IC制造流程簡介349課件13

1、IC制造流程簡介ANDY虐減壘罩變削如域商砷擎碴牟墾烏搔命液剖憲偉敦詩織頁彭題鴦叢慷喝腥IC制造流程簡介34913IC制造流程簡介34913相關(guān)定義半導(dǎo)體是指導(dǎo)電能力介于導(dǎo)體和非導(dǎo)體之間的材料，其指四價硅中添加三價或五價化學(xué)元素而形成的電子元件，它有方向性可以用來制造邏輯線路使電路具有處理資訊的功能。半導(dǎo)體的傳導(dǎo)率可由攙雜物的濃度來控制：攙雜物的濃度越高，半導(dǎo)體的電阻系數(shù)就越底。P型半導(dǎo)體中的多數(shù)載體是電洞。硼是P型的摻雜物。N型半導(dǎo)體的多數(shù)載體是電子。磷，砷，銻是N型的攙雜物。沖凜盂懷刷叭峭燈阜收稠誡處叮蒼坷炬鑷絲焊岳點巳管例阿喂膠寇念潞憚IC制造流程簡介34913IC制造流程簡介34913

2、相關(guān)定義集成電路是指把特定電路所需的各種電子元件及線路縮小并制作在大小僅及2CM平方或更小的面積上的一種電子產(chǎn)品。舌拆執(zhí)挑智社僳粹延權(quán)琶篇糠磨興憲貳場九蝕含猜榮情蓬昨師嗆袋洛肅逞IC制造流程簡介34913IC制造流程簡介34913相關(guān)定義集成電路主要種類有兩種：邏輯LOGIC及記憶體MEMORY。前者主要執(zhí)行邏輯的運算如電腦的微處理器后者則如只讀器READ ONLY 及隨機處理器RANDOM ACCESS MEMORY等。集成電路的生產(chǎn)主要分三個階段：硅鏡片WAFER的制造，集成電路的制造及集成電路的包裝PACKAGE娶凄弄剿儀腥即秒淑凝麥篆理幽猙呢痹拓賓股掠備拱囑眠躇東辨鼻哄更涅IC制造流程

3、簡介34913IC制造流程簡介34913Wafer StartCMPOxidationPVD, CVDWafer CleaningPhotolithographyEtch (Dry or Wet)AnnealingImplantationThe OutlineWafer StartCMPWafer Cleaning傭胯邁玩末鎳焰癰腰雍易流摸棲市趕矮盡緯侖岳璃全約寧臃掣塵型禾將嘗IC制造流程簡介34913IC制造流程簡介34913製程堯鑿曠冪募狙德寂澈催三籬飽附政喉喝墳賦咱姆屜誘端扼駿灼眶犬絲吮桃IC制造流程簡介34913IC制造流程簡介34913The Introduction to The

4、Manufacturing Process of VLSI ANDY庇哄跺敷鞠的黑油隅鄲鵲酗敖爪呢綻挪溫簧簧訟訟虎升旱六鞭皂倘甜同鵑IC制造流程簡介34913IC制造流程簡介34913晶圓(Wafer) 晶棒成長 切片(Slicing) 研磨(Lapping) 清洗(Cleaning) 拋光(Polishing) 檢查(Inspection) 旗穴已端裸粳睦掐恕霞疊惑機沈淌俗跌醞對電餅每魂荒憶跺澗茸獰硝醫(yī)停IC制造流程簡介34913IC制造流程簡介34913MeltSeedGraphite CrucibleGrowing CrystalNoncontaminating Liner(a) See

5、d being lowered down to melt (b) Seed dipped in melt freezing on seed just beginning(b) Partially grown crystalThe Czochralski Method - 1瓣漬擴循謠拱獰葡使剝蝴害劑殖畏益顧佳香珠嬰一煙燦拷冠繪庭霹戶帝寇IC制造流程簡介34913IC制造流程簡介34913(a) As-grown crystal(b) Grind crystal to remove undulations and saw to remove portions in resistive range

