MPC教育資料和專業(yè)詞匯解析

1、1：什么是PC2：什么是MPC3：MPC需要關注和解決那些問題4：MPC專業(yè)詞匯解釋MPC教育資料和專業(yè)詞匯解析什么是PCPC就是production controlPC 是著眼在公司層面，根據(jù)銷售訂單以及生產(chǎn)線產(chǎn)能進行制定生產(chǎn)投入產(chǎn)出計劃職責：產(chǎn)品的投入計劃確保產(chǎn)品交貨期，以及產(chǎn)出計劃。確認制品MOVE情況以及提醒交貨期會有延遲的產(chǎn)品執(zhí)行客戶需求的產(chǎn)品釋放以及停滯等等MPC教育資料和專業(yè)詞匯解析什么是MPCMPC 的客戶是MPP,MPP客戶是PC。也就是說詳細的完成PC所下達的任務。按生產(chǎn)計劃檢查、跟蹤并準確及時報告生產(chǎn)流程中的問題。 依據(jù)WIP、制品交期、設備負荷、制程時間限制以及在制品及

2、設備的運行狀況等因素調(diào)整實時調(diào)度系統(tǒng)的運行 提高人員及設備利用率制品流通率的管理及有關數(shù)據(jù)的提供 依據(jù)生產(chǎn)數(shù)據(jù)計算生產(chǎn)能力。MPC教育資料和專業(yè)詞匯解析MPC需要解決哪些問題The mission of a manufacturing fab : To satisfy customer and maximize the capacity and wafer output What customer wants? On time delivery Good wafer quality Low unit priceMFG indices indicates the performance of a

3、 FabMPC教育資料和專業(yè)詞匯解析Index nameShort descCTCycle TimeTRTurn RatioMoveWafer movementWIPProduction wafer in processEngWIPEngineer wafer in processYieldFab YieldHoldHold WIPTerminateEngineer wafer scrapScrapProduction wafer scrapReworkRework waferWSWafer startWOWafer outKEYMPC教育資料和專業(yè)詞匯解析 C/T英文全名：Cycle/Tim

4、e中文全名: 運轉(zhuǎn)周期定義: the average lead time which one wafer must pay for running,waiting,holding,and time on bank from wafer start to QC-Inspection計算方式: Cycle_Time_Waferi/Wafer_Output 計算頻率/單位: 天FAB的硅片的運轉(zhuǎn)速度FAB的run貨效率MPC教育資料和專業(yè)詞匯解析 TR英文全名：TurnRatio T/R中文全名: 在制品周轉(zhuǎn)率定義: Average number of stages which one wafer

5、can penetrate in one day 每片硅片平均每天跑過的Stage數(shù)計算方式: Stage Move/WIP WIP=(BOH+EOH)/2計算頻率/單位: 每日Turn Ratio可知硅片處理速度是否正常Stage Move與WIP的比值，因此由此可以得知目前的WIP量是否合理，在制品積壓成本是否過高，以及生產(chǎn)流程是否順暢 MPC教育資料和專業(yè)詞匯解析 Move英文全名：Wafer Moves中文全名: 硅片移動量定義: 一片硅片完成一個Stage 稱為一個Stage Move; 一片硅片完成一個Step 稱為Step Move計算方式: 由Fab中實際操作的硅片數(shù)加總得到計

6、算頻率/單位: 每日或每月指標意義: 1.由各個移動量可以了解目前硅片之處理速度是否 正常MPC教育資料和專業(yè)詞匯解析 WIP英文全名：廣義上 Work in process 在半導體行業(yè):Wafer In Process中文全名: 在制品定義: 從硅片投入到硅片產(chǎn)出，F(xiàn)ab內(nèi)各站積壓了相當數(shù)量的硅片，統(tǒng)稱為Fab內(nèi)的WIP計算方式: 堆積硅片求和計算頻率/單位: 每日或每月/片指標意義: 衡量一個FAB的生產(chǎn)能力的標志 PWIP : Production WIPEngWIP : Engineering WIPMPC教育資料和專業(yè)詞匯解析 Yield英文全名：Yield中文全名: 良率定義:

