制程控制審核表-先途電子

Area:ReworkandRepair(返工和維修),,,,,,,,,,,,,,,,,,

No.,AuditCriterion,,Actual,,,,,,,,,,,,,,,Remark

,,"關(guān)鍵

(Y)","請記""X""字

(如果適用)",0,25,50,75,100,,,,,,Applicable,Sum,Valid,Total,

1.基本維修能力,,,,,,,,,,,,,,,,,,

1.1,維修工位是否相關(guān)的維修SOP?(SMT/AI/HI/組裝)修理人員是否有效執(zhí)行?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.2,SMT/AI/HI/組裝工序中的補(bǔ)料是否有補(bǔ)料流程或SOP?修理人員是否有效執(zhí)行?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.3,維修SOP中輔料有否定義焊錫(錫線)、助焊劑、清潔劑的型號/廠家/適用的客戶嗎?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.4,有否明示說明不同部件的應(yīng)用溫度及烙鐵嘴的尺寸?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.5,維修工在更換無件之前，操作工有否用萬用表確認(rèn)其數(shù)值或確認(rèn)規(guī)格絲印?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.6,"SMT補(bǔ)件的板是否按正常修理板流程處理?

(查找BOM→找物料→更換或補(bǔ)件前測量數(shù)值→補(bǔ)件→作補(bǔ)件標(biāo)示和修理標(biāo)示→記錄維修報表→單獨(dú)區(qū)分→單獨(dú)送檢→單獨(dú)轉(zhuǎn)后工序跟蹤)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.7,SMT/HI維修SOP是否明確定義金手指元件被拆卸后是不可以再使用?證據(jù)?實(shí)際作業(yè)方式確認(rèn)?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.8,"SMT/HI維修SOP是否注明金手指元件/開關(guān)類元件假焊/連錫需補(bǔ)焊時,嚴(yán)禁使用熱風(fēng)槍,必須進(jìn)行烙鐵點(diǎn)焊?證據(jù)?實(shí)際作業(yè)方式確認(rèn)?",Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.9,SMT/HI維修SOP是否注明金手指元件的維修OK后的清洗方式?維修清洗如何避免液體的浸入?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.10,帶接地片IC（QFN)的維修：是否遵循定位--→接地加熱焊接--→烙鐵托焊原則?證據(jù)?實(shí)際作業(yè)方式確認(rèn)?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.11,"HI維修工將補(bǔ)件的板修理OK后,是否在手補(bǔ)的HI元件上打點(diǎn)作標(biāo)示?(便于檢查工位確認(rèn)HI補(bǔ)件的方向極性是否正確)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.12,"AI操作員是否在工作中發(fā)現(xiàn)拋料時需及時停機(jī),在漏料的位置做標(biāo)示,再繼續(xù)生產(chǎn),帶整塊板打完AI后,進(jìn)行補(bǔ)料?(適用于排序式AI)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.13,"AI拋料的板給維修工維修時,拋料的位置是否依據(jù)BOM進(jìn)行補(bǔ)料?",,,,,,,,0,0,0,0,0,0,0,1,0,

1.14,"AI維修工將補(bǔ)件的板修理OK后,是否在手補(bǔ)的AI元件上打點(diǎn)作標(biāo)示?(便于檢查工位確認(rèn)AI補(bǔ)件的方向極性是否正確)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.15,對于金手指（鍋?zhàn)衅┌存I板的維修，是否必須帶手指套作業(yè)，不可以帶手套作業(yè)?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.16,修理工是否接受過以上培訓(xùn)?證據(jù)?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.返工及維修管理,,,,,,,,,,,,,,,,,,

2.1,是否有返工流程文件?返工流程文件是否被審核批準(zhǔn)?（抽檢不良/客戶反饋等品質(zhì)異常返工）,,,,,,,,0,0,0,0,0,0,0,1,0,

2.2,電烙鐵溫度有否定期監(jiān)控?(漏電流及溫度點(diǎn)檢),,,,,,,,0,0,0,0,0,0,0,1,0,

2.3,所有維修使用的烙鐵/電批有否接地?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.4,維修區(qū)的物料是否有按客戶/供應(yīng)商管理?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.5,CHIP元件是否在料帶中保存?料帶外是否有物料編碼/規(guī)格型號?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.6,IC類物料的是否存放在ESD防護(hù)盒中和原料帶/料盤中?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.7,"IC的領(lǐng)用是否建立相關(guān)領(lǐng)用臺帳?不可以多領(lǐng)用,做備用.",,,,,,,,0,0,0,0,0,0,0,1,0,

2.8,"維修工使用的MSD元件必須在下班后退回到倉庫,由倉庫放入干燥箱中進(jìn)行保管.",,,,,,,,0,0,0,0,0,0,0,1,0,

2.9,"AI補(bǔ)料使用的物料需從編帶上拆散,放入相應(yīng)的有物料標(biāo)簽的料盒中?(防止應(yīng)物料盒太小,再次引腳變形拉伸,損壞元件)",,,,,,,,0,0,0,0,0,0,0,1,0,

2.10,是否有鑒別待維修的板及其維修OK待測試的板的分放?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.11,每個維修位是否都有適當(dāng)?shù)恼{(diào)試設(shè)備?如：萬用表，示波器等?調(diào)試設(shè)備是否有校驗(yàn)?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.12,維修工位是否有使用視覺教具，工具作識別數(shù)值，位置及極性部件。,,,,,,,,0,0,0,0,0,0,0,1,0,

2.13,是否有用到最新的缐路圖?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.14,維修品有序列號管理嗎?如維修報表/QC報表中有記錄不良品序列號(適合有序列號管理的組件),,,,,,,,0,0,0,0,0,0,0,1,0,

2.15,"在維修/不良分析工位,每件維修品被更換的元件是否清楚?都有被更換元件的記錄嗎?",,,,,,,,0,0,0,0,0,0,0,1,0,

2.16,"是否對維修品進(jìn)行全檢,是否對數(shù)量/維修標(biāo)示/工程更改狀態(tài)進(jìn)行確認(rèn)?",,,,,,,,0,0,0,0,0,0,0,1,0,

2.17,是否所有維修品都有維修“R”標(biāo)示及外箱有單獨(dú)的維修標(biāo)示?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.18,維修品是否有單獨(dú)區(qū)分送OQA檢驗(yàn)和出貨?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

2.19,"維修中發(fā)現(xiàn)同一原因不良超過3PCS,是否有預(yù)警反饋上級領(lǐng)導(dǎo)?是否有相關(guān)分析改善措施?證據(jù)?是否所有的維修人員都知