PCB常用英文詞匯匯編

1、PCB常用英文詞匯匯編A aA.O.I(Automatic Optical Inspection)自動(dòng)光學(xué)檢查Apparatus設(shè)備，儀器Acceptable quality level (AQL)可接受質(zhì)量水平Area面積Accuracy精確度Artwork菲林Activating活化Artwork Drawing菲林圖形Active carbon treatment活性碳處理Artwork Film原裝菲林After Pressed Thickness壓板后之厚度Artwork Modification菲林修改Alignment校直，結(jié)盟Artwork No.菲林編號(hào)Annular rin

2、g錫圈Assembly組裝，裝配Anti-Static Bag靜電膠袋Axis軸B bBackplane背板Blistering起泡/水泡Back-up墊板Board Cutting開料Baking 烘板Board Thickness板厚Ball Grid Array (BGA)球柵陣列Bottom side底層Bare board裸板Breakaway tab打斷點(diǎn)Base Copper底銅Brushing磨刷Base material基材Build-up積層Bevelling斜邊Bullet pad子彈盤Black Oxide黑氧化Buried hole埋孔Blind via hole盲孔

3、C cC/M(Component Marking)元件字符Conductor width/space導(dǎo)體線寬/線隙Carbon ink碳油Contact接點(diǎn)Carrier帶板Copper area銅面積Ceramic substrate陶瓷Copper clad銅箔Certificate of Compliance合格證書Copper foil銅箔Chamfer倒角Copper plating電鍍銅Chemical cleaning化學(xué)清洗Corner角線Chemical corrosion化學(xué)腐蝕Corner mark板角記號(hào)Chip Scale Package (CSP)晶片比例包裝Cor

4、ner REG.Hole角位對(duì)位孔Circuit線路Cracking裂縫Clearance間距/間隙Creasing皺折Color顏色Criteria規(guī)格,標(biāo)準(zhǔn)Component Side(C/S)元件面Crossection area切面Composite layers復(fù)合層Cu/Sn Plating鍍銅錫Computer Aided Design (CAD)電腦輔助設(shè)計(jì)Current efficiency電流效率Computer Aided Manufacturing (CAM) 電腦輔助制作Customer客戶Computer Numerial Control (CNC)數(shù)控Custom

5、er Drilling File客戶鉆孔資料Conductor導(dǎo)體Customer P/N客戶產(chǎn)品編號(hào)D dD/F Registration Hole干菲林對(duì)位孔Diamond鉆石D/F(Dry Film)干膜Diazo film重氮片Date Code日期代號(hào)Dielectric breakdown介電擊穿Datum hole基準(zhǔn)參考孔Dielectric constant介電常數(shù)Daughter board子板Dielectric Thickness介電層厚度Deburring去毛刺Dielectric Voltage Test絕緣測(cè)試Defect缺陷Dimension尺寸Definiti

6、on定義Dimensional stability尺寸穩(wěn)定性Delamination分層Direct/indirect直接/間接Delay耽擱Distribution發(fā)放Delivery交貨Document type文件種類Densitomefer透光度計(jì)Documentation Control文件控制PCB常用英文詞匯匯編Density密度Double sided board雙面板Department部門Drill bit鉆咀Description說(shuō)明Drilling鉆孔Design origin設(shè)計(jì)原點(diǎn)Drilling Roughness鉆孔粗糙度Desmear去鉆污,除膠Dry Fil

7、m 干菲林Dessicant防潮珠Dry Film-Pattern干膜線路Developer顯影液,顯影機(jī)Dynamic動(dòng)態(tài)E eECN(Engineering Change Notification)工程更改通知Entek有機(jī)涂覆Effective date有效期Epoxy glass substrate環(huán)氧玻璃基板Electrical Test Fixture電測(cè)試 針床Epoxy resin環(huán)氧基樹脂Electro migration漏電Etch蝕刻Electroconductive paste導(dǎo)電膠Etchback凹蝕Electroless無(wú)電沉Etching蝕刻Electroless

