田中銀合金線AgSEA技術(shù)資料

1、Ag 合金線SEA型號Tanaka Denshi Kogyo K.K.Technical Department TANAKA DENSHI KOGYO K.K.半導體市場的發(fā)展趨勢小型化微間距低線弧的運用縮減成本降低材料成本低成本提高生產(chǎn)力UPHMTBA參數(shù)范圍簡單的參數(shù)設(shè)定客戶的要求: 低價格材料高生產(chǎn)力LED Device市場的發(fā)展趨勢小型化低線弧短弧長縮減成本降低材料成本低價格材料提高生產(chǎn)力UPH參數(shù)范圍簡單的參數(shù)設(shè)定高亮度高反射率客戶的要求:低價格材料高生產(chǎn)力高性能Yes (氣體配件No 資金總額Yes (N2-H2No 混合氣體芯片損傷第一焊點參數(shù)生產(chǎn)力(UPH etc 反鍵合第二焊

2、點參數(shù)材料成本銅線金線項目Ag 為主的鍵合線Yes (氣體配件Yes (N2銀線Au, Cu, 和Ag 合金線的比較(壞(好材料成本/ 接合性4 TANAKA新Ag合金線的命名命名:S E A序號Enhanced的英文首字母Silver的英文首字母SEA 型號的特點1. 材料成本低以銀為主,低材料成本的鍵合線2. 鍵合性SEA 型號能在金線打線參數(shù)下打線3. 微間距SEA 的壓著球真圓度良好5機械特性設(shè)備: 拉伸試驗機UTM-拉伸速度: 10mm/min 試料長度: 100mm 測定數(shù)= 10鍵合線: SEA(Ag 合金線TCA1(裸銅線CLR-1(鍍鈀銅線GFC(金線0.8 1.0 1.2

3、1.4 1.6Wire diameter (milB r e a k i n g L o a d (g f SEATCA1 (Bare CuCLR-1 (coated CuAu (GFC6電阻率SEA型號的電阻率比金線高測定方法根據(jù)直流4端子法,通過一定的電流,測定當時的電壓。根據(jù)測定值計算電阻。R=V / I(R:電阻V:電壓I:電流根據(jù)右側(cè)公式,計算電阻率。= R×S/L(:電阻率S:橫截面積L:長度99.99%Au 99.99%CuAg alloy GPG-2GPH GFCTCA1SEAR e s i s t i v i t y (u c m

4、 3N 4N7熔斷電流計算公式0.00.02.0 4.0 6.0Wire Length (mmF u s i n g C u r r e n t (A 0.7mil0.8mil 0.9mil 1.0mil0.02.0 4.0 6.0Wire Length (mmF u s i n g C u r r e n t (A 0.8mil SEA0.8mil Cu wire 0.8mil A u alloy 0.8mil 4N-AuSEA的熔斷電流與金合金線的一樣。在Eugene Loh技術(shù)報告中提到的公式:IEEE Trans.Comp.,Hybrids,Manu.Tech.,Vol6,no.2,P

5、.209,JUNE1983.報告的標題是“Fussed-Open Bond Wires 物理分析資料”FAB形成性氣體流量的確認8打線機:UTC-3000 裝有氣體配件, 保護氣體:N21.0 l/min0.2 l/min0.4 l/min0.6 l/min0.8 l/min好901002003004005006005101520Deformation (um C o m p r e s s i o n L o a d (m N SEACoated Cu Bare Cu 4N-AuFAB 壓縮試驗Flat tool FAB【FAB 制造條件】線徑:20um FAB:38m打線機:Shinkaw

6、a UTC-1000氣體:N 2, 0.6l/min EFO 時間:0.36msEFO 電流:36mA(銀合金49mA(鍍鈀銅46mA(4N-金【測定設(shè)備】壓縮裝置:MCT-W500(SHIMADZU 【測定概圖】【測定條件】壓縮速度:23.5mN/sec 最大負荷:400mN 硬度比較軟Au wire >SEA > Cu wire 硬10第一焊點【Al-Splash】【Bonding condition 】Bonder:Shinkawa UTC-1000Gas :N2 0.6l/minDie-Pad:Al-0.5%Cu(t=0.8umCapillary :SPT SI (H:25

