版權說明:本文檔由用戶提供并上傳,收益歸屬內容提供方,若內容存在侵權,請進行舉報或認領
文檔簡介
i.MXHWDesignGuide
andBoardBringUp
FAE:LindaLinConsolidatedbyi.MXFAE(Draftver0.2)Aug.6,2014Topics1.i.MX6HWDesignReferenceBoard.(gothroughschematicofi.MX6SDP)2.i.MX6HardwareDevelopmentGuide.(IMX6DQ6SDLHDG.pdf)3.i.MXHWCheckingList.(Excelfileofi.MX6HWDesignCheckingList)4.i.MX6XPowerdesign5.DDRCalibrationandStressTest.6.IOMuxTool7.i.MX6XHardwarebringupi.MX6HWDesignReferenceBoard.RelatedHardwarematerialsSABRESDP_DESIGNFILES.zip/SABRE_AI_DESIGNFILES.zip:SDP/AIboardschematic/layout.IMX6DQ6SDLHDG.pdf:i.MX6Xhardwaredesignguide,includeschematic/layoutcheckpoints,iomuxtools,bringup,IBIS/BSDL,RMIIinterface.IMX6DQ/DLS_A/I/CEC.pdf:i.MX6XDatasheet:includechipsetelectricalCharacteristicslikethevoltagerange,MaxcurrentandPowersequence.IMX6DQ/DLS_RM.pdf:i.MX6XChipsetreferencemanual.AN4509:i.MX6DQPowerConsumptionMeasurement.AN4576:i.MX6DLSPowerConsumptionMeasurement.IMX6_IOMUX_TOOL:iomuxconfigurationtools.Mfgtools-Rel-4.1.0_130816_MX6Q_UPDATER.tar.gz:MFGtools.L3.0.35_4.1.0_130816_images_MX6.tar.gz:linuxdemoimage.HWDesignCheckingListfori.Mx6Rev2.6.xlsx:i.MX6Xhardwarechecklist,downloadfrom:DDR_Stress_Tester_v1.0.3.zip:DDRtesttools,downloadfrom:i.Mx6DQSDLDDR3ScriptAid:DDRconfigurationtools,Downloadfrom:Freescalei.MX6DRAMPortApplicationGuide-DDR3
i.MX6ReferenceSolutionRelatedMaterialSelect“SABREPlatformforSmartDevices”HardwareMaterial(Schematic,PCB,Gerber.etc);SABREBoardforSmartDevices(SDB)i.MX6Quad1GhzCortex-A9ProcessorCanbeconfiguredasi.MX6DualFreescaleMMPF0100PMIC1GBDDR3memory(nonterminated)3”x7”8-layerPCBDisplayconnectors2xLVDSconnectorsConnectorfor24bit4.3”
800x480WVGAwith
4-wiretouchscreenHDMIConnectorAudioWolfsonAudioCodecMicrophoneandheadphonejacksExpansionConnectorCameraCSIportsignalsI2C,SSI,SPIsignalsConnectivity2xFull-sizeSD/MMCcardslot22-pinSATAconnector10/100/1000Ethernetport1xhigh-speedUSBOTGportmPCI-econnector
DebugJTAGconnectorSerialtoUSBconnectorAdditionalFeatures3-axisFreescaleacceleCompassPowersupplyNobatterychargerOSSupportLinuxandAndroidJBfromFreescale;Others:supportby3rdpartiesToolsSupportLauterbach,ARM(DS-5),Macraigordebug/IDEtoolchainPartNumbers: MCIMX6Q-SDB($399)Display(9.7”): MCIMX-LVDS1($499)Display(4.3”): MCIMX28LCD($199)SABREPlatformforSmartDevices(SDP)i.MX6Quad1GHzCortex-A9Processori.MX6DualLite1GHzCortex-A9ProcessorFreescaleMMPF0100PMIC1GBDDR3memory(nonterminated)3”x7”8-layerPCBDisplayconnectorsNative1024x768LVDSdisplay
(comeswithkit)2ndLVDSconnectorConnectorfor24bit4.3”
800x480WVGAwith
