8D報(bào)告-8D-Report案例1-開(kāi)路8D

18Dreport-OpenAnalysisReportVersion1PreparedBy:JackCheckedBy:AnnApprovedBy:MikeDate:YYMMDD21.TeamTeammemberDepartmentNameTitlePhoneNo.E_mailTeamleaderQAMichaelDirector123456XXX&XXX.COMMemberCSJackManager123456XXX&XXX.COMMemberQAAllenManager123456XXX&XXX.COMMemberMFGMikeManager123456XXX&XXX.COMMemberEngineeringJohnManager123456XXX&XXX.COMMemberMaintenanceStanleyManager123456XXX&XXX.COM3CustomerXXXXCustomerP/NPN123ABCP/NPN12343253WhenYYMMDDWhereSMTWhatOpenD/C143101Quantity2pcsLotcode32B2.DefectDescription4PCSareopeninsamelocation;PatternsinwholePCBexistsnick.NGOKNGOK43.1ContaminationList3.ContainmentActionItemQTY(PCS)DepositionMethodEffectivenessResultProduction(CDA)PCB1,103HoldMicroscope/X-Ray100%0/1,103PCBA1,028HoldMicroscope/X-Ray100%0/1,028ECU1,399HoldX-Ray100%17/1,399Warehouse(CDA)PCB0HoldNA100%0IntransitPCB1,329(143102DC)HoldNo

suspect

lot100%0/1,329ABCPCB1,634(143103DC)Hold40X

Magnifiercheck100%0/1,643WIP3,358Hold1.Quality

alert

:

ScrapallPCBinmachinewhenPCBjamoccurredinimmersionsilvermachine.2.Tighten

Inspection

:

Add

open

as

inspection

item

in

immersion

silver3.History

check：32B

lot

exist

PCB

jam

in

immersion

silver

(8/10)100%Temporaryinstruction5ExistsOpenNoopen3.ContainmentAction3.2PCB/PCBASortingMethod40XNGOK【Summary】Use40XmagnifiercanfindPCB/PCBApatternopenPickoutopenandoveretchedproducts.63.ContainmentAction3.3FinishedGoodsSortingMethodPictureafterX-rayPutproductsinmachineX-Ray

Instrument一操作NGOK圖片OK【Summary】UseX-Raycanpickoutopen/thinnerpatternproducts7OKNG（pcs1）4.DefectAnalysis4.1ResistanceMeasurement【Summary】PCS1Resistanceisinfinity,Open0.1Ω0F:Infinity8【Summary】PCS2Resistanceisinfinity,OpenNG（pcs2）4.DefectAnalysis4.1ResistanceMeasurement0F:Infinity9【Summary】Checkthenetwork,theopenoccurredononeline.4.DefectAnalysis4.2NetworkAnalysis10【Summary】PCS1:CutthemiddleofAandB,andmeasuretheresistance.OpenoccurredbetweenB-C.PCS2isthesame.4.DefectAnalysis4.3NetworkCheck11【Summary】PCS1:Noanyobviousabnormalitywasfound.4.DefectAnalysis4.3Appearancecheck(PCS1)12【Summary】PCS2:Wedon'tfindanyobviousabnormalitybecausetherearesoldmaskonthesurface.4.DefectAnalysis4.3Appearancecheck(PCS2)13【Summary】NGSampleisopenatmarkedarea.PCS1-NGSample35x200x400xOKSampleOnepatternopen,otherpatternsarealsoappearoveretchedDefectsontheboundaryofsoldermaskandcopper4.DefectAnalysis4.3Strippingtintocheck1435x200x400xPCS2-NGSampleOKSampleOnepatternopen,otherpatternsarealsoappearoveretchedDefectsontheboundaryofsoldermaskandcopper【Summary】NGSampleisopenatmarkedarea.4.DefectAnalysis4.4Strippingtintocheck157【Summary】AfterremoveSM,wefoundthetracewasopen35x200x35x100x200xPCS1-NGSample100xPCS2-NGSampleOKSampleOpenOnepatternopenOtherpatternsalsooveretched;4.Defectanalysis4.4RemoveSolderMask164.Defectanalysis4.5.Otherlocationscheck【Summary】Checkotherlocations,wefoundthetracewasalsolightlyetched.Patternsclosetosoldermaskisoveretched;Pad,patternsfarawayfromsoldermaskisnormalThedefectsappearwholePCBBasedonabovephenomenon,itisGalvanicEffect.17RoutingETImmersionsilverFQCPacking4.Defectanalysis4.6FailureMechanismSolderMaskRinsePre-dipImmersionsilverRinseDryer……SolderMaskCuAg【Summary】CuontheboundaryofsoldermaskwillreplacedbyAg,Auwillreplacedmoreandmorewithtimeincreasing18【Summary】PCBstackedindryer,releasedPCBafterconfirmquality.4.Defectanalysis4.7ImmersionsilverBoardjamrecordcheckPaperrecord:showsthePCBjaminformation,includedate,Partnumber,quantity,tec.,information.Videoevidenceisbetter.PCBJamrecord194.Defectanalysis4.8InvestigationofPCBJam【Summary】partofUShapebasesupportdamaged,causeairknifefellandPCBcannotpassthrough.UShapebasesupportdamagedDryerAirknife204.Defectanalysis4.9SchematicdiagramofPCBJamAirknifeUShapebasesupportDamagedAirknifefell,PCBcannotAirknifefell,PCBcannotOKNG【Summary】partofUShapebasesupportdamaged,causeairknifefellandPCBcannotpassthrough.214.Root

