Flipchip工藝流程演示文稿

Flipchip工藝流程演示文稿當(dāng)前1頁，總共33頁。優(yōu)選Flipchip工藝流程當(dāng)前2頁，總共33頁。1.Metalbump金屬凸塊-C4process(IBM)2.Tape-Automatedbonding捲帶接合-ACFprocess3.Anisotropicconductiveadhesives

異方向性導(dǎo)電膠-ACPprocess4.Polymerbump高分子凸塊-C4process5.Studbump.打線成球-ACPprocess(Matsushita)FlipChipconductivemethod-connecttoSubstrate/PCBC4:controlledcollapsechipconnectionACF:anisotropicconductivefilmACP(ACA):anisotropicconductiveAdhesivepasteKingbondTrainingCourse當(dāng)前3頁，總共33頁。KingbondTrainingCourseVariousflipchiptechnologiesPS:WIT(Wireinterconnecttechnology)TAB(Tape-automatedbonding)當(dāng)前4頁，總共33頁。KingbondTrainingCourseVariousflipchiptechnologies當(dāng)前5頁，總共33頁。KingbondTrainingCourseStudBumpFlipChipBondUnderfillCureovenCureovenSBBProcess當(dāng)前6頁，總共33頁。C4:ControlledCollapseChipConnectionProcessKingbondTrainingCourseReflowovenFlipchipbonderFluxcleanerUnderfilldispenserCureoven1.Fluxcoatingorre-printing2.MountingHeatingCleaningDispensingHeatingWaferbumpBumpbysolder當(dāng)前7頁，總共33頁。ACP:AnisotropicConductivePasteProcessReflowovenFlipchipbonderUnderfilldispenserCureovenThermosettingDispensingHeating1.PrinttheACA2.AlignmentWaferbumpBumpbyAgKingbondTrainingCourse當(dāng)前8頁，總共33頁。ACF:AnisotropicConductiveFilmProcessACFPre-setterFlipchipbonderPressandcureequipmentACFPre-setting1.Mounting2.Heating3.Press1.Heating2.PressWaferbumpBumpbyAuKingbondTrainingCourse當(dāng)前9頁，總共33頁。Overcoatwithpolymideandopenthebumpareas.PatternwettablebasemetalCoatchipwithpolymide,openviasovereachpadUseddry-filmlift-offprocesstodefinebasemetalandsolderoneachpadPatternaluminumtore-routeI/OtoonareaarrayConventionalchipwithaluminumI/OpadsaroundtheperimeterTack,Flux&ReflowPrint,Place&ReflowKingbondTrainingCourse當(dāng)前10頁，總共33頁。FCTBumpStructureSiliconwaferUBM-UnderBumpMetallurgySolderBumpFinalMetalPadDiePassivationWaferBumpKingbondTrainingCourse當(dāng)前11頁，總共33頁。1.蒸鍍Evaporation2.濺鍍Sputter3.電鍍Electroplating4.印刷Printedsolderpastebump5.錫球焊接SolderballbumpingorStudbumpbonding(SBB)6.無電鍍鎳ElectrolessnickeltechnologiesMetalbumpmethodUBMKingbondTrainingCourse當(dāng)前12頁，總共33頁。1.95Sn/5Pb,97Sn/3Pb高溫錫鉛合金2.63Sn/37Pb低溫錫鉛合金3.Ni鎳4.Au金5.Cu銅MaterialofsolderbumpKingbondTrainingCourse當(dāng)前13頁，總共33頁。SiliconWaferarriveswithanaluminumbasedfinalmetalpadanddiepassivation.Wafercanbeprobedpriortobumping.Waferbump(Printedmethod)Process:WafercleanKingbondTrainingCourse當(dāng)前14頁，總共33頁。TheUnderBumpMetallurgyisaddedbyFCTthroughsputteredlayersofAl,Ni-V,&CuWaferBump(Printedmethod)Process:SputterUBMAl/Ni/Cu(Au)KingbondTrainingCourse當(dāng)前15頁，總共33頁。