4-wiretouchscreenHDMIConnectorMIPIDSIconnectorAudioWolfsonAudioCodecMicrophoneandheadphonejacksDual1WSpeakersExpansionConnectorEnablesparallelLCDorHDMIoutputCameraCSIportsignalsI2C,SSI,SPIsignalsConnectivity2xFull-sizeSD/MMCcardslot22-pinSATAconnector10/100/1000Ethernetport1xhigh-speedUSBOTGportmPCI-econnector
DebugJTAGconnectorSerialtoUSBconnectorAdditionalFeatures3-axisFreescaleaccelGPSreceiverAmbientLightSensoreCompassDual5MPCamerasPowersupplyBatteryChargerBatteryconnectorsOSSupportLinuxandAndroidJBfromFreescale;Others:supportby3rdpartiesToolsSupportLauterbach,ARM(DS-5),Macraigordebug/IDEtoolchainPartNumbers: MCIMX6Q-SDP($999)
MCIMX6DL-SDP($999)Display(4.3”): MCIMX28LCD($199)WiFi: SilexWiFimoduleSABREPlatformforAutomotiveInfotainment(AI)PowerandMemoryFreescaleMMPF0100PMIC2GBDDR3memory(i.MX6Dual/Quad)1GBDDR3memory(i.MX6Solo)32GBParallelNORFlashNANDSocketDisplayLVDSconnectorcompatiblewithMCIMX-LVDS1ParallelRGBdisplayinterfaceHDMIoutput
connector
DebugJTAGconnectorDebugUARTconnectorConnectivityandExpansionSDCardSlotHighSpeedUSBOTGEthernetSATAMIPICSIPCIeMLB150INICconnector281-pinMXMcardedgeconnectorformainboardexpansionCanbereusedfromi.MX53SABREAIConnectivityandExpansionSDcardslot(WiFimoduleorSD)BluetoothorBluetooth+WiFiheaderAM/FMtunerheaderSiriusXMModuleheader(de-pop’’d)GPS(UART)moduleconnector2xCANDualHighSpeedUSBHostconnectorsMLB25/50INICconnectorSPINORflash
DisplayI/OLVDSconnectorcompatiblewithMCIMX-LVDS1AnalogVideoInputLVDSInputAudioCirrusmultichannelaudiocodecUpto8outputsDualmicrophoneinputsStereoLineLevelInputSPDIFreceiverOSSupportLinuxOthers:futuresupportby3rdpartiesCPUCardDetailsBaseBoardDetailsPartNumbersBaseBoard: MCIMXABASEV1($699)CPUCards: MCIMX6SAICPU1($799) MCIMX6QAICPU1($799)Display: MCIMX-LVDS1($499)i.MX6SMARTDEVICESYSTEMBlockDiagrami.MX6SMARTDEVICESYSTEMSchematic
Here,openi.MX6SabreSDSchematic,gothroughit.i.MX6HardwareDevelopmentGuide.Suggestion:Pre-design:Studythedatasheet,powerconsumption,schematictounderstandourchipsetrequirement.In-design:Checkthehardwaredesignguide,iomuxtoolsAfter-design:FilltheHWdesigncheckinglist,providetheiomuxdatatosoftware.Hardware-bringup:Checkthepower,powersequence,clock,reset,providethebootconfigurationtosoftware,runddrtest.Debugport:SuggesttohaveUSBOTGPort:Forimageprogram,YoucanuseitasUSBhostport,noproblem.MFGjustuseUSBdevicemode.Debugserialport,i.MX6Xubootcanchangetosupporteveryserialportasdebugport.Sdcardslot:SuggesttokeepatleastoneSdcardslot,itwillhelptousetheSdcardboot,whichcanburnimagedirectlyfromPCtoSdcard.NoneedtodebugtheMFGkernel.Jtag(optional).SuggesttousetheGPIOBoot_cfgbutnotthefuseBoot_cfg.Andbootmodepincanbepulled,becausewecanusethenon-imageboottoenterthedownloadmodei.MX6HardwareDevelopmentGuide