7、, T:130, CD:38, FA:8, OR:30Wire diameter :20umFAB diameter :38um鍍鈀銅線US-Power 260 US-Power 200SEA US-Power 170Search Level :120umSearch Speed :8.0mm/sSearch Force :40gfBond Force :40gfUS-Power :170230US-Mode :-2Pre US-Power :40Bond Time :6.0ms11第一焊點Squashed Ball & Shear Force【Bonding condition 】B

8、onder : UTC-3000Gas : N2 0.6l/min Die : Al-1.0Si-0.5Cu(t=0.8um Capillary : SPT SI Wire dia. : 20um FAB dia. : 38um S-Level : 150um S-Speed : 4mm/s Bond Time : 6ms Pre-US : 40N=24Ave. (Std.25320280240US Power203015Search Force & Bond Force (gfXYToolGap: 3um12樣品型號: SEA,GFC 線徑: 18um觀察項目縱切面: FAB &am

9、p; HAZ 橫切面: FAB , Wire設(shè)備Focused Ion Beam (FIB : Hitachi FB2000A橫切面縱切面結(jié)晶觀察1399.99%Au (GFCSEA結(jié)晶觀察(縱切面14Wire SEA99.99%Au(GFCFAB結(jié)晶觀察(橫切面15第二焊點Wire Pull at 2nd Position【Bonding condition 】Bonder :Shinkawa UTC-1000Gas :N2 0.6l/minDie-Pad :Al-0.5%Cu (t=0.8um Capillary :SPT SI(H:25, T:130, CD:38, FA:8, OR:3

10、0Wire diameter :20umSearch Level :100um Search Speed :4.0mm/sSearch Force & Bond Force :52gf US-Power :440560Bond Time :6.0ms:2nd bond lift occurred.23456784204605005405802nd US-PowerP u l l F o r c e (g f TANAKA Ag alloy wire23456784204404604805005205405605802nd US-PowerP u l l F o r c e (g f E

11、rror bar is STD.Pd coated Cu wireN=3016可靠性【Migration Test】Pass SEA 0/22Sample-30 / 22Sample-30/22Sample-20 / 22Sample-20/220 / 21PassSample-14N-Au wireSample-1ResultFailure / sample size (pinTerminal distance : 30 50 umVoltage : DC 6VHAST Machine : PC-R8D (HIRAYAMAMetal : Al-0.5%Cu 0.6um 40umFAB siz

12、e 0.8mil Wire dia.Size :6mm ×6mm ×300um Device130deg C 85%RH 96hHAST ConditionsQFP200pinFrame UTC-1000 ( Shinkawa Bonder SEA / 4N-Au wire Wire DC 6V+-+-+-3050um1743 44 umTarget squashed ball 33um FAB diameter ElBL 3.0 %8.9 gf Mechanical Properties 19.0 um Wire diameter SEA Wire type Thickn

13、essMetallization GE-7470 / non halogen compound Mold Resin QFP-200pin / Ag plating Flame 0.8 umAl-1%Si-0.5%Cu DieK&S 414FF-2021-R35(H10 CD13 T28 OR5 FA11Capillary 0.6 l / minForming Gas Shinkawa UTC-3000 with Cu kit Bonding Machine 121 deg / 100% / 2 atmPCT conditionPCT (Pressure Cooker test18PC

14、T【1st Bonding condition 】Bonder :Sinkawa UTC-3000Cu-kit Gas :N2 0.6l/minDie-Pad :Al-1.0%Si-0.5%Cu (t=0.8um Frame :QFP200pin Resin :NITTO DENKOGE-7470(non halogen Capillary :K&S 414FF-2021-R35(H10 CD13 T28 OR5 FA11Wire diameter :19.0um FAB diameter :33umSpark Current : 30mASpark Time : 0.26msTarg

15、et of Squashed all size : 44umTail Length : 100umSearch Speed : 4mm/secBond Force :15-30gfUS Power : 180-320Bond Time : 10msec US Time : 8msecUS mode : 0【SEA1】Shear force: 6.2kgf/mm2Bond Force : 20gf, US : 180【SEA2】Shear force : 11.5kgf/mm2Bond Force : 20gf, US : 280【SEA3】Shear force: 12.7kgf/mm2Bond Force : 20gf, US : 320【Au wire 】Shear force : 10kgf/mm2up0.04.04.55.0020040060080010001200