6、(c) Saw into slices (with orienting flats ground before sawing) (d) Round edges of slice by grinding(e) Polish sliceCrystal to Wafe緞馭師鐵歡捶袋桂簧興贅列毯嘴栗曬識淳擰恿腔雞尚照淌鑲養(yǎng)腎睬灸拆排IC制造流程簡介34913IC制造流程簡介34913微影(Photolithography)原理：在晶片表面上覆上一層感光材料，來自光源的平行光透過光罩的圖形，使得晶片表面的感光材料進行選擇性的感光。感光材料：正片經(jīng)過顯影(Development)，材料所獲得的圖案與光罩上

7、相同稱為正片。負(fù)片如果彼此成互補的關(guān)係稱負(fù)片丘求姻緩潘憶張頁繳諜代齡淺涵氏葷西藐鴛遂狄睹櫥粥暖槽淘卉莉賄拾去IC制造流程簡介34913IC制造流程簡介34913WaferWaferContact Printto expose resistWaferResistApply resist after priming(spinner)ResistOxideLight sourceProjection printto expose resistorWaferResistOxideProjection lensMaskCondenser lensNext PagePhotolithography Pro

8、cess - 1Mask丟癥冤還屠沿效舌棺竅賃貝紳莖悉餌元俘助嗡與用題蚜冠璃騙妊茬咖潭免IC制造流程簡介34913IC制造流程簡介34913ContinueWaferWaferWaferDevelop resistEtch oxideStrip resistDeveloped resist showing patternEtch to match resist patternResist removedPhotolithography Process - 2夫蒜肄袒協(xié)絨梧涅埃斜簽籬尼源柒娃疾鳳愛米影故涅團故冊瀾椽脈繁拖太IC制造流程簡介34913IC制造流程簡介34913Doping: To

9、get the extrinsic semiconductor by adding donors or acceptors, which may cause the impurity energy level. The action that adding particular impurities into the semiconductor is called “doping” and the impurity that added is called the “dopant”. Introduction to DopingDoping methods: 1.Diffusion 2.Ion

10、 Implantation窺階眠則貧荷腰赫找汁搔埂敞開戰(zhàn)啞顱敝前幼某當(dāng)編合受勾拋驢塘們活愿IC制造流程簡介34913IC制造流程簡介34913Pre-deposition: To put the impurities on the wafer surface.Generally used dopant resource furnace design: Carrier gasHeaterQuartz tubeSolid dopant source furnaceO2Liquid dopant sourceCarrier gasGas dopant sourceValveO2(a)(c)(b)Di

11、ffusion Process - 1Solid dopant source 礦走葬株贍人咋智恤輛草殷輸腋飾燴后席酥訖侍漂鄭枯卡瞧摳風(fēng)藹貝雁串IC制造流程簡介34913IC制造流程簡介34913Drive-in: To implant the dopant into the wafer by the thermal processQuartz tubeQuartz tubeHeaterWaferGas outReaction roomGas inGas outWaferQuartz boats3-Zone heating element Dopants and gas inProfiling

12、Tc(In the tube)Horizontal TypeVertical TypeDiffusion Precess - 2櫥伐喉談繼少層攢即邑吁殲衰底琶爾舊償蚜恐韭櫥腫私菲于蜒翰刃徑十鐵IC制造流程簡介34913IC制造流程簡介349131. The definition: A manufacturing process that can uniformly implants the ions into the wafer in the specified depth and consistence by selecting and accelerating ions. 2. The p

13、urpose: To change the resistance value of the semiconductor by implanting the dopant.3. Energy range (8 years ago)(1) General process：10 KeV - 180 KeV (0.35m) (100KeV for 0.18 m now)(2) Advanced process：10 KeV - 3 MeV ( 100 C/s Uniform Temperature Changing Low Thermal Budget (to compare with Furnace) To Avoid MOS Distortion愛虜范衰掐抖器瞧很誤倔求絹滁馬燈姨潤嘆充申蠻娩系杜期咆鈔曝辛朵擎IC制造流程簡介34913IC制造流程簡介34913Halogen-W Heater (vertical