Here,open<<IMX6DQ6SDLHDG.pdf>>,gothroughit.1).DesignChecklist2).i.MX6SeriesLayoutRecommendations3).RequirementsforPowerManagement4).AvoidingBoardBring-upProblemsi.MXHWCheckingList.i.MXHWCheckingListHere,open<<HWDesignCheckingListfori.Mx6Rev2.6.xlsx>>,gothroughit.Clear1Isvoltagelevelmatchedonbus/signal/logic/buffertwoside?Clear2Suggestdrawingpull-upsnearpinareawithpowerdomaindescriptioninschematic.Clear3Pleasetakecareclocksourcecanmeetrequirementofperipheraldevices.(frequency/drivingcapability/jitter/tolorance/fly-timeetc.)Clear4WhenBuffer/Levelshifter/switchareused,SIimpactiononsignalshouldbeconsidered.Clear5ThecontrolsignalspolarityforDirectionSellect/EN/RESETshouldbecheckedforallthedevices.Clear6IOconfigurationshouldbecheckedusingIOMUXToolwhichprovidedbyFreescale.Clear7TheTESTandFAULTmodeinputsoftheindividualchipsshouldbetiedtotheproperlevelfornormaloperation.Clear8Pinsequence/direction/gendersofconnectorshouldbeconfirmedwithMechnicalconsideration.Clear9Pull-upsandvoltagesshouldbeverifiedforOC/ODsignals.Clear10Properpull-upandpull-downresistorvaluesprovidedtoavoidexcesssourcingorsinkingcurrent.Clear11Thepolaritiesofthecapsanddiodesconnectedto–vevoltagesshouldbeverified.Clear12Suggestallactivelowsignals--include“_B”atendofthesignalnetnameandallclocksignalsinclude“CLK”aspartofnetname.Clear13Pleaseconfirmifallpowersourcehavesufficientpowercapacityandgoodenoughripplenoiselevelforrequirementofpowerinput.Clear14Poweron/offsequencingshouldbeverifiedwhenmultiplepowersourcesareused.Clear15ThecurrentratingofDiodes/Inductorsusedinthepowersupplyandotherhighcurrentsectionsshouldbeprovidedproperly.Clear16PleasepayattentiononEMI/EMC/ESD/Ligteningconsideration(decouplingcaps/TVSdiodes/chokes/filters/beads/fueseetc).Clear17Pleaseconfirmifunusedpinsareconfiguredproperlyfollowingformalrecommend.Clear18Pleaseconfirmbootmodeandconfigurationpinsaresetproperlyandcanmeettheactualbootrequirment.Clear19Pleasetakecarewatchdog/cold/keyresetsystemdesign,PMICandbootdevicealsoshouldberesetatsametime.i.MX6XPowerdesigni.MX6PowerRelateddocIMX6DQCEC.pdf:i.MX6Dual/6QuadApplicationsProcessorsforConsumerProductsAN4509.pdf:i.MX6Dual/6QuadPowerConsumptionMeasurementIMX6SDLCEC.pdf:i.MX6Solo/6DualLiteApplicationsProcessorsforConsumerProductsAN4576.pdf:i.MX6DualLitePowerConsumptionMeasurementSDPschematic(PF0100):SPF-27392.pdfSaberliteschematic(DiscreteDCDC)(fromboundarydevices)IMX6DQ6SDLHDG.pdf(