7、產(chǎn)出硅片良品數(shù)量與投入生產(chǎn)之硅片數(shù)量的比率計算方式: 硅片產(chǎn)出量/（硅片產(chǎn)出量+硅片報廢量）計算頻率/單位: 每月 %指標意義: 由良率可以顯示所生產(chǎn)硅片之制造環(huán)境，制程，規(guī)格方面之綜合表現(xiàn)，故其為最重要的品質(zhì)指標MPC教育資料和專業(yè)詞匯解析英文全名:Hold中文全名:硅片擱置定義: 在生產(chǎn)過程中因為控制或者工程原因暫時無法進行生產(chǎn)的硅片數(shù)量計算方式: 所有hold WIP數(shù)量相加計算頻率/單位: 每日或每月 片指標意義: 1. 衡量工廠生產(chǎn)穩(wěn)定度 HoldMPC教育資料和專業(yè)詞匯解析 Terminate / Scrap英文全名：Scrap中文全名:報廢硅片定義: total wafer sc

8、rap quantity in FAB計算方式: 所有Scrap求和計算頻率/單位: 每日或每月 片F(xiàn)AB的生產(chǎn)良率 3.Eng WIP terminate 用以衡量工廠研發(fā)或者保持制程穩(wěn)定而用掉的costMPC教育資料和專業(yè)詞匯解析 Rework英文全名:Rework中文全名:返工定義: Total rework count in Fab litho area計算方式: 所有rework 數(shù)目累加計算頻率/單位: 每日或每月 片Litho制程穩(wěn)定度litho無效 movement數(shù)量MPC教育資料和專業(yè)詞匯解析 WS英文全名:Wafer start中文全名:硅片下線定義: Total waf

9、er start count計算方式: 所有下線數(shù)目累加計算頻率/單位: 每日或每月 片指標意義: 衡量工廠生產(chǎn)規(guī)模MPC教育資料和專業(yè)詞匯解析 WO英文全名:Wafer out中文全名:硅片出貨定義: Total wafer out count計算方式: 所有出貨數(shù)目累加計算頻率/單位: 每日或每月 片指標意義: 衡量工廠生產(chǎn)規(guī)模MPC教育資料和專業(yè)詞匯解析 MFG indices introduction What is a “Golden” FabMPC教育資料和專業(yè)詞匯解析MPC需要關注哪些問題Wafer MovesWafer Step MoveLocation MoveWafer I

10、n Process (WIP)End On Hand & Begin On HandTurn Ratio (T/R) - Daily Equipment UP TimeWafer Per Hour (WPH)Equipment EfficiencyUtilizationManufacturing EfficiencyCycle Time Per Mask Layer (C/T)Wafer OutLine Yield Wafer Acceptance Test (WAT) Fab Yield MPC教育資料和專業(yè)詞匯解析Wafer MovesDefinitionWafer step Move =

11、 1 wafer moving from one Step to another.Wafer stage Move = 1 wafer moving from one stage to another.Method of CalculationSum of actual fab or section wafer stage moves to give fab wafers move, and section wafers move respectively.Purpose of Wafer Move IndexFrom present amount of wafer moves, we can

12、 determine if the present production rate of the section or fab is normal.Use as a measurement index to compare shift to shift or fab to fabMPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: Particular lot of 25 wafers completed 4 stages on the 1st of February 2000.Scenario 2:Particular lot of 25 wafers c

13、ompleted 70 stages in the month of January 2000.Scenario 1 Moves: On the 1st of February 2000, Wafer Move = 25 X 4 = 100 Scenario 2 Moves: In the month of January 2000, Wafer Move = 25 x 70 = 1750MPC教育資料和專業(yè)詞匯解析Wafer Step MoveDefinitionWafer STEP Move - 1 wafer moving from one step to another.(Note:

14、1 Step is equivalent to 1 equipment move or 1 metrology step.)Method of Calculation Sum of actual fab, section or equipment wafer STEP moves to give fab wafers move, section wafers move and equipment wafer moves respectively.Purpose of Wafer Step Move IndexFrom present amount of wafer moves, we can

