PCBUL樣品規(guī)范標準要求

1、ATTACHMENT:SAMPLEPREPARATIONINSTRUCTIONS附件：樣品準備說明General總述SAMPLEPREPARATION-PreparesamplesbysubjectingthemtoAlloperationsofthespecifiedprocess.樣品準備一準備之樣品必須經(jīng)受所有的指定的工藝流程Includealletching,bakingandcuringsteps.包括所有蝕刻，烘烤和干燥過程。Exposethesamplestoallmaximumtimes,temperaturesandpressures.使樣品經(jīng)受所有的最長時間，最高溫度和最大

2、壓力。Subjectsamplestothemaximumnumberofcyclesspecifiedinanystep.使樣品經(jīng)受任何指定步驟中的最多次循環(huán)。PartA章節(jié)ABDSAMPLES-Makecertaintheconductorpatternwhichyouusetobuildthesamplesreflectyourratingrequirements.Theseinclude:BD樣品一務必確定樣品的導線分布反映您所要求的等級，包括：minimumcopperthickness最小銅厚minimumconductorwidths最小導線寬度maximumunpiercedd

3、iameter最大區(qū)域直徑minimumthicknessoflaminate基材最小厚度Wewillassignpatternlimitsbasedonactualmeasurementsofthetestsamples.我們將根據(jù)您所提供的測試樣品的實際尺寸來標定樣品規(guī)格界限。AttachmentT1,takenfromtheStandardforPrintedWiringBoards,Ul796,Figure10.1,illustratesatypicaltestpattern.Thetestpatternshouldappearonbothsidesofthesamples,onesi

4、debeingthemirrorimageoftheother.IfyoudesireRecognitionforsingle-sidedprintedwiringboardsonly,thetestpatternonlyneedappearononesideofthesamples.附件T1,取自印刷線路板標準一UL796,圖10.1,圖示為典型的樣品測試式樣。若為雙面板，則雙面的布線式樣應互為鏡像。若為單面板，則僅有一面為此布線式樣。Ifthemaximumunpierceddiameterwontfitonthetestpattern,pleaseprovideaseparateseto

5、fsamples.Youmayetchtheseintoeitheracircleorasquare.SeeFigure10.3.若最大直徑區(qū)域在附件T1樣品圖中無法容下,請另外準備一組體現(xiàn)最大直徑的樣品。可以蝕刻成圓形或者正方形。參見圖10.3。COPPERTHICKNESS-Ifyouplantobuycoppercladlaminatewithaminimumcopperthicknessoflessthan34microns(1oz./squarefoot),youshouldplateyoursamplesto34micronsfortestingpurposes.銅厚一若您將要使用

6、的覆銅基材的銅厚小于34微米，則為了測試需要，請將您的樣品銅厚鍍至34微米。Inproduction,ifyouplantoplatecoppertomorethan102micronsthick(3oz./squarefoot),pleaseprovideanextrasetofsamplesbuiltuptoyourmaximumcopperthickness.在實際生產(chǎn)中，若您使用的銅箔厚度超過102微米，請另外提供一組符合您最大銅厚的樣品。MULTILAYERCONSTRUCTION-Formultilayerboards,youmustusethesameconductorpatte

7、rnontheexternalandinternallayers.Positiontheunpiercedareasdirectlyovereachother.多層板結構一對于多層板，在內(nèi)外層上都必須使用相同的導線分布式樣。最大直徑區(qū)域應互相覆蓋。Werequiretheconstructiontoincludetwoormoreinternalconductorlayers.Oneoftheinternalconductorlayersmustbethemaximuminternalconductorthickness.Thesamplemustalsoincludetheminimumla

8、minate(core)andprepregthicknesstobeRecognizedforthePrintedWiringBoardType.我們要求的結構應包含兩層或兩層以上的內(nèi)部導線層。其中的一層必須符合最大內(nèi)層銅厚要求。樣品也必須包含申請認證的印刷線路板的基材最小厚度和半固化片最小厚度。Foradditionalinstructionsonmultilayersampleconstruction,refertoStandardUL796,Sections17and20.多層板樣品結構的其他說明，請參照標準UL796,第17節(jié)和第20節(jié)。Note-Theboardtotalbuild

9、-upthicknessshouldbeatthethicknessorwithintherangespecifiedinthesamplerequirements.注意-壓合后的最小厚度應符合樣品要求的最小厚度或在指定的厚度允許范圍內(nèi)。D-i有em的圓磐TeD-i有em的圓磐Te-e其他線ee圖形接觸。見注釋b。和多多條導線內(nèi)e沒有切）Sei見注釋a，e。tora.Figure10.1BDTestPatternBD測試樣品圖(o個IE-MaximumdiameterunpIercedcircularconductorspecifiedbyfabricator.Seenoteb.PCB生產(chǎn)商指

