KLA缺陷檢查培訓(xùn)學(xué)習(xí)教案

1、會(huì)計(jì)學(xué)1KLA缺陷缺陷(quxin)檢查培訓(xùn)檢查培訓(xùn)第一頁(yè)，共25頁(yè)。21xx Capabilities2第1頁(yè)/共24頁(yè)第二頁(yè)，共25頁(yè)。3第2頁(yè)/共24頁(yè)第三頁(yè)，共25頁(yè)。Run Overview4第3頁(yè)/共24頁(yè)第四頁(yè)，共25頁(yè)。Run one waferInspection Queue5第4頁(yè)/共24頁(yè)第五頁(yè)，共25頁(yè)。6第5頁(yè)/共24頁(yè)第六頁(yè)，共25頁(yè)。7第6頁(yè)/共24頁(yè)第七頁(yè)，共25頁(yè)。8第7頁(yè)/共24頁(yè)第八頁(yè)，共25頁(yè)。9第8頁(yè)/共24頁(yè)第九頁(yè)，共25頁(yè)。Stopping the Inspection10第9頁(yè)/共24頁(yè)第十頁(yè)，共25頁(yè)。Defect Overview To im

2、prove production yields, defects need to be monitored and statistically analyzed at each stage of wafer production.11第10頁(yè)/共24頁(yè)第十一頁(yè)，共25頁(yè)。Defect Sort1.False : Found nothing after review with inspection data.2.Unkown : Defects were found but there is no suitable defect code to assign.3.Fall on particle

3、 : Particle on surface of patten. 4.In film particle : Particle was contained in film, such as poly, HDP, metal and so on.HDPPoly12第11頁(yè)/共24頁(yè)第十二頁(yè)，共25頁(yè)。5.Scratch : Especially for scratch caused by robot , other tool parts or man-made. Defect map :Defect iamge:MicroMacro13第12頁(yè)/共24頁(yè)第十三頁(yè)，共25頁(yè)。6.Discolor

4、: Color difference7.Masking ：Should be etched but still remian(poly,SiN,spacer,metal and so on). Some connect more than two lines,its bridge(killer).14第13頁(yè)/共24頁(yè)第十四頁(yè)，共25頁(yè)。8.Ring like defect: Such as defects caused by ARC splash, usually related to PHOTO.PolyMetal9.Grape like defect:Induces by PHOTO P

5、U.15第14頁(yè)/共24頁(yè)第十五頁(yè)，共25頁(yè)。10.Residue ：Always happen after wet station clean.11.Patten abnormal : Roughness,Defocus,Patten shift and so on.RoughnessDefocusPatten shiftPatten Abnormal16第15頁(yè)/共24頁(yè)第十六頁(yè)，共25頁(yè)。12.Concave: COP（ Crystal oriented pits ）, Oxide Loss，Pits.13.Peeling : Pattern shift or missing（W plu

6、g is one of peeling,always appear at wafer edge.） 17第16頁(yè)/共24頁(yè)第十七頁(yè)，共25頁(yè)。14.Blind : CT or Via have not been opened.15.Patten damage : Metal damagePoly broken is patten damage too,always happen during High Imp.18第17頁(yè)/共24頁(yè)第十八頁(yè)，共25頁(yè)。16.W Residue : 1). Caused by Oxide Loss; 2). Caused by CMP.NORMAL ABNORM

7、AL17.Under_Pat ：Under layer pattern fail issue.19第18頁(yè)/共24頁(yè)第十九頁(yè)，共25頁(yè)。18. Salicide_abnormal:Salicide poor formation.19.Grain : Including poly or metal grain.20第19頁(yè)/共24頁(yè)第二十頁(yè)，共25頁(yè)。20.Slurry: 21.PR /Polymer_remain :PR has not been stripped completely, typically contains Carbon21第20頁(yè)/共24頁(yè)第二十一頁(yè)，共25頁(yè)。22.Arcing:23.Line open:22第21頁(yè)/共24頁(yè)第二十二頁(yè)，共25頁(yè)。24.Corrosion : Caused by etch strip chamber or bad environment. This type defect is 100% killer defect.23第22頁(yè)/共24頁(yè)第二十三頁(yè)，共25頁(yè)。24第23頁(yè)/共24頁(yè)第二十四頁(yè)，共25頁(yè)。NoImage內(nèi)容(nirng)總結(jié)會(huì)計(jì)學(xué)。Defect map :。6.Discolor : Color difference。Some connect more than two lines,its bridge