15、determine if the present production rate of the equipment or section is normal.Use as a measurement index to compare equipment to equipment or performance of operator to operator.MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: Particular lot of 25 wafers completed 6 steps on the 1st of February 2000.Sc

16、enario 1 Step Moves: On the 1st of February 2000, Wafer Move = 25 X 6 = 150 Step Moves (Assuming the average number of steps per stages 3 steps / stage)Stage Moves on 1st of February 2000 = 150 / 3 = 50 Stage MovesMPC教育資料和專業(yè)詞匯解析Location MoveDefinitionTotal number of Wafer Stage Move 1 wafer moving f

17、rom one stage to another.Method of Calculation Sum of stage moves within process area (CVD, PVD, PHOTO, etc).Purpose of Location Move IndexFrom present amount of wafer moves, we can determine if the present production rate of the process area is normal.Use as a measurement index to compare day to da

18、y or month to month performance of a process area.MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: Wafer Move in the CVD area for IMD = 1200, PETEOS = 800, SACVD = 500, HDP = 400 and BPTEOS = 400.Scenario 1 Locaton Moves: CVD Location Moves = 1,200 + 800 + 500 + 400 + 400= 3,000 MovesMPC教育資料和專業(yè)詞匯解析Wafer

19、 In Process (WIP)DefinitionNumber of wafers per step, stage, section, shift or fab. (ie running, wait, hold, etc)Method of Calculation Sum of all wafers in that step, stage, section, shift or fab respectively.Purpose of Work In Process IndexFrom present amount of wafer moves, we can determine if the

20、 present capacity of the equipment, section or fab is sufficient.Use as an indicator to possible bottleneck in the fab.Movement of the WIP index will reflect the stability of the equipment / process and at the same time the capability (constraints) of the equipment.MPC教育資料和專業(yè)詞匯解析End On Hand & Begin

21、On Hand (1)DefinitionEOH - WIP per stage, section or shift or fab at the END of a shift.BOH - WIP per stage, section or shift or fab at the START of a shift. Method of Calculation Sum of all wafers in that stage, section, shift or fab respectively at the end or start of a shift.MPC教育資料和專業(yè)詞匯解析End On

22、Hand & Begin On Hand (2)Purpose of EOH and BOH IndexBy comparing the EOH and the BOH of a shift, we can have a feel of the performance of the equipment and the shift. An increase in WIP from the BOH to EOH may indicate poor equipment status in the different fabs or sections or shifts, or poor dispat

23、ching skill of the shift if the equipment status is normal.MPC教育資料和專業(yè)詞匯解析Turn Ratio (T/R) - Daily (1)DefinitionNumber of stages completed by each wafer per day.Method of Calculation T/R = Total Stage Moves Per Day / Average WIP(Note: Average WIP per day = BOH + EOH / 2)MPC教育資料和專業(yè)詞匯解析Turn Ratio (T/R)

24、 - Daily (2)Purpose of Turn Ratio IndexFrom the T/R we can determine if the current wafer production rate is normal or too slow.As this indicator takes the ratio of Stage moves to Average WIP, therefore we could determine if:Current WIP is reasonable relative to bench marked quantity.Is the cost of

25、WIP (inventory) relative to the cost of equipment lost time proportional.Current production flow is smooth with no bottleneckIs the stage target realistic.MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: On the 1st of February 2000, Total Stage Move (CVD) is 10,000, the BOH WIP on that day is 5,500 and

26、EOH WIP on that day is 6,000.Scenario 1 T/R: On the 1st of February 2000, T/R = 10,000 / (5,500 +6,000) / 2 (Note: An average T/R of 2.1 to 2.2 is reasonable for a fab)MPC教育資料和專業(yè)詞匯解析Equipment UP Time (1)DefinitionTime when equipment is fit-for-production.Method of Calculation UP Time = Run Time + Lo

27、st Time + Test Time + Backup TimePurpose of UP Time IndexFrom the UP Time we can determine the total amount of time available for production.The ratio of Lost Time to Available Time is used to determine the room for improvement in terms of utilization for a particular equipment. MPC教育資料和專業(yè)詞匯解析Equipm