optional):DesignChecklist:Table2-6.PoweranddecouplerecommendationsPowerSupply,andCommonHardwareDesigni.MX6System-PowerDesignConsiderationsSystemPowerRequirements(oneachpowerrail)MaxCurrentrequirementVoltagerangeSystemOver-VoltageProtectionPowerOnSequencingSystemcontrolfunctionsLayout&decouplei.MX6PowerRailRequirementsToFunctionproperly,thei.MX6Processorrequiresninedifferentpowerrails(Somemaybecombined)VDDARMPowertoARMCoresAllowedvoltage:0.9V–1.5VVDDSOCVPPowertoonchipSystemPeripherals(VDDSOC_CAP):HDMIPHY,SATAPHY,PCIEPHY,&ARMCoreCachePowertoImageprocessingmodules(VDDPU_CAP)VPU,GPU2D,GPU3D,OpenVGAllowedvoltage:0.9V–1.5Vi.MX6PowerRailRequirements(con)VDDHIGHVPHPowertoonchipSystemPeripherals(VDDHIGH_CAP)MIPI,HDMI,SATA,PCIE,LVDS,USB,PLLsPowertomiscPeripherals(NVCC_PLL_OUT)USD,PLLs,24MHzOsc.SharedpowerofSNVSmoduleAllowedvoltage:2.7V–3.3VVSNVS32KHzOscillatorandSRTCfunctionsSharedpowerofSNVSmoduleAllowedvoltage:2.8V–3.3Vi.MX6PowerRailRequirements(con)USB_H1/OTG_VBUSPowertoUSBPHYAllowedvoltage:4.4V–5.25VNVCC_DRAMPowersupplyforDRAMmemoryAllowedvoltage:1.14V–1.575V(DependsontypeDRAM)EthernetIOpins(NVCC_RGMII)Allowedvoltage:1.14–1.9VGeneralIOpins(NVCC_)Typically1.8Vor3.3VAllowedvoltage:1.65V–3.6Vi.MX6PowerRailRequirements-SummaryInatypicalapplication,sixdifferentvoltagesarerequiredfortheprocessortofunction:FunctionTypicalVoltageVDDARM,VDDSOC1.375VVDDHIGH,VSNVS3.0VUSB_VBUS5.0VNVCC_DRAM1.5VNVCC_3.3V3.3VNVCC_1.8V1.8Vi.MX6PowerRequirements–VDDARM,VDDSOCDatasheetMaxRequirementsforVDDARM:3920mADatasheetMaxRequirementsforVDDSOC:1890mATypicalMaximumCurrentRequirements(AN4509):Showingthreeseparatevideooutputs1080pVideoplaybackHDMI1080pVideoplaybackIPUParallelport(LCD)3DgraphicsthroughLVDSportVDDARM:1625mAVDDSOC:1250mAi.MX6PowerRequirements–VDDHIGH,VSNVSDatasheetMaxRequirementsforVSNVS:300uAPullUpresistorsonVSNVSwilladdtocurrentrequirementsDatasheetMaxRequirementsforVDDHIGH:160mATypicalMaximumCurrentRequirements(AN4509):VDDHIGH:85mAi.MX6PowerRequirements–DRAM,IOPinsDatasheetMaxRequirementsforDRAM:1900mATypicalMaximumCurrentRequirements(AN4509):DRAM:1390mADatasheetrequirementsforIOPins,use:I(A)=NxCxVx(0.5xF)N–NumberofIOpinssuppliedC–Equivalentexternalcapacitiveload(Farads)V–IOvoltage(Volts)(0.5xF)–Datachangerate,whereF=Frequency(Hz)Typical=2-3mAfora3.3VpinSummaryPowerRequirementsPowerRailVoltageTypicalMaximumVDDARM1.375V1625mA3920mAVDDSOC1.375V1250mA1890mAVDDHIGH2.8V85mA160mAVSNVS3.0V-300uADRAM1.5V1390mA1900mAUSB5.0V500mA530mAI/OPins3.3V300mA500mA*I/OPins1.8V50mA275mA**MaximumvaluesaremutuallyexclusiveTypicalConsumerDevicePowerRequirementsFunctionVoltageTypicalMaximumSDCard3.3V100mAWIFI/BT3.3V1000mA3G/4GModem3.3V2000mA3000mALVDS3.3/5V300/370mAHDMI5V50mAEthernet3.3V130mAAudio1.8/5V40/100mA80/530mASATA5V500-1000mA1500mAeMMC3.3V100mA200mACAN5V70mAGPS1.5/3.3V20/100mACamera1.5/1.8V150/20mAGrandTotalPowerRequirementsVoltageTypicalFullPower1.375V1875mA5800mA1.5V1500mA2300mA1.8V100mA350mA3.0V160mA200mA3.3V2000mA5000mA5.0V1500mA3300mAi.MX6System-PowerDesignConsiderationsTotalSystemPowerRequirementsTypicalSystemrequirements(5Vsource):2.9ATypicalSystemrequirements(3.7Vsource):4.1ASystemOver-VoltageProtectionSelectPowercomponentswithhighvoltagetoleranceDesignOver-Voltageprotectionsub-systemUserbatterychargingcircuitwithprotection.PowerOnSequencingSystemcontrolfunctionsStand-by,reducedpoweroptionsi.MX6System-PowerOn/OffSequencingPowerOnSequencingVDD_SNVS_IN=<VDDHIGH_IN<anyotherpowersupply(FSLsuggestVDDHIGN_INpowerwithVDD_SNVS_INorinstep2)VDDARM_IN<=(VDDSOC_IN-1ms);Vvddarm_cap<=(Vvddsoc_cap+50mV):IfVDDARM_INandVDDSOC_INareconnectedtodifferentexternalsupplysourcesPowerOffSequencingN/ANotes:Needtoensurethatthereisnobackvoltage(leakage)fromanysupplyontheboardtowardsthe3.3Vsupply(forexample,fromtheexternalcomponentsthatuseboththe1.8Vand3.3Vsupplies)USB_OTG_VBUSandUSB_H1_VBUSarenotpartofthepowersupplysequenceandmaybepoweredatanytimeIMX6DQ6SDLHDG:Table2-6.PoweranddecouplerecommendationsVGEN5forVDDHIGH_INandincreaseto3VtoalignwithdatasheetOnlyone22μFbulkcapacitorshouldbeconnectedtoeachoftheseon-chipLDOregulatoroutputs:VDD_ARM/23/SOC/PU_CAPasnearaspossiblewithpins/vias.Thedistanceshouldbelessthan50milbetweenbulkcapandVDD_xx_CAPpins;ripplenoiseshouldbelessthan5%Vp-pofsupplyvoltageaveragevalueNVCC_LVDS2P5mustbepowered-onevenwhennotusingtheLVDSinterface becauseTheDDRpre-driverssharetheNVCC_LVDS2P5powerrailwiththeLVDSinterface33i.MX6Dual/Quad:5vINPUT+PFUSE100:SDP34i.MX6Dual/Quad:5vDiscretePowerDevelopTools
DDRStressTestDDRStressTestToolWhatisDDRStressTesterkit?Itisdownloadabletestapplicationarchitecture.AprogramrunningonPC(DDR_Stress_Tester.exe,whichrunningonCommandPromptwindow)willdownloadthetestimagetotargetboard’sIRAMwiththehelpofUART/USBconnection.ThetestimagewilldotheDDRstresstestandtheresultwillbesenttoPCthroughUART/USBandbeprintedontheCommandPromptwindow.Formx6dq,mx6dlsormx6sl,UARTisnotsupported.Supportmx53,mx51,mx6dq,mx6dlsandmx6sl.DDRStressTestToolcont.TestLog
LinkDevelopTools
IOMuxToolIOMUXToolApplicationWindowOverview
