各種IC封裝形式圖片

1、各種IC封裝形式圖片BGABall Grid ArrayEBGA 680L詳細規(guī)格LBGA 160L詳細規(guī)格PBGA 217LPlastic Ball Grid Array詳細規(guī)格 SBGA 192L詳細規(guī)格 TSBGA 680L詳細規(guī)格CLCC詳細規(guī)格CNRCommunication and Networking Riser Specification Revision 1.2 詳細規(guī)格CPGACeramic Pin Grid ArrayDIPDual Inline Package 詳細規(guī)格DIP-tabDual Inline Package with Metal HeatsinkFBGAF

2、DIPFTO220Flat PackHSOP28ITO220ITO3pJLCCLCCLDCCLGALQFPPCDIPPGAPlastic Pin Grid Array 詳細規(guī)格PLCC詳細規(guī)格PQFPPSDIPLQFP 100L詳細規(guī)格 METAL QUAD 100L詳細規(guī)格PQFP 100L詳細規(guī)格QFPQuad Flat PackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603FosterLAMINATE TCSP 20LChip Scal

3、e Package詳細規(guī)格TO252TO263/TO268SO DIMMSmall Outline Dual In-line Memory ModuleSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUQFPQuad Flat PackageTQFP 100L詳

4、細規(guī)格SBGASC-70 5L詳細規(guī)格SDIPSIPSingle Inline PackageSOSmall Outline PackageSOJ 32L詳細規(guī)格SOJSOP EIAJ TYPE II 14L詳細規(guī)格SOT220SSOP 16L詳細規(guī)格 SSOPTO18TO220TO247TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayZIPZig-Zag Inline PackageBQFP132TEPBGA 288LTEPBGA 288L詳細規(guī)格C-Bend Lead CERQUADCeramic Quad Flat Pack詳細規(guī)格Ceramic CaseLAMINATE CSP 112LChip Scale Packagespan style=font-size:9.0pt;font-family:宋體; mso