28、ent UP Time (2)MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: In February 2000, Run Time = 700 hours, Lost Time = 100 hours, Test Time = 100 hours, and Backup Time = 50 hours for WCVD equipment. Scenario 1 WCVD Available Time: In February 2000, Avail Time= 950 hoursLost Rate = 100 / 950= 10.5%MPC教育資料和

29、專業(yè)詞匯解析Wafer Per Hour (WPH) (1)DefinitionNumber of wafers processed per hour.Method of Calculation WPH = Wafer Move / Run TimePurpose of Wafer Per Hour (WPH) Index (1)From the present equipment WPH we can determine whether the current equipment rate of production total is normal.The equipment WPH can

30、 be used to derive the equipment capacity, which can be in turn used to determine if the total capacity for a particular capability is sufficient.MPC教育資料和專業(yè)詞匯解析Wafer Per Hour (WPH) (2)Purpose of Wafer Per Hour (WPH) Index (2)The ratio of the current equipment WPH to the Theoretical WPH (T WPH) can b

31、e used to determine if the equipment is presently operating in the optimum conditions.WPH index can also be used to measure individual MA or shift performance, especially so in manual operations.Relative WPH between equipment running the same recipe can be used to determine the individual equipmentM

32、PC教育資料和專業(yè)詞匯解析Sample Calculations (1)Scenario 1: On 1st of February 2000, Run Time = 20 hours and Wafer Moves = 1700 wafers for WCVD equipment. Scenario 2:The same equipment for the month of February 2000, Run Time = 600 hours and the total Wafer Moves = 54,000 wafers. Scenario 3:Run Time = 12 hours,

33、 Wafer Moves by Operator A = 500 and Operator B = 400 on the same equipment.MPC教育資料和專業(yè)詞匯解析Sample Calculations (2)Scenario 1 WCVD WPH: On 1st of February 2000, WPH = 1,700 / 20 = 85 wafers / hourScenario 2 WCVD WPH: In the month of February 2000, WPH = 54,000 / 600 = 90 wafers / hourTherefore, we can

34、 say that the current equipment rate of production is lower than the average for the whole month.Scenario 3: Operator A has a WPH = 500 / 12 = 41.67 wafers / hour Operator B has a WPH = 400 / 12 = 33.33 wafers / hourMPC教育資料和專業(yè)詞匯解析Equipment Efficiency (1)DefinitionPercentage of the actual wafer moves

35、 per hour to the ideal wafer moves per hour.Method of Calculation Equipment Efficiency = (Total Actual Wafer Moves / Total Run Time) / (Average Ideal WPH) X 100%Note: As the “Ideal WPH” is dependent on the recipe of the lot processed, the “Average Ideal WPH” is the sum of the “Ideal WPH” multiple by

36、 the proportion of the number of lots (during the period of time) with that recipe divided by the Total Run Time. MPC教育資料和專業(yè)詞匯解析Equipment Efficiency (2)Purpose of Equipment Efficiency IndexThe equipment efficiency index show how much deviation from the optimum performance is the equipment being oper

37、ated in.Determine if there is any weakness / abnormality with an equipment capabilities / fab WIP profile / process capability.Base on the efficiency of the equipment, we are able to look into methods to optimize the equipment and increase the throughput of the equipment.MPC教育資料和專業(yè)詞匯解析ExamplesExampl

38、e of some situations that LOWERS the equipment efficiency:Only 1 SMIF Arm is in working condition.Takes a longer time than usual to achieve required vacuum for the load lock equipment problem.SMIF Arm unable to unload automatically therefore status remains “Run” (Run Time increases without increase

39、in output) even when wafers already completed its process.The bottleneck chamber of the equipment is down and therefore the impact deducted is less than the actual impact.Time require for achieving vacuum is the same for a lot with 25 wafers and one with only 1 wafer. Therefore the time per wafer is

40、 increase significantly when lot with only 1 wafer is processed.MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: On 1st of February 2000, shift A, WCVD equipment, Wafer Moves = 375 wafers, Run Time = 12 hours. The lots consist of 5 lots of recipe A and 10 lots of recipe B. Recipe A: Ideal WPH = 30, Reci

