芯片常用封裝及尺寸說明

1、 /5249/527.2、QFN328、BGA類BGA的全稱是BallGridArray（球柵陣列結(jié)構(gòu)的PCB）,它是集成電路采用有機(jī)載板的一種封裝法。它具有：封裝面積減少功能加大，引腳數(shù)目增多PCB板溶焊時(shí)能自我居中，易上錫可靠性高電性能好，整體成本低等特點(diǎn)。有BGA的PCB板一般小孔較多，大多數(shù)客戶BGA下過孔設(shè)計(jì)為成品孔直徑812mil，BGA處表面貼到孔的距離以規(guī)格為31.5mil為例，一般不小于10.5mil。BGA下過孔需塞孔，BGA焊盤不允許上油墨，BGA焊盤上不鉆孔。9、PLCC類PLCC塑料弓坡芯片載體）引腳PS1S2WLL1L220FN137.DD790D75201.20.

2、628FN1.271Q4510.45752.01.2O.EA4FN1.27155015.50752.01.2D.B66FN1.2723.1S23.160.75201.2o.e34FN1.27282028.30075201.20.B-J0opoqo0宣o掲oczi豈0oKQEo星fNwoopEw工嗎1乞-hlCpopF4w百寸Fa.so8oBoHoaosO:.-oIIl査Cl2CL舀DLmOLB|V*rvgssoQD88亍-s-堞需！kK冃sdJ&H絲cMQI61CMLOuM3co11tniCDL”omQFi-Qrncziprno6花ci3o茁osci述11aBGE需$1Lhi尸馬L険L茗L&Q

3、QQ占o(jì)舉oQo|0933禺ILOCMLO52/5252/5252/5252/52附錄1、貼片電阻規(guī)格介紹【貼片電阻規(guī)格、封裝、尺寸】英制inch)公制(mrm)K(L)(mm)寬側(cè)(mm)(mm)(oim)mm)02016030.6005.300.05.LDO050.150.0504(121005WXQ.LUU-iUCl.lDJ.3CJ0.LU0.2U0.1D0.250.LU0603160S1.60a,15a.sn+o.15a.40a.iDa,3D0.200.3D0.20030520122.000.201.250.150.5010.10CT.400.200.400.2012(?632163.

4、20a.20i.aa+o.150.550.100.5D+0.200.500.2032253.200.202.500.20O.S5O.LOCr.SD0.200,S00.2CLSL248324.50C.Ma.2an.2D55C.1Di：.50tl.2D0.500.202QL0502S5.000.2D2-50+0.20a.550.10a.60+0.200.600.20251264326.4Oa.?0300200.55a.l0a.&oo.2oo.eao.2o如貝奇想讓貼片電阻有拄穴的功耗，建枚怖把焊盤傲n面祝比較犬的更洞二，運(yùn)樣，吾通，顋斤封泯的已正|何頁也下二有E題！三是熱穩(wěn)走性待迪差一二小以俯日氓IMWI/2W2間電容電阻外形尺寸幻封皓的對應(yīng)關(guān)系是(M02=l.anmid_5mm06113=IjiiimxOSnnii0S(巧=2Ommx1.2mmI2()fy=32mmx1.6mm121(J=1.2mmx2_5mm1SI2=4.Smmx3_2mm2225=5.6mmxfi_5mm封裟額走功辜top苗制linil心制(miYi)揑卄也蘋至列最大工作電JE(V)nsm亦恥I/2CW!”-oweII協(xié)!I6W1506m1測1/I6W1/I0W50ostrs20121/ICJWI/KWJ501206S2lfil/S