DownloadandInstalltheMicrosoft.NETFramework4.0SelectModulesandSignalsforBoardChecktheUARTS:UART1,UART2andUART3.ExpandallsignalsunderUART3.AccessingMuxed-SignalInfoAccessingMuxed-SignalInfoResolveConflictingSignalsSelectALT4–EIM_D30(J20)forUART3/CTS.SelectALT4–EIM_D31(H21)forUART3/RTS.SelectALT2–SD4_CLK(E16)forUART3/RXD_MUX.SelectALT2–SD4_CMD(B17)forUART3/TXD_MUX.AddingCommentsforClarityRight-clicktheUART2/TXD_MUXrowintheSignalstabtobringupthecontextmenu.Clickingonthemenuwillbringupatextentryfieldwheretheusermayentertext.AddingCommentsforClarityBallDiagramViewPads“Spreadsheet”ViewConfiguringIOMUXCRegistersSelectUART3/RXD_MUXintheleft-handpane.AlloftheIOMUXCRegistersassociatedwiththeAD4_CLK(E16)padareshownontheRegistersTabintheright-handpane.DragaSignaltoanotherModuleRenameSignaltoMatchSchematicsCAN1ModulewithAllSignalsCommentsauto-generatedtodenoteoriginalModule/Signal.CodeReflectsAddedSignalsBasicCodeStyleasaTooltip.GenerateConfigurationCodeSeveralCode-StylesavailableintheCodeMenu.ExamplesareshownintheUser’sGuide.Click“GenerateCode”tocreatethefilesforthecurrentdesign.Tryiti.MX6XHardwarebringupi.MX6XHardwarebringup:Doc&Tools.IMX6DQ6SDLHDG.pdf:Chapter8AvoidingBoardBring-upProblems.IMX6XRM.pdf:Chapter7SystemBoot,Chapter60:SystemResetController(SRC)MFGtools,DDRtesttools.USBline;有源可限流電源,萬用表,示波器i.MX6XHardwarebringup:Step1目視檢查檢查主要器件是否有錯貼的情況,比方說二極管,三極管,有沒有安裝位置反向或旋轉的問題??梢栽赑CBA時使用X光檢查,有條件的使用BSDL檢查來確認焊接與連線i.MX6XHardwarebringup:Step2
電源檢查使用萬用表,先空板檢查每個電源有沒有對地短路的情況。使用限流電源上電,檢查i.MX6X每路電源的電壓是否符合我們datasheet要求,量測電壓是要求在電源輸出端和i.MX6X電源輸入端(越近越好,如在濾波電容上量測)都量測一下,以防止IR跌落。VDD_ARM/SOC_IN供給i.MX6X內部邏輯電路,需要仔細檢查,VDD_SNVS_IN,NVCC_JTAG,NVCC_DRAM也對正常啟動很重要,NVCC_LVDS2V5也供給了DDRI/OPads,也必須要正常供給。i.MX6X在各路電源穩(wěn)定后,才能釋放reset(POR_B)。如前電源上電時序要求,檢查上電時序。i.MX6XHardwarebringup:Step3
時鐘檢查一般在電源電壓正確,無跌落,24Mhz和32K晶體會自動起振??墒褂檬静ㄆ髁繙y這兩個時鐘,如果24Mhz不工作,那么系統(tǒng)不能啟動,如果外部沒有32K,或32K不工作,那么i.MX6X會自動使用內部晶振,但根據newerrataIM6DQCERev.4,07/2014:ERR007926ROM:32kHzinternaloscillatortiminginaccuracymayaffectSD/MMC,NAND,andOneNANDboot,由于內部romcode的GPT使用這個時鐘,而GPT被用于外設訪問中一些event和timeout控制,所以不穩(wěn)定的時鐘有可能導致romcodes讀取外設失敗,所以建議連接外部32K.i.MX6XHardwarebringup:Step4準備bringup文檔一般硬件工程師需要準備三份文檔描述板級設計電源文檔:每一路電源的源,供給到?輸出,輸入電壓,測量點,時序。如SDPschematic:i.MX6XHardwarebringup:Step4準備bringup文檔IOMUX文檔:可以使用iomux工具導出,也可以手動準備,內容最好包括:以方便軟件工程師配置IOMUX,這個表應該至少包括所有數(shù)字管腳,軟件工程師根據這個表來配置iomux文件:arch\arm\mach-mx6\Board-mx6q_sabersd.hstaticiomux_v3_cfg_tmx6q_sabresd_pads[]={… /*UART1fordebug*/ MX6Q_PAD_CSI0_DAT10__UART1_TXD,//CSI0_DAT10為管腳名,UART1_TX會功能名。