8、 copper無(wú)電沉銅E-Test Marking電測(cè)試標(biāo)記Electroless Ni無(wú)電沉鎳E-Test(Electrical Test)電測(cè)試Electroless Gold/Au無(wú)電沉金Exposure曝光Engineering drawing工程圖紙External layer外層F fFiducial mark基準(zhǔn)點(diǎn)Fixture夾具Filling填充Flammability可燃性Film Fabrication菲林制作Flash Gold薄金Final QC最終檢查Flexible易曲的,能變形的Finish Overall Board Thickness成品總板厚度Flux助焊

9、劑G gGeneral information一般資料Golden board金板Ghost image重影Grid網(wǎng)格Glass transition temperature玻璃化濕度Ground plane地線層Gold Finger(G/F)金手指H hHAL(Hot Air Leveling)熱風(fēng)整平Hole density孔的密度Hand Rout手鑼Hole Diameter孔徑Hardness硬度Hole location孔位Heat Sealed熱密封Hole Location Chart孔位座標(biāo)表Heat Shrink-warp熱收縮Hole Position Toleran

10、ce孔位誤差Holding time停留時(shí)間Hole size孔尺寸Hole孔Hot Air Leveling(HAL)熱風(fēng)整平Hole breakout破環(huán)Humidity濕度I Identification標(biāo)識(shí),指標(biāo)Inter Plane Separation內(nèi)層分離Image影像Interleave Paper隔紙Imaging transfer圖形轉(zhuǎn)移Internal layer內(nèi)層Impedance阻抗Internal stress內(nèi)應(yīng)力Impedance Test阻抗測(cè)試Ionic cleanliness離子清潔度Inner copper foil 內(nèi)層銅箔Isolation孤立I

11、nspection檢驗(yàn)Isolation Resistance絕緣電阻Insulation resistance Test絕緣測(cè)試Item項(xiàng)目K kKEY board按鍵盤Kraft paper牛皮紙Key slot槽孔PCB常用英文詞匯匯編L lLaminate板材Legend Width字符寬度Laminate Thickness材料厚度Length長(zhǎng)度Lamination void 層間空洞Lifted Lands殘銅Landless hole破孔Line Width線寬Laser plotter激光繪圖機(jī)Liquid液體Laser plotting激光繪圖Location位置Laser

12、 via hole激光穿孔Logic diagram邏輯圖形Layup層壓配本Logo嘜頭,標(biāo)記Lay-up Instruction壓板指示Lot size批卡Legend字符M mMark標(biāo)記Min. Nickel Thickness最小鎳厚Master drawing菲林圖形Min. Tin-Lead Thickness (After HAL)（噴錫后）最小錫厚Material Thickness材料厚度Min.Annular Ring最小環(huán)寬Material Type材料類型Min.Spacing between Line to Line線與線之間的最小距離Max. X-out壞板上限M

13、in.Spacing between Line to Pad線與焊盤之間的最小距離Max.Board Thickness After Plating電鍍后總板厚度之上限Min.Spacing between Pad to Pad焊盤與焊盤之間的最小距離Measling白斑M(jìn)inimum 最小Mech Drawing No.圖紙編號(hào)Mirroring鏡像Mechanical cleaning機(jī)械清洗Missing 缺少M(fèi)etal金屬M(fèi)odel No.產(chǎn)品名稱Method方法Molded模塑MI(Manufacturing Instruction)生產(chǎn)制作指示Mother board主板Micro

14、strip微條線Moulding模房Min Conductor Copper Thickness最小線路銅厚Mounting hole安裝孔Min Hole Wall Copper Thickness最小孔壁銅厚Multilayer多層板Min. Gold Plating Thickness最小金厚Multi-layer Laminate多層板材料 N nNegative反面的No.of Panel per Stack每疊板數(shù)Net list網(wǎng)絡(luò)表No.of Panel/Sheet每張大料拼板數(shù)Network網(wǎng)絡(luò)No.of Pcs Per Bag每包數(shù)量Nick缺口No.of Unit/Arr