CauseAnalysis4.10SimulationTestAirknifeUShapebasesupportDamagedAirknifefell,PCBcannotpassOKNG【Summary】Testresultshow600secfoundopendefect.Testcondition：1.UShapebasedamage,airknifefell2.3arrayPCB(226666-2)3.Speed:1.1

m/minDOETestTest1Test2Test3Test4Test5Test6Test7Test8Test9Test10Time（Sec)90130170210255300340480540600OpenJudgeNoNoNoNoNoNoNoNoNoYesNormalPCB224.Defectanalysis4.11Escapeanalysis(FQC）Defectoccurredinimmersionsilverprocess,itisafterE-Check,soitisnotescapeofE-check;【Summary】AVIcannotdetect,3Xmagnifieralsocannotdetect,soit’snotescapeofFQC.RoutingE-CheckImmersionsilverFQCPackingSolderMaskVRSVisualInspectionAVIAVIdidn’tdetectopeninthisareaYellowmarkislocationneedverify23ProcessOccur/DetectionRootcausevalidationmethodResultContributionAttachmentOut-layerOccurAOIResultverification,confirmnosimilardefectNo0%AOIrecordSolderMaskOccurSelf/firstarticleinspectionrecord,confirmnosimilardefectNo0%SelfarticleinspectionrecordCNCRouteOccurNoetchingprocesscauseNo0%E-CheckDetectionNoetchingprocesscauseNo0%ImmersionsilverOccurPCBJamoccurredYes100%PCBJamrecordFQCDetectionAVI

can

not

detect

due

to

open

under

solder

mask.Yes100%AVIsimulationtestrecordSolderMaskCuAg1.

Why

open?2.

Why

not

all

patterns

open?4.Defectanalysis4.12Processreviewoccurcause244.Defectanalysis4.13Escapeanalysis(Immersionsilver)MethodofhowtodealwithPCBjam(SOPNO.:……)Immersionsilvertank【Summary】PCBjammedindryprocess,whentheytakeoutjammedPCBindryprocess,otherPCBcansmoothlypassthrough,productsinimmersiontankandtankdidn’thandledwell,causedefectsoccurred.AbnormalityRootcauseJudgmentSolvemethodPCBJam………FellPCB………254.RootCauseAnalysisOccurrenceItemWhy1Why2Why3Why4Why5Open

HappenPCBtracewasbeingetchedbyimmersionsilverchemicalPCBwasblockedinimmersionsilvertankU

shape

base

broken

cause

air

knife

fell,

boardjamindrysectionUShapeagingandexistcrack,itisnotinthemaintenanceitemDidn’trecognizeriskofPCBjam.4.145Whyanalysis26ItemWhy1Why2Why3Why4Why5Why

didn’tdetectPCBjamintimeNoPCBjamalarmsensorinimmersionsilversectionDidn’trequestthiswhenbuymachineGeneralruleofmachinedidn’tlistalarmforkeysectionDidn’trecognizeriskofPCBjamWhyescapeafterfindPCBjamAbnormaltreatmentproceduredidn’tdefineclearlyDidn’trecognizeriskofPCBjamWhyE-CheckcannotcoveropenOpenhappenedafterE-Check.

