注意事項：上下偏光板與面板搭 配的方式條件決定產(chǎn)品合 光學特性，故上下偏光板 貼付的方向精度需符合規(guī) 格要求 Chi Mei Optoelectroni

10、cs Page14制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page1

11、57th - 脫泡 (Auto Clave)作法：將偏光板貼付完成品置入高溫加壓爐內(nèi)目的：利用壓力及高溫將偏光板 與面板貼合時產(chǎn)生的氣泡 擠壓出來或壓小、并使面 板與偏光板兩者接合更緊 密注意事項：抬放Cassette時須小心 ，避免摔破面板 Chi Mei Optoelectronics Page16制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試

12、PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page178th - 點燈測試 (LOT)作法：將高溫加壓脫泡后半成品在LOT機臺點燈檢查目的：篩檢磨邊至偏光板貼付工 程造成的的不良（如偏光 板異物、偏光板膠等）及 前工程（LCD廠）后流的 品位不良品注意事項：檢查工程需花費較多 的眼力精神更需要仔細與 耐心，確保不良不后流及 避免篩檢過嚴，才能避免 材料浪費，成本損

13、失 Chi Mei Optoelectronics Page18制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Me

14、i Optoelectronics Page199th - OLB (TAB壓著)作法：將面板與TAB IC藉由ACF接合目的：使面板端子Lead與TAB Lead準確對位藉由ACF 異方向?qū)щ姷奶匦裕ㄉ?下導通，左右絕緣）接 合導通，使面板內(nèi)的 TFT能接收到TAB IC輸 出的正確訊號和資料注意事項：生產(chǎn)前的點檢、確 認事項必須確實 Chi Mei Optoelectronics Page20制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈P

15、olarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page2110th - OLBI (OLB測試)作法：將OLB半成品在OLBI機臺點燈檢查目的：檢查OLB工程造成的的不 良（如線欠陷、short等）注意事項：拿取半成品需小心避 免碰觸到TAB Lead，造成 TAB Lea

16、d曲折。檢查工程 需花費較多的眼力精神更 需要仔細與耐心，確保不 良不后流及避免篩檢過嚴 ，才能避免材料浪費，成 本損失 Chi Mei Optoelectronics Page22制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍

17、調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page2311th - PCB (PCB壓著)作法：將PCBA與TAB IC藉由ACF接合目的：使PCBA Lead與TAB Lead準確對位藉由ACF 異方向?qū)щ姷奶匦裕ㄉ?下導通，左右絕緣）接 合導通，使PCBA輸出 的邏輯控制訊號與資料 能正確傳送到TAB IC輸 入端注意事項：生產(chǎn)前的點檢、確 認事項必須確實 Chi Mei Optoelectronics Page24制程重點解說.Appearance Inspection外觀檢查

18、Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page2512th - PCBI (PCB測試)作法：將PCB半成品在PCBI機臺點燈檢查

19、目的：檢查PCB工程造成的的不 良（如線欠陷、階調(diào)不良 等）注意事項：拿取半成品需小心， 避免碰撞PCBA，造成 TAB拉扯而撕開、脫落。 需花費較多的眼力精神 更需要仔細與耐心，確 保不良不后流及避免篩 檢過嚴，才能避免材料 浪費，成本損失 Chi Mei Optoelectronics Page26制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試

20、PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page2713th - Silicone Dispense (涂防水膠)作法：將硅膠涂在面板X/Y側(cè)端子部份上目的：防潮防腐蝕增加密合強度增加IC強度注意事項：膠量的多寡，多則容易溢出玻璃邊或溢到玻璃上；少則防潮、防腐蝕、增加密合強度等需求特性會不足 Chi Mei Optoelectronics Page28制程重點解

21、說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page2914th - 組裝 (As

22、sy.)作法：將背光板外框?qū)щ娕菝轕CB COVERX/Y保護膜SCREW等物料與Panel組合目的：將PANEL與B/L組裝成模組注意事項：確認物料的機種規(guī)格 B/L表面異物徹底清除 組裝方式/流程PANEL 拿取方式 Chi Mei Optoelectronics Page30制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCB

23、IPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page3115th - 閃爍調(diào)整 ( Flicker Adjust)作法：利用螺絲起子調(diào)整可變電阻（Vcom)目的：將Vcom值調(diào)整至Flicker最佳狀態(tài)（Flicker均勻、跳動最小）注意事項：依照規(guī)格值（ spec.）調(diào)整 Chi Mei Optoelectronics Page32制程重點解說.Appearance Inspectio

24、n外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page3316th - 高溫烘烤 (Aging)作法：將模塊放進Aging爐目的

25、：針對液晶在高溫長期動作之測試及模塊機構(gòu)測試注意事項：溫度確認、排線接合確認、程序確認 Chi Mei Optoelectronics Page34制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C Test

26、C檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page3517th - C檢 (C Test)作法：將模塊接上信號源目的：依品味檢查注意事項：依照規(guī)格（spec. ）檢查 Chi Mei Optoelectronics Page36制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測

27、試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page3718th - D檢 (D Test)作法：將模塊拿起來用眼睛左右前后檢查看看目的：模塊外觀檢查注意事項：組裝是否完全崁合、外觀是否有刮傷、部材是否錯誤或欠缺 Chi Mei Optoelectronics Page38制程重點解說.Appearance Inspection外觀檢查Conductive Res

28、in Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓著OLBIOLB測試PCBPCB壓著PCBIPCB測試Silicone Dispense涂防水膠Assy.組裝Flicker Adjust閃爍調(diào)整Aging高溫烘烤C TestC檢D TestD檢OQCPacking包裝Ware House.入庫 Chi Mei Optoelectronics Page3919th - OQC作法：將模塊接上信號源、進行一連串的測試目的：確保產(chǎn)品品質(zhì)是否符合顧客要求注意事項：依照顧客品質(zhì)要求檢查QC Chi Mei Optoelectronics Page40制程重點解說.Appearance Inspection外觀檢查Conductive Resin Dispense涂導電膠Beveling磨邊Cullet Remove異物括除Wet Clean洗凈Polarizer貼偏光板Auto Clave脫泡LOT點燈測試OLBTAB壓