41、pe B: Ideal WPH = 45.Scenario 1 Efficiency: Average Idea WPH = (5 / 15 X 30) + (10/15 X 45)= 40 wafer per hourEquipment Efficiency = (375 / 12) / (40) X 100= 78.13%MPC教育資料和專業(yè)詞匯解析Utilization (1)DefinitionThe amount of time demanded of an equipment for production, versus the total amount of time avail

42、able. Demand / CapacityMethod of Calculation Utilization = (Run Time + Test Time + Back Up Time) / Total Time X 100%MPC教育資料和專業(yè)詞匯解析Utilization (2)Purpose of Utilization IndexFor a Utilization Index greater than 100% for certain equipment, we can safely say that the present equipment capacity is not s

43、ufficient for the present demand.If the utilization is low for certain equipment, but the WIP is high, it could be due to the equipment not having the capability to run the recipes required by the WIP.MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: In a day (24 hours), WCVD equipment has Run Time = 12

44、hours and Back Up Time = 6 hours. Scenario 1 Utilization: Utilization = (12+6) / 24 X 100%= 75%MPC教育資料和專業(yè)詞匯解析Manufacturing Efficiency (1)DefinitionPercentage of the equipment available time used for production (Run Time, Test Time and Back Up Time) over the total equipment available time (Run Time,

45、Test Time, Lost Time and Back Up Time).Method of Calculation Manufacturing Efficiency = (Utilization / Availability) X 100%MPC教育資料和專業(yè)詞匯解析Manufacturing Efficiency (2)Purpose of Manufacturing Efficiency IndexThe manufacturing efficiency index compares the performance of the operator under a high WIP s

46、ituation. The higher the efficiency index the better the performance.One of the indicators for low WIP for specific equipment, section or fab.A high WIP and low manufacturing efficiency index could be due to equipment constraint and its capabilities.MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: Opera

47、tor As equipment has Run Time = 8 hours, Test Time = 1 hour, Back Up Time = 0 and Lost Time = 3 hours. Scenario 1 Operator A: Manufacturing Efficiency =(8+1+0) / (8+1+0+3) X 100% = 75%MPC教育資料和專業(yè)詞匯解析Cycle Time Per Mask Layer (C/T) (1)DefinitionAverage number of days required for processing between tw

48、o photo stages. (1 layers . one photo stage to another)As each individual layer is defined by a photo stage, therefore the number of layers of a product is equivalent to the number of photo stages.Note: For 0.25 micron technology, there is an average of 25 layers.Method of Calculation C/T = (Time wh

49、ich wafer passes the QC test Time at wafer start) / Number of photo stages.MPC教育資料和專業(yè)詞匯解析Cycle Time Per Mask Layer (C/T) (2)Purpose of Wafer Move IndexBase on the number of layers of the product, and the use of the average cycle time of the fab, we are able to determine the average time required for

50、 the product from start to completion. Thereby, enabling us to decide on the date for the product wafer start in order to meet the delivery schedule.MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: A particular product has 16 layers, and the time required from wafer start till QC testing is 40 days. Sce

51、nario 1 C/T per layer: C/T per layer = 40 / 16= 2.5 days per layerMPC教育資料和專業(yè)詞匯解析Wafer OutDefinitionTotal quantity of wafers that passes the QC test. Method of Calculation Production Controller (PC) will announced the official Wafer Out quantity.Purpose of Wafer Out IndexThe Wafer Out Index will indi

52、cate the fab output status.MPC教育資料和專業(yè)詞匯解析Sample CalculationsScenario 1: In the month of February 2000, quantity of wafers that passes QC test =15,000 wafers. Scenario 1 Wafer Out: In the month of February 2000 Wafer Out = 15,000 wafersMPC教育資料和專業(yè)詞匯解析Line YieldDefinitionPercentage of wafers produced by the fab prior to WAT.Method of Calculation Line Yield = (Quantity of Wafer Produced) / (Quantity of Wafer P