SMT錫膏印刷培訓(xùn)

Design.Build.Ship.Service.錫膏印刷培訓(xùn)DocumentTitle:LeanHandBookDocumentNo:GBE-KPO-2-033-00Doc.Revision :02DocumentDate:March26,2008BusinessExcellence2025/6/12TechnologyScreenprinter/絲網(wǎng)印刷機(jī)SolderPastePrinting絲網(wǎng)印刷絲印機(jī)Chip貼片機(jī)多功能貼片機(jī)多功能貼片機(jī)Chip貼片機(jī)回流爐2025/6/13TechnologyDescribingtheStencilPrintingProcess

絲網(wǎng)印刷工藝概述2025/6/14Technology15mmminDia.Paste/最小直徑15mm的錫膏體Zero‘PrintGap’零印刷間隙Metalsheet/金屬平板Openaperture/開孔BasicStencilPrintingProcess/基本絲網(wǎng)印刷工藝2025/6/15TechnologyControlled‘PrintSpeed’控制印刷速度Even‘SqueegeePressure’以及刮刀壓力BasicStencilPrintingProcess,cont./基本絲網(wǎng)印刷工藝（續(xù)）PasteRolling錫膏滾動(dòng)2025/6/16TechnologyBoardisloweredundercontrolled‘SeparationSpeed’在“分離速度”控制下，板被分離下來(lái)BasicStencilPrintingProcess,cont./基本絲網(wǎng)印刷工藝（續(xù)）01-Jun-257TechnologySTENCIL鋼網(wǎng)01-Jun-258TechnologyEffectofstencil絲網(wǎng)的影響效果Withagoodstencil優(yōu)良的絲網(wǎng)Excellentresults極好的結(jié)果Fewfailures很少的故障Predictableyields可預(yù)知的合格率Withabadstencil不良的絲網(wǎng)Lotsofstencilwiping需要大量的擦拭Lotsofbridgesandinsufficientdisposition產(chǎn)生許多的橋連和少錫StencilDesignGuideline:IPC7525絲網(wǎng)設(shè)計(jì)指導(dǎo)文件：IPC752501-Jun-259TechnologyStencilsConsiderations絲網(wǎng)的關(guān)鍵因素StencilThickness絲網(wǎng)的厚度StencilMaterial絲網(wǎng)的材質(zhì)Steppedoruniformedthicknessstencil階梯式的或者同一厚度的絲網(wǎng)StencilMaterialCoefficientofFriction絲網(wǎng)材質(zhì)的摩擦系數(shù)StencilSurfaceRoughness絲網(wǎng)的表面粗糙度StencilHardness/TensileStrength絲網(wǎng)的硬度、抗拉強(qiáng)度FramingTension邊框的張力MountingMaterial原料的裝配PartialorFull部分的和全部的ApertureSize孔徑尺寸ApertureShape&Wall開口外形和內(nèi)側(cè)的形狀A(yù)pertureArrangement開口排列ApertureAspectRatio開口的縱橫比例AreaRatio面積比ApertureTolerance開口大小的公差A(yù)pertureGasketing開口的涂層ApertureLocationTolerance開口的位置公差ThicknessTolerance厚度公差01-Jun-2510TechnologyStencilType絲網(wǎng)的類型FullStencil全平面絲網(wǎng)PartialStencil(stencilwithmeshborder)

局部的絲網(wǎng)Polyestermesh(tension22-30Newtonspersquarecm)聚酯型網(wǎng)孔（表面張力在22-30N/cm2之間)Stainlesssteelmesh(tension30-40Newtonpersquarecm)

不銹鋼網(wǎng)孔（表面張力在30-40N/cm2之間）Framelessstencil無(wú)框的絲網(wǎng)MicroMountfromDEKDEK公司的微小貼裝絲網(wǎng)TECFOILfromTECFOILTECFOIL公司的TECFOIL技術(shù)SMartframefromSMTSMT小巧的外框01-Jun-2511TechnologyStencilFabricationMethods絲網(wǎng)的制作方法Chemicaletch化學(xué)腐蝕Singlesideetch單個(gè)側(cè)面腐蝕Dualsideetch雙行側(cè)面腐蝕Etchandelectro-polish蝕刻和電拋光Lasercut激光切割Straightlaser直接光刻Laserandpolish光刻并拋光Electroform電鑄成型

Stencilsaremanufacturedbythreemainmethods:制造絲網(wǎng)的主要三種方法01-Jun-2512TechnologyWallcharacteristic