15、ay每套單元數(shù)No. of holes孔數(shù)Normal value標(biāo)準(zhǔn)值No.of Array/Panel每個(gè)拼板套板數(shù)O oOblong橢圓形的Organic Solerability Peservatives(OSP) 有機(jī)保護(hù)劑Offset 偏移Originator原作者Open/short開路/短路Outer copper foil外層銅箔Optimization(design)最佳化(設(shè)計(jì))Outline外形P pPacking包裝Pitch間距Packing包裝Placement放置Pad焊盤Plated Though Hole(PTH)沉銅Panel Area拼板面積Platin

16、g電鍍Panel Plated Crack板鍍?nèi)笨赑lating Crack電鍍裂縫Panel plating整板電鍍Plating line電鍍線Panel Size拼板尺寸Plating rack電鍍架Panel Size After Outerlayer Cutting外層切板后拼板尺寸Plating Void電鍍針孔PCB常用英文詞匯匯編Panel Utilization拼板利用率Plug Hole塞孔Pass rate通過(guò)率Polymer聚合體Passivation鈍化Porosity孔隙率Pattern線路Positive絕對(duì)的Pattern Inspection線路檢查Power

17、 plane電源層Pattern plating圖形電鍍Prepreg半固化片PCB(Printed Circuit Board)印制線路板Primary side首面Peck drilling啄鉆Print印刷Peel strength 剝離強(qiáng)度Probe point針床測(cè)點(diǎn)Peelable可剝性Process工序Peelable 剝離強(qiáng)度Process flow工序流程Peelable Mask可脫油Product Planning Dept.生產(chǎn)計(jì)劃部Peeling剝離Production生產(chǎn)板Permanent永久性Profile外形PH valuePH值Profiling 外形加工P

18、hoto plotting圖形輸出Profiling Process外形加工Photo via hole菲林過(guò)孔Project No.產(chǎn)品編號(hào)Photographers照片靶標(biāo)PTH Thermal Seress TestPTH熱沖擊測(cè)試Photoplotler光繪機(jī)PTH(Plating Through Hole)沉銅Physical物理的Pull away拉離Pin hole銷定孔Punch啤模Pink ring粉紅環(huán)Punching沖切Pinning hole鉆孔管位Punching Mould Drawing啤模圖形Q qQA Audit品質(zhì)審計(jì)Quality質(zhì)量QA(Quanlity

19、 Assurance)品質(zhì)部Quantity數(shù)量Quad Palt Pack (QFP)四邊扁平林整器件R rRaw Material Utilization原材料利用率Resist抗蝕劑Recall回收Resolution分辨率Rectifier整流器Rigid精密的Register mark對(duì)位點(diǎn)Roller coating涂覆Registration重合點(diǎn)Roughening粗化Remark備注Round pad圓盤Resin樹脂Routing外形加工,銑板Resin Recession流膠S sS/M Material綠油物料Solder mask on bare copper (sm

20、obc)裸銅覆蓋阻焊膜S/M(Solder Mask)阻焊Solder side焊接面Sales 銷售Solder Side C/M阻焊面字符Sample樣板Solder Side Cir.焊接面線路Sampling inspection抽樣檢驗(yàn)Solder Side Circuit焊接面Scaling factor縮放比例因素Solder Side S/M焊接面阻焊Scope范圍Solderability可焊性Scoring刻槽Solvent Test可溶性測(cè)試Scratch劃痕Spacing線距Secondary side第二面Special requirement 特殊要求Section

21、 Code組別代號(hào)Specification詳細(xì)說(shuō)明，規(guī)范Section Code Change組別代號(hào)更改Spindle主軸Segment部分,片段Split裂片Separated分離Square pad方塊Sequence順序Standard標(biāo)準(zhǔn)值Sets套Static靜態(tài)Sheet Size大料尺寸Stencial網(wǎng)版PCB常用英文詞匯匯編Shematic diagram原理圖Step drilling分布鉆Shiny有光澤的,發(fā)光的Step scale光梯尺Silk screen絲印Store貨倉(cāng)Silver film銀鹽片Supplier供應(yīng)商Single/double單層/雙面Suppor