10、定的最大的圓形導體。見注釋b。PARTA:ATTACHMENTT1A-Minimumwidthconductorofconfigurationspecifiedbythefabricator.Seenotee.B1-(NotShown)oneormorepotentialconductorwidthsmaybeincludedbetweentheminimumF-Edgeconductorofaminimumwidthspecifiedbythefabricator.Shallbewithin0.4mm(0.015inch)G-Plated-throughholes.Atleast4plate

11、d-throughholesshallbepresentonthesamplea.Theplated-throughholesamplelocationisoptional,butshallnotcontactothercircuitpatternfeatures.Seenoteb.aOptional,butmustbeonsamplesifacceptanceofthistypeofconstructionisdesired.可選的，但是如果希望采用這種結構就必須在樣品上體現(xiàn)。bItemsE,G,H,andImaybeprovidedonseparatesamples.條款E,G,H和I可以

12、在不同的樣品中分別提供。cPlatedcontactsarerequiredonlyiftheplatingisdifferentfromtheconductor.只有當觸點鍍層不同于導體時，鍍金手指才要求提供。dTestPatternArtworkisavailablefromtheIPC-AssociationConnectingElectronicsIndustries,300LakesideDrive,Bannockburn,IL60015,Phone:847-615-7100,Fax:847-615-嚴嚴AProductionprinted-wiringboard.PWB的產(chǎn)品。BL

13、argestunpiercedconductorsection.最大導體區(qū)域。ELargestcirclethatfitsB(tobeacceptable,theareaisnottoexceedthatofcircleEinFigure10.1).適合B區(qū)域的最大圓(可以接受的，該區(qū)域不能超過在圖10.1中的圓E)。7105,ordernumberIPCA22.IPC-AssociationConnectingElectronicsIndustries,300LakesideDrive,Bannockburn,IL60015,電話：847-615-7100，傳真：847-615-7105,o

14、rdernumberIPCA22可以提供測試圖形的底片。eConductorpatternsarerequiredontheinternallayersofmultilayersamples.Internalconductorwidthsaretovaryasneededforthemetalweightsandthicknessemployedbutshallnotbenarrowerthantheexternalconductorwidth.對于多層板，內(nèi)層導線分布也有要求，內(nèi)層導線的寬度和厚度都可以變化，但是不能窄于外層導線的寬度。Figure10.2:Figure10.2:Maximu

15、munpiercedconductorareameasurement最大區(qū)域?qū)w的度量Figure10.3DelaminationTestPatternFigure10.3revisedFebruary26,20084iD$CFigure10.3DelaminationTestPatternFigure10.3revisedFebruary26,20084iD$CB一Maximumunpiercedcircularconductorspecifiedbyfabricator.PWB生產(chǎn)商指定的最大區(qū)域圓形導體。C一Distancefromedgeofcircularconductor(B)to

16、edgeofsampleshallbesufficienttoaccommodateplatedthroughholes(A).大圓邊緣與板邊的距離必須足夠容納pTh孔accommodateplatedthroughholes(A).大圓邊緣與板邊的距離必須足夠容納pTh孔可選的，但是如果這個型號采用這種結構就必須在樣品上體現(xiàn)。/*/*PartB章節(jié)BDOSAMPLES-Makecertaintheconductorpatternwhichyouusetobuildthesamplesreflectyourratingrequirements.Theseinclude:DO樣品一務必確定樣品的

17、導線分布反映您所要求的等級，包括：minimumcopperthickness最小銅厚maximumunpierceddiameter最大區(qū)域直徑minimumthicknessoflaminate基材最小厚度Wewillassignpatternlimitsbasedonactualmeasurementsofthetestsamples.我們將根據(jù)您所提供的測試樣品的實際尺寸來標定樣品規(guī)格界限。AttachmentT2,takenfromtheStandardforPrintedWiringBoards,UL796,Figure10.3,illustratesatypicaltestpat

18、tern.Thetestpatternshouldappearonbothsidesofthesamples,onesidebeingthemirrorimageoftheother.IfyoudesireRecognitionforsingle-sidedprintedwiringboardsonly,thetestpatternonlyneedappearononesideofthesamples.附件T2,取自印刷線路板標準一UL796,圖10.3，圖示為DO測試樣品式樣。若為雙面板，則雙面的布線式樣應互為鏡像。若為單面板，則僅有一面為此布線式樣。MULTILAYERCONSTRUCTI

19、ON-Formultilayerboards,youmustusethesameconductorpatternontheexternalandinternallayers.Positiontheunpiercedareasdirectlyovereachother.多層板結構一對于多層板，在內(nèi)外層上都必須使用相同的導線分布式樣。最大直徑區(qū)域應互相覆蓋。Werequiretheconstructiontoincludetwoormoreinternalconductorlayers.Oneoftheinternalconductorlayersmustbethemaximuminternalc

