試驗(yàn)項(xiàng)目4要點(diǎn)

1、實(shí)驗(yàn)項(xiàng)目名稱：印刷電路板的設(shè)計(jì)學(xué)生姓名：試驗(yàn)時(shí)間：2014-3-28批改老師：戴勤實(shí)驗(yàn)學(xué)時(shí)：4實(shí)驗(yàn)地點(diǎn)：4-214實(shí)驗(yàn)成績：批改時(shí)間：2012-4-20實(shí)驗(yàn)項(xiàng)目4印刷電路板的設(shè)計(jì)一、實(shí)驗(yàn)?zāi)康暮鸵?、掌握通過手工方式和系統(tǒng)內(nèi)置的向?qū)?，新元件封裝的制作方法與操作步驟。2、掌握對元件封裝庫進(jìn)行管理的基本操作。3、掌握由原理圖生成網(wǎng)絡(luò)表4、理解電路板的物理邊界和電氣邊界的區(qū)別及繪制方法，了解由向?qū)呻娐钒宓倪^程。5、 重點(diǎn)掌握自動(dòng)布線規(guī)則的設(shè)置及自動(dòng)布線有關(guān)命令的使用，理解DRC校驗(yàn)的功能。6、 掌握幾種手工調(diào)整布線的操作技巧，如將焊盤或元件接入到網(wǎng)絡(luò)內(nèi)的操作步驟，對導(dǎo)線、焊盤或字符串進(jìn)行全局編輯

2、的操作方法等。二、實(shí)驗(yàn)儀器和設(shè)備已安裝Protel 99se軟件的PC 一臺(tái)三、實(shí)驗(yàn)內(nèi)容1、給出發(fā)光二極管的 SCH元件，如圖4.1所示。請繪制出其對應(yīng)的元件封裝，如圖4.2所示。兩個(gè)焊盤的 X-Size和Y-Size都為60mil，Hole Size為30mil，陽極的焊盤為方形，編號(hào)為A，陰極的焊盤為圓形，編號(hào)為K，外形輪廓為圓形，半徑為 120mil，并繪出發(fā)光指示。圖4.1發(fā)光二極管的SCH元件圖4.2發(fā)光二極管的PCB元件2、NPN型三極管的SCH元件，如圖4.3所示，其對應(yīng)元件封裝選擇TO-5，如圖4.4所示。由于在實(shí)際焊接時(shí)，TO-5的焊盤1對應(yīng)發(fā)射極，焊盤 2對應(yīng)基極，焊盤 3

3、對應(yīng)集電極，它們之間存在引腳的極性不對應(yīng)問題，請修改TO-5的焊盤編號(hào)，使它們之間的保持一致，并重命名為TO-5A。TO52C皐電總3E發(fā)射扱圖4.3 SCH元件3、通過封裝制作導(dǎo)向，繪制出實(shí)驗(yàn)二中元件圖4.4 PCB元件ICS512對應(yīng)的封裝 SOP-8，如圖4.5所示。焊盤的X-Size為80mil, Y-Size為24mil。第一引腳的焊盤為矩形，其余焊盤的兩端為半圓形?？v向相鄰焊盤之間的距離為50mil，橫向相鄰焊盤之間的距離為220mil。圖4.5 SOP-8封裝4、通過封裝制作導(dǎo)向，繪制出實(shí)驗(yàn)二中開關(guān)DIPSW8對應(yīng)的封裝DIP-16，如圖4.6所示。焊盤的X-Size和Y-Siz

4、e均為50mil，Hole Size為30mil。第一引腳焊盤為方形，其余焊盤為圓形?？v向相鄰焊盤之間的距離為100mil，橫向相鄰焊盤之間的距離為300mil。圖4.6 DIP-16封裝5、手工繪制二極管IN4007的封裝RAD-0.2。如圖4.7所示。兩個(gè)焊盤的 X-Size和Y-Size都為60mil，Hole Size為30mil，二極管陽極的焊盤為方形，陰極的焊盤為圓形，外形輪廓為距形，并繪出方向指示。圖4.7二極管的封裝 RAD-0.26、使用電路板生成向?qū)?，新建一個(gè)邊長為1500mil的正方形電路板，在電路板的四角開口，尺寸為100mil x lOOmil，無內(nèi)部開口，雙層板，過

5、孔不電鍍，使用針腳式元件，元件管腳間 只允許一條導(dǎo)線穿過，最小走線寬度為10mil，走線間距15mil。所使用元件如表 4.1所示。電氣原理圖和PCB布局如圖4.8所示。操作練習(xí)內(nèi)容如下：1）分別使用直接裝載和利用設(shè)計(jì)同步器兩種方法裝入網(wǎng)絡(luò)表和元件。2）分別使用群集式和統(tǒng)計(jì)式兩種方法進(jìn)行自動(dòng)布局，并使用手工方法對布局進(jìn)行調(diào)整。3）采用全局自動(dòng)布線。4）在電路板上添加三個(gè)焊盤，標(biāo)注為VCC、GND和CLK ,并把他們連入相應(yīng)的網(wǎng)絡(luò)。表4.1元件一覽表元件名稱元件標(biāo)號(hào)元件所屬SCH庫元件封裝元件所屬PCB庫RES2R1、R2Miscellaneous Devices.ddbAXIAL0.4Advp

6、cb.DdbCAPC1Miscellaneous Devices.ddbRAD0.1Advpcb.DdbCRYSTALY1Miscellaneous Devices.ddbXTAL1Advpcb.Ddb74LS00U1A、U1B、U1CProtel DOS Schematic Libraries.ddbDIP14Advpcb.DdbX 二 0口蘭 " 人 二壬 口cs1LCi ¥1j 1 iR2 -I 卜 LK辰 1 LOOM 1異1卜IK圖4.8 電氣原理圖和 PCB布局圖7、使用電路板生成向?qū)?，新建一個(gè)邊長為1800mil的正方形電路板，在電路板的四角開口，尺寸為100

7、mil x lOOmil，無內(nèi)部開口，雙層板，過孔電鍍，使用針腳式元件，元件管腳間只允許一條導(dǎo)線穿過，最小走線寬度為20mil，走線間距15mil。加載Advpcb.ddb元件封裝庫，所使用元件如表4.2所示。電氣原理圖和 PCB布局如圖4.9所示。操作練習(xí)內(nèi)容如下：1 ）利用設(shè)計(jì)同步器裝入網(wǎng)絡(luò)表和元件。2）先對集成電路555進(jìn)行預(yù)布局（以555為布局的中心），再使用群集式方法進(jìn)行自動(dòng)布局，并使用手工方法對布局進(jìn)行調(diào)整。3 ）先對電阻R1進(jìn)行手工預(yù)布線，然后再采用自動(dòng)布線完成其它布線任務(wù)。4）采用全局編輯，對電源和接地的走線線寬變?yōu)?0mil。表4.2 元件一覽表元件名稱元件標(biāo)號(hào)元件所屬SCH

8、庫元件封裝元件所屬PCB庫RES1R1、R2Miscellaneous Devices.ddbAXIAL0.3Advpcb.DdbCAPC1、C2Miscellaneous Devices.ddbRAD0.1Advpcb.DdbUA555U1Protel DOS Schematic Libraries.ddbDIP8Advpcb.Ddb4HEADERJP1Miscellaneous Devices.ddbPOWER4Advpcb.Ddb設(shè)置為板長1800mil，寬1200mil，按照電路的功能進(jìn)行元件的手工布局與調(diào)整，可參照圖4.10的布局。C4CL C2Y1., u I；U2口U13 艮=L

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