ChemicalEtch化學(xué)腐蝕孔內(nèi)壁的特性01-Jun-2513TechnologyCleaningofstencilWheneverprintingiscompleted,CleanthestencilwithlowlintpapersoakedinIPA.任何時(shí)候,只要印刷結(jié)束，就要用浸有IPA的無(wú)塵紙擦凈絲網(wǎng)．Usebrushtoclearpasteinstencilapertureifnecessary.如果需要，用刷子清理絲網(wǎng)開孔．01-Jun-2514TechnologyStencilHandling絲網(wǎng)的使用Handlethestencilwithextremecare.Anydents,crackordamageswillresultinpoorprintquality.移動(dòng)絲網(wǎng)時(shí)，要萬(wàn)分小心．任何破邊，破碎，或損壞都將導(dǎo)致糟糕的印刷質(zhì)量．Alwaysholdthestencilbythealuminumframeanddonotdropanyobjectonthestencilorfoil.保持絲網(wǎng)在鋁框中永遠(yuǎn)處于繃緊狀態(tài)，并且嚴(yán)禁把東西放在絲網(wǎng)上．Donotsetstencildownonsurfacethatwilldamagethefoilsurface.不要把絲網(wǎng)底部平放其它物體上，那樣會(huì)損壞金屬的表面．2025/6/115TechnologyThePerfectPrint/完美的印刷Cleanedges/清潔的邊緣Flatontop/頂部平坦Height=StencilThickness高度=鋼網(wǎng)厚度GoodAlignment/很好地對(duì)位NoFluxBleed...無(wú)助焊劑溢出2025/6/116TechnologyPastePrintDefect:Bridging/錫膏印刷缺陷：橋聯(lián)2025/6/117TechnologyPastePrintDefect:ExcessPrintHeight/錫膏印刷缺陷：高度偏高2025/6/118TechnologyPastePrintDefect:Scooping/錫膏印刷缺陷：塌陷2025/6/119TechnologyIncompletePrint/不完全印刷（少錫）2025/6/120TechnologyPastePrintDefect:Misalignment/錫膏印刷缺陷：偏位2025/6/121TechnologyTailing/錫膏拉尖Acceptable/可接受(Soldersmearorslump<10%)錫量減少<10%Reject/拒收(Soldersmearorslump>10%)錫量減少>10%SolderPastePrintQuality/錫膏印刷質(zhì)量2025/6/122TechnologyPasteClogging錫膏堵塞Acceptable/可接受(pastedeposit>90%)焊盤錫量超過(guò)90%Reject/拒收(pastedeposit<90%)焊盤錫量超過(guò)90%SolderPastePrintQuality/錫膏印刷質(zhì)量2025/6/123TechnologySmearingandSlumping/錫膏塌陷Acceptable/可接受(Soldersmearorslump<10%)塌陷小于10%Reject/拒收(Soldersmearorslump>10%)塌陷大于10%SolderPastePrintQuality2025/6/124TechnologyMajorcontributortodefects/缺陷的主要分布Source:MPM’sAuser’sguidetomorePreciseSMTprinting2025/6/125TechnologyHardware/硬件Software/軟件Environment/環(huán)境Squeegees/刮刀PrintSpeed/印刷速度Temperature/溫度Paste/錫膏Humidity/濕度Stencil/鋼網(wǎng)Pressure/壓力Tooling/surportpinPrintGap/印刷間隙Board/印刷線路板SeparationSpeed/分離速度FactorsAffectingthePrint/影響印刷的因素2025/6/126TechnologySqueegee/刮刀2025/6/127TechnologySqueegeeType/刮刀類型Diamondedge Trailingedge ‘D’cut2025/6/128TechnologySqueegeeMaterial/刮刀材料Polyurethane/聚亞安酯Composite/合成物2partpolyurethaneEpoxy/環(huán)氧樹脂Metal/金屬PlainSteel/平鋼P(yáng)olished/被拋光RolledLubricatedsurfaceTeflonPermalex2025/6/129TechnologySqueegee/刮刀Hardness/硬度:30to90durometer(ShoreA)with60to90durometermostused,metal.AttackAngle/接觸角度:45to75degreesPressure/壓力Parallelism/平行度2025/6/130TechnologyScanpicofrubberandmetalsqueegee,paste,cyberoptics橡膠和金屬刮刀，錫膏，影像Scavenging2025/6/131TechnologyPrintParameters/印刷參數(shù)PrintSpeed/印刷速度SqueegeePressure/刮刀壓力SeparationSpeed/分離速度PrintGap/印刷間隙UnderScreenCleanRate/鋼網(wǎng)底板清洗頻率PasteDispense/加錫膏Environment/環(huán)境2025/6/132TechnologyTriangulationmeth