Non-detection4.RootCauseAnalysis4.145Whyanalysis27SystemItemWhy1Why2Why3Why4Why5WhysystemcannotcoverPCBjam?Didn’tlockabnormallotinsystemDidn’trecognizeriskofPCBjam4.RootCauseAnalysis4.145Whyanalysis28入料清潔水洗1水洗2微蝕檢視預(yù)浸化銀熱水洗1水洗3后清潔水洗4熱水洗2冷風(fēng)吹熱風(fēng)吹風(fēng)扇吹出料0.55M1.80M1.05M1.80M1.35M0.55M1.00M1.80M0.77M1.05M2.28M1.05M0.77M0.70M1.28M0.88M0.88M1rowJam:PCBinChemistryarea:Chemistryarealength/PCBLength

1.48/0.214=6.9ShippingPanel;MaxPCS=7*4=28PCS

ItemPCSSorting+Process

ScrapSorting17CDAScrap7Total24MaxSuspectQty28MaxEscapeQty4

ItemPCSRemarkSorting+Process

ScrapSorting17CDAScrap7ABCscrapcausebyPCBjam4CannotconfirmPCBinimmersionsilvertankornotTotal28MaxSuspectQty28MaxEscapeQty0【Summary】：Escapequantity0~4PCS.4.RootCauseAnalysis4.145Whyanalysis29PCBinChemistryarea:Chemistryarealength/PCBLength1.48/0.214=6.9ShippingPanel;MaxPCS=7*4=28PCS

ItemPCSSorting+Process

ScrapSorting17CDAScrap7Total24MaxSuspectQty28MaxEscapeQty4

ItemPCSRemarkSorting+Process

ScrapSorting17CDAScrap7ABCscrapcausebyPCBjam4CannotconfirmPCBinimmersionsilvertankornotTotal28MaxSuspectQty28MaxEscapeQty0【Summary】：Escapequantity0~4PCS.Loader0.55mRinse2.85mEtch2.85mRinse1.35mInspection0.55mPre-dip1mImmersionsilver1.8mRinse5.9mRinse5.9mDryer2.86mUnloader0.88mChemistryarea1.48m12345670.214M4.RootCauseAnalysis4.145Whyanalysis305.CorrectiveActions5.1PreventHappenImprovementBeforeAfterBreakpoint:XXXXReplaceokUshapebasesupportInvestigationallprocessPCBjamandstudyimprovementmethodECD:XXXX315.CorrectiveActionsBeforeAfterHavedifferentmethodtohandlePCBdependonPCBinwhichtankScrapPCBinwholemachinewhenjammed5.2EscapeimprovementBreakpoint:XXXXX325.CorrectiveActions5.3EscapeimprovementtrainingrecordTrainingrecord335.CorrectiveActionsHappen：1.

Review

and

revise

FMEA.

(

Engineering)2.Define

life

of

U

Shape

base.

(Maintenance)3.Add

U

Shape

base

into

check

list.

(Maintenance)4.AddPCBJamalarmsysteminimmersionsilverEscape：1.AddPCBjamalarmsystemforkeysectionintoGeneralruleofbuymachine：SOP

NO.

:……(Maintenance)2.Reviseinspectionitemofimmersionsilver3.DefinescrapallPCBinmachinewhenPCBJam.

System：1.ReviseabnormaltreatmentflowofPCBjam(QClockdefectlotinsystem,Supervisorunlockafterconfirm)ECD

:XXXECD

:XXXACD

:

XXXACD

:

XXXACD

:

XXXACD

:

XXXXACD

:

XXXXECD

:

XXXSOP&FMEAUshapebaseinspectioncriteria346.Effectiveness1.UShapebasenodefe