封裝工藝介紹PPT課件

Packageprocessintroduction,Presenter:GanJunLuo2019/08/15,Page2,PurposeandOutline,Purpose:SharepackageprocessintroductionOutline:ThepurposeofchippackagingProcessflow,Page3,Thepurposeofchippackaging,Thepurposeofchippackaging:TheICdiesonthewaferareseparatedfordieattach,connectexternalpinsbywirebonding,thendomoldingtoprotectelectronicpackagingdevicesfromenvironmentalpollution(moisture,temperature,pollutants,etc.);protectthechipfrommechanicalimpact;providestructuralsupport;provideelectricalinsulationsupport.ItiseasilyconnectedtothePCBboard.,Page4,Processflow,WaferSaw,DieAttach,WaferMount,WaferGrinding,EpoxyCure,Pre-Moldingplasma,PostMoldCure,Plating,Trim/Form,Test,De-junk,LaserMarking,Before,After,LaserMarking,Pre-WBplasma,WireBond,FOL(FrontofLine),EOL(EndofLine),Molding,De-flash,Packing,Page5,WaferGrinding,Purpose:Makethewafertosuitablethicknessforthepackage,Page6,WaferMount,Purpose:CombinethewaferwithDicingtapeontotheframefordiesawing,Page7,WaferSaw,Purpose:Makethewafertounitcanpickupbydiebonder,Page8,WaferSaw,ProcessdifferencebetweenBDandSD:SDBG:,Refertohttp:/www.disco.co.jp/cn_s,Page9,WaferSaw,QualityControl,切偏,正崩,劃片寬度量測(cè),Page10,DieAttach,Purpose:Pickupthedieandattachitontheleadframebyepoxy,Pickuptool:247X479mil,Collect,Needle,Page11,DieAttach,DieattachmethodEutectic,Epoxy,softsolder,DAF,Page12,DieAttach,粘著劑的工藝流程,Page13,DieAttach,QualityControl,DieShear,EpoxyThickness2Hrs,LaserMarking,LaserMarking,load,unload,unload,Platingline,電鍍兩種類(lèi)型：PbFree：無(wú)鉛電鍍，錫（Tin）的純度99.95%,符合Rohs的要求；Tin-Lead：鉛錫合金。Tin占85%，Lead占15%，由于不符合Rohs，目前基本被淘汰。,晶須（Whisker），是指錫在長(zhǎng)時(shí)間的潮濕環(huán)境和溫度變化的環(huán)境下生長(zhǎng)出的一種須狀晶體，可能導(dǎo)致產(chǎn)品引腳的短路。,Page26,Planting,QualityControl,外觀檢查,Solderabilitytest,鍍層厚度量測(cè),Preconditioning:Steamaging93+3/-5,8hrsSolderdip:SnAgCu2455,50.5ssoldercoverage95%,Page27,TrimForm,Purpose:Removethetie-barandlead-frameandformproductstounitsfromstrips,fillthemintotubesandthenpasstonextprocess.,LaserMarking,LaserMarking,load,unload,Platingline,load,unload,Platingline,Sawworkarea,unload,Workingarea,unload,Lasermarking,Trimming,Forming,Page28,TrimForm,QualityControl,毛刺,腳偏,漏底材,長(zhǎng)短腳,腳彎,異物附著,外觀檢查,外形尺寸量測(cè),連筋,壓傷,共面性不良：同一產(chǎn)品不同管腳站立高度大于0.1mm,Page29,Packing,Purpose:Protecttheproductinthecirculationprocess,convenientstorageandtransportation,LaserMarking,LaserMarking,load,unload,Plati