Notes:1i.MX6X根本所有的可做為GPIO的pin在reset狀態(tài)下都是iomux設為gpio,gpio設為輸入高阻,iopad設為100K上拉的.2i.MX6X的datasheet中也列出了一些例外:Formostofthesignals,thestateduringresetissameasthestateafterreset,However,therearefewsignalsforwhichthestateduringresetisdifferentfromthestateafterreset:EIM_A16~A25,EIM_DA0~DA15,EIM_EB1~EB3,EIM_LBA/RW/WAIT,GPIO_17/19,KEY_COL0,請注意有一些pin是用于bootgpio的.管腳名腳管序號網絡名IOMUX用于CSI0_DATA10M1UART1_TXALT3UART1_TXi.MX6XHardwarebringup:Step4準備bringup文檔Boot_Cfg文檔:說明Boot_cfg配置,以SDP的eMMCboot為例FuseSBMR1定義GPIO管腳默認值設置值默認值定義BOOT_CFG1[7:6]Bit7_6啟動設備接口EIM_DA7_6000101:BootfromUSDHCBOOT_CFG1[5]bit5SD/MMCSelEIM_DA5010:SD/eSD/SDXC;1:MMC/eMMCBOOT_CFG1[4]bit4FastBootSuppoEIM_DA4000:NormalBoot;1:FastBootBOOT_CFG1[3:2]bit3_2SD/MMC速度模式EIM_DA3_20000MMC:0x:HighSpeedMode;1x:NormalSpeedModeSD:0x:High/Normal;
10:SDR50;
11:SDR104BOOT_CFG1[1]bit1SDPowerCycleeMMCResetEIM_DA100MMC:0:eMMCresetdisabled.1:eMMCresetenabledviaSD_RSTpad(onUSDHC3/4)SD:0:Nopowercycle1:PowercycleenabledvisSD_RSTpad(onUSDHC3/4)BOOT_CFG1[0]bit0SDLoopbackClockSourceSel(SDR50/104only)EIM_DA0000:throughSDpad1:directBOOT_CFG2[7:5]bit15_13BusWidth/SDCalibrationStepEIM_DA15~13000010SD:BusWidth:xx0:1bit;xx1:4bit.SDCalibrationStep:00x~11x:1~3delaycellsMMC000~010:1,4,8bit.101~110:4,8bitDDR(MMC4.4)i.MX6XHardwarebringup:Step4準備bringup文檔SDP的BootSelect為:所以eMMC啟動的SBMR1=0Xxxx5860FuseSBMR1定義GPIO管腳默認值設置值默認值定義BOOT_CFG2[4:3]Bit12_11啟動設備接口EIM_DA12_11001100~11:USDHC1~4BOOT_CFG2[2]Bit10DLLOverride(eMMC)EIM_DA10000:BootROMdefault;1:ApplyvalueperfuseMMC_DLL_DLY[6:0]BOOT_CFG2[1]Bit9BootACKdisable/PulldownDuringPowerCycleEnableEIM_DA900MMC:0:BootACKEnabled;1:BootACKDisabled.SD:0:UsethedefaultSDpadsettingsduringpowercycle.1:SetPulldownonSDpadsduringpowercycleBOOT_CFG2[0]bit
溫馨提示
- 1. 本站所有資源如無特殊說明,都需要本地電腦安裝OFFICE2007和PDF閱讀器。圖紙軟件為CAD,CAXA,PROE,UG,SolidWorks等.壓縮文件請下載最新的WinRAR軟件解壓。
- 2. 本站的文檔不包含任何第三方提供的附件圖紙等,如果需要附件,請聯(lián)系上傳者。文件的所有權益歸上傳用戶所有。
- 3. 本站RAR壓縮包中若帶圖紙,網頁內容里面會有圖紙預覽,若沒有圖紙預覽就沒有圖紙。
- 4. 未經權益所有人同意不得將文件中的內容挪作商業(yè)或盈利用途。
- 5. 人人文庫網僅提供信息存儲空間,僅對用戶上傳內容的表現(xiàn)方式做保護處理,對用戶上傳分享的文檔內容本身不做任何修改或編輯,并不能對任何下載內容負責。
- 6. 下載文件中如有侵權或不適當內容,請與我們聯(lián)系,我們立即糾正。
- 7. 本站不保證下載資源的準確性、安全性和完整性, 同時也不承擔用戶因使用這些下載資源對自己和他人造成任何形式的傷害或損失。
最新文檔
- 2025年營養(yǎng)、保健食品項目申請報告模稿
- 建筑工程標準與法規(guī)
- 建筑工程施工進度控制
- 2025小型建筑工程施工合同范本
- 建筑工程創(chuàng)新技術與發(fā)展趨勢
- 培訓對個人自信心的提升
- 第二學期小學德育工作計劃
- 我的新學期學習計劃(15篇)
- 音樂律動與小學舞蹈課的結合探討
- 教育政策執(zhí)行中的內部審計實踐
- SB-T 11238-2023 報廢電動汽車回收拆解技術要求
- 旅游公司發(fā)展規(guī)劃
- 新舊施工現(xiàn)場臨時用電安全技術規(guī)范對照表
- 03軸流式壓氣機b特性
- 五星級酒店收入測算f
- 某省博物館十大展陳評選項目申報書
- GB/T 9109.5-2017石油和液體石油產品動態(tài)計量第5部分:油量計算
- GB/T 16316-1996電氣安裝用導管配件的技術要求第1部分:通用要求
- GA/T 455-2021居民身份證印刷要求
- 邀請函模板完整
- 建設工程施工合同糾紛涉及的法律適用問題課件
評論
0/150
提交評論