UBMconsist3layer:1.Adhesionlayer:Ti,Cr,TiW提供鋁墊(Alpad)與護層(Passivationlayer)有較強之黏著性2.Wettinglayer:Ni,Cu,Mo,Pt高溫迴焊時錫球可完全沾附而成球3.Protectivelayer:Au保護Ni,Cu等免於被氧化.WaferBump(Evaporationmethod)Process:SputterUBMKingbondTrainingCourse當(dāng)前16頁，總共33頁。Applyphotoresist,PatternanddevelopWaferBump(Printedmethod)Process:Photo-resistKingbondTrainingCourse當(dāng)前17頁，總共33頁。EtchtoformUBMcapWaferBump(Printedmethod)Process:EtchUBMKingbondTrainingCourse當(dāng)前18頁，總共33頁。DepositsolderpasteandreflowtoformbumpWaferBump(Printedmethod)Process:Printsolderpaste&reflowSn/Pb63/37低溫95/5高溫KingbondTrainingCourse當(dāng)前19頁，總共33頁。Samplemeasurebumpheight,bumpshearandbumpresistance.WaferBump(Printedmethod)Process:InspectionKingbondTrainingCourse當(dāng)前20頁，總共33頁。1.Evaporativebumpsare125milsindiameterand100milshigh.2.Platedbumpsare125-175milsindiameterand25-100milshigh.Thetypicalsizeofabumpbeforereflow:KingbondTrainingCourse當(dāng)前21頁，總共33頁。製程名稱:晶片背面黏貼Wafermounting生產(chǎn)設(shè)備:晶片背面黏貼機檢驗設(shè)備:顯微鏡製程說明:將膠帶黏貼於晶片背面,避免晶片切割時分離.設(shè)備名稱:檢驗重點項目:1.晶片方向Dieorientation2.氣泡Airbubble3.表面皺紋Wrinkle製程圖例:?？蚓琄ingbondTrainingCourse當(dāng)前22頁，總共33頁。Process:InspectwaferKingbondTrainingCourse當(dāng)前23頁，總共33頁。晶片切割DieSaw生產(chǎn)設(shè)備:晶片切割機檢驗設(shè)備:顯微鏡製程說明:依據(jù)晶粒尺寸大小,利用切割刀具,將晶片切割成單顆的晶粒.1.切割道寬度Streetwidth2.崩裂Crack製程圖例:晶粒晶片設(shè)備名稱:檢驗重點項目:KingbondTrainingCourse當(dāng)前24頁，總共33頁。上晶片F(xiàn)lipChip生產(chǎn)設(shè)備:晶片上片機檢驗設(shè)備:X-RAY影像觀測機製程說明:依據(jù)晶粒尺寸大小,利用上晶片機將單顆的晶粒,分別植入基板或模組.1.Bump定位與焊接情形2.晶片崩裂Crack,有無短路,斷路製程圖例:設(shè)備名稱:檢驗重點項目:ChipBumpSubstrate/ModuleKingbondTrainingCourse當(dāng)前25頁，總共33頁。上晶片流程FlipChipflowPickupFlipPrecisionAddedFluxBonding/Reflow基板/模組C4processKingbondTrainingCourse當(dāng)前26頁，總共33頁。上晶片流程FlipChipflowPickupFlipPrecisionAddedfilm/pasteBondingwithheating基板/模組ACF&ACPKingbondTrainingCourse當(dāng)前27頁，總共33頁。填膠Under-fill設(shè)備名稱:生產(chǎn)設(shè)備:填膠機檢驗設(shè)備:X-RAY影像觀測機製程說明:利用填膠機將已完成植入基板或模組之每單顆的晶粒,分別以填膠注入.1.有無球脫或晶圓偏移製程圖例:檢驗重點項目:KingbondTrainingCourse當(dāng)前28頁，總共33頁。

WhydoyouneedtounderfillSolderjointreliabilityforflipchipsisbasedonseveralfactors:1.Bumpalloytype2.Solderjointheight(standoff)3.DistancetoneutralpointorDNP.(Ameasurementofthecenterofmassofthedietothefarthestbumponthedie,typicallythecornerbump.)KingbondTrainingCourse當(dāng)前29頁，總共33頁。填膠製程Under-fill1.毛細(xì)作用型Capillarytype):利用毛細(xì)力造成膠材之流動.2.異方向?qū)щ娔z(Anisotropicconductiveadhesive):低溫製程,分膏狀(paste)和膜狀(film)3.前置型(Pre-appliedtype):小尺寸晶片(<6mm),點膠(Dieattachment)後再迴焊(Reflow