20、onductorthickness.Thesamplemustalsoincludetheminimumlaminate(core)andprepregthicknesstobeRecognizedforthePrintedWiringBoardType.我們要求的結構應包含兩層或兩層以上的內(nèi)層導線。其中的一層必須符合最大內(nèi)層銅厚。樣品也必須包含申請認證的印刷線路板的基板最小厚度和半固化片最小厚度。Foradditionalinstructionsonmultilayersampleconstruction,refertoStandardUL796,Sections17and20.多層板樣品結

21、構的其他說明，請參照標準UL796，第17節(jié)和第20節(jié)。Note-Theboardtotalbuild-upthicknessshouldbeatthethicknessorwithintherangespecifiedinthesamplerequirements.注意-壓合后的最小厚度應符合樣品要求的最小厚度或在指定的厚度允許范圍內(nèi)。PARTB:ATTACHMENTT2Figure10.3:DOTestPatternDO測試樣品圖Figure10.3DelaminationTestPatternFigure10.3DelaminationTestPatternFigure10.3revis

22、edFebruary26,2003A一Platedthroughholes.Atleast4plated-throughholesshallbepresentonthesample.*Theplated-throughholesamplelocationisoptional,butshallnotcontactothercircuitpatternfeatures至少4個鍍通孔，位置不限，但不能跟其他線路圖形接觸。:B?CIaccommodateplatedthroughholes(A).大圓邊緣與板邊的距離必須足夠容納pTh孔B一Maximumunpiercedcircularconduct

23、orspecifiedbyfabricator.PWB生產(chǎn)商指定的最大區(qū)域圓形導體。C一Distancefromedgeofcircularconductor(B)toedgeofsampleshallbesufficienttoG一Optional,butmustbeonsamplesifacceptanceofthistypeofconstructionisdesired.可選的，但是如果這個型號采用這種結構就必須在樣品上體現(xiàn)。PartC章節(jié)cFLSAMPLES-ConstructthesamplesintheminimumboardthicknesstobeRecognized.Prep

24、arethembysubjectingdouble-sidedlaminate(uniessyoualwaysusesingle-sidedlaminate)toallstepsofyourmanufacturingprocess.Removealloftheconductivematerialduringetching.Thereshouldbenoholesinthespecimens.SeeFigureA.NotethattheminimumthicknesscannotbelessthantheminimumRecognizedthicknessofthebaselaminate.Al

25、sonoteincertaininstances,ULassignsminimumthicknessesbasedonstandardtolerances.SeeAttachmentT3fortheminimumthicknessvalues.FL測試樣品一以要求認證的最小板厚來準備測試樣品。準備經(jīng)歷所有生產(chǎn)工藝的雙面板(除非您總是使用單面板)。用蝕刻方式除去所有導電材料。樣品應無洞。參見圖A。注意：樣品的最小厚度不能小于已被認證的基材的最小厚度。同時應注意，在特定情況下，UL可根據(jù)標準公差對最小厚度有一定范圍的容許量。參見T3最小厚度值。Cutthespecimensto1255mmlong

26、by13.00.5mmwide.Theedgesshouldnotbefrayed.Theradiusonthecornersshouldbe1.3mmorless.將樣品切割成長：125士5mm,寬：13.0士0.5mm。邊緣不應有磨損。不需倒角，角半徑不應超過1.3mm。MULTILAYERFLSPECIMENS-Etchallconductivematerialfromboththeinternalandtheexternalsurfaceswhenconstructingmultilayertestspecimens.多層板FL測試樣品用蝕刻方式除去所有內(nèi)外表面導電材料。PARTC:A

27、TTACHMENTT3ConstructionofSamplesforFLTestFL樣品結構ZT（d）(c)W（b）ZT（d）(c)W（b）請使用雙面的基材來制作樣品(除非你申請的是單面板)，樣品必須經(jīng)受所有的指定的工藝流程。用蝕刻方式除去所有導電材料。樣品上不允許有孔，樣品邊緣應沒有毛邊，破損。NotethattheminimumthicknesscannotbelessthantheminimumRecog-nizedthicknessofthebaselaminate.Alsonoteincertaininstances,ULassignsminimumthicknessesbased

28、onstandardtolerances.SeeattachmentT3fortheminimumthicknessvalues.注意：樣品的最小厚度不能小于已被認證的基材的最小厚度。同時應注意，在特定情況下，UL可根據(jù)標準公差對最小厚度有一定范圍的容許量。參見T3最小厚度值。Formultilayerspecimens,removeallconductivematerialfromboththeinternalandtheexternalsurfacesofthesamplesduringetching.對于多層樣品,制作時請用蝕刻方式除去所有內(nèi)外表面導電材料.NOTES:-Length:Samplesshouldmeasure125土5mm(5.0土0.2in.)inlength.樣品長：125士5mm(5.0土0.2in.).-Width:Samplesshouldmeasure13.0土0.5