TSTT產(chǎn)品可測(cè)試性需求

1、Document must be followedto ensure thatthe format of documents arecon siste nt and sta ndardized.R&D-Template -Testability Requireme nts Guideli ne概念階段確定可測(cè)試性需求指南-03.00.00活動(dòng)號(hào)：TE-15Activity ID: TE-15Con trol Secti on文檔控制輸出文檔格式要求：在按照IPD模板內(nèi)容執(zhí)行IPD活動(dòng)中，當(dāng)輸出文檔時(shí)，請(qǐng)作者務(wù)必套用IPD輸出文檔格式，以保證文檔格式的規(guī)范性Requireme nts f

2、or format of output docume nts: whe n you output docume ntsFormat of IPD OutputVersioDateChange and reas onBywhile follow ing IPD template to execute activities,n版本日期更改及其理由責(zé)任人Project Man ager: Project:項(xiàng)目經(jīng)理：項(xiàng)目Project Phase / Decisi on Checkpo int:項(xiàng)目階段/決策檢查點(diǎn):Con ceptDevelopLaunchIn terim概念幵發(fā)發(fā)布臨時(shí)LifePl

3、anQualify計(jì)劃驗(yàn)證Cycle生命周期該模板僅作為確定可測(cè)性需求的指南，實(shí)際需求文檔模板參照IPD端到端產(chǎn)品包需求模板。1、概述 OVERVIEW目前可測(cè)性需求一般有以下幾方面的考慮：1、面向產(chǎn)品的可測(cè)性需求，是為了提高產(chǎn)品的故障檢測(cè)定位和隔離能力而考慮 的可測(cè)性需求，直接影響產(chǎn)品問(wèn)題故障檢測(cè)定位和隔離的難易程度。面向產(chǎn)品的可 測(cè)性需求在評(píng)審?fù)ㄟ^(guò)后將作為產(chǎn)品本身的規(guī)格特性。2、面向軟件驗(yàn)證測(cè)試的可測(cè)性需求，是為了方便軟件驗(yàn)證測(cè)試而提出的可測(cè)性需求，直接影響測(cè)試開(kāi)發(fā)和測(cè)試執(zhí)行的難易程度。3、面向硬件驗(yàn)證測(cè)試的可測(cè)性需求，是為了方便硬件驗(yàn)證測(cè)試而提出的可測(cè)性需求，直接影響測(cè)試開(kāi)發(fā)和測(cè)試執(zhí)行的

4、難易程度。4、面向生產(chǎn)測(cè)試的可測(cè)性需求，是為了方便生產(chǎn)測(cè)試，提高生產(chǎn)測(cè)試效率而提出的可測(cè)性需求。面向生產(chǎn)測(cè)試的可測(cè)性需求參見(jiàn)概念階段確定可制造性需求指南相應(yīng)內(nèi)容。目前公司已經(jīng)發(fā)布了各產(chǎn)品線的可測(cè)性需求基線 （工程特性需求基線之可測(cè)性部 分），該需求基線是公司多年來(lái)已有可測(cè)性經(jīng)驗(yàn)總結(jié)提煉的成果，而且還將不斷優(yōu)化和完善，所以需求基線可以覆蓋產(chǎn)品的大部分可測(cè)性需求。因此具體產(chǎn)品開(kāi)發(fā)時(shí) 可測(cè)性需求的提出一般按以下操作：1、產(chǎn)品在提可測(cè)性需求時(shí)首先參照相應(yīng)可測(cè)性需求基線剪裁得到具體產(chǎn)品的需求基線。相應(yīng)的要求參見(jiàn)可測(cè)性需求基線實(shí)施規(guī)定。2、結(jié)合具體產(chǎn)品的特點(diǎn)，充分考慮產(chǎn)品各階段測(cè)試的可能遇到的問(wèn)題和困難，

5、提出相應(yīng)的可測(cè)性需求。3、參考相關(guān)產(chǎn)品的可測(cè)性方面的經(jīng)驗(yàn)案例，提出相應(yīng)的可測(cè)性需求。4、分析參考業(yè)界同類(lèi)產(chǎn)品的可測(cè)性設(shè)計(jì)特點(diǎn)，提出相應(yīng)的可測(cè)性需求。下面的指南主要針對(duì)上述24點(diǎn)的需求分析收集給出指導(dǎo)，最后的需求輸出格式 參照IPD端到端產(chǎn)品包需求模板。對(duì)于需求基線的需求剪裁參照可測(cè)性需求基線 實(shí)施規(guī)定。1. summarizeTestability requirements could be consider as following aspects:1. Product-oriented testability requirements are proposed to improve the

6、 ability of detecting and isolating defect, in which would affect the ease of detecting and isolating defects during testing. The reviewed product-oriented testability requirements will be treated as a part of the offering requirements of the product under construction.2. Software-oriented testabili

7、ty requirements are proposed to ease the test development and execution when verifying the software of a product.3. Hardware-oriented testability requirements are proposed to ease the test development and execution when verifying the hardware of a product.4. Production-oriented testability requireme

8、nts are proposed to ease the testing and improve efficiency during the production of a product. Please refer to <concept phase productability requirement guideline> for production-oriented testability requirements.The testability requirement baselines for all products are released in our compa

9、ny(part of the engineering feature requirement baseline). The baselined requirements are summarized from the long term past project experience in our company, and it's also being optimize and consumate. Therefore the baselined requirements can cover most testability requirements of most products

10、, and testability requirements could be proposed by thefollowing steps:1.The testability requirement of a particular product could be obtainedby tailoring the baselined testability requirements to a particular need.For more detail, please refer to the <Testability Requirement Baseline User Guide&

11、gt;2. Accompany with the characteristic of the product, think over theproblems and difficulties that might be encountered during each phase of testing, testability requirements could be proposed for them.3. Referring the past experience of proposed testability requirementsfrom relevant products.4. A

12、nalysis and reference to the similar product in the industry, consider their design for testability.The following guide is served for the 24 shown above, and the finalrequirement output is in conformity with the IPD< end to end offering requirement template>. To tailoring the baselined testabi

13、lity requirement, please refer to <testability requirement baseline user guide>.2、產(chǎn)品測(cè)試需求和策略初步考慮Product testing requirements and strategy overview初步考慮產(chǎn)品進(jìn)行哪些測(cè)試， 可以根據(jù)相應(yīng)測(cè)試規(guī)范標(biāo)準(zhǔn)、 類(lèi)似產(chǎn)品或前一版本 的測(cè)試經(jīng)驗(yàn)而來(lái)。初步考慮產(chǎn)品如何進(jìn)行這些測(cè)試，要說(shuō)明如下問(wèn)題：哪些測(cè)試是手動(dòng)測(cè)試、哪些是自動(dòng)測(cè)試？測(cè)試數(shù)據(jù)源是內(nèi)置在系統(tǒng)中，還是外部提供？測(cè)試數(shù)據(jù)的采集和處理是內(nèi)置，還是外置？測(cè)試數(shù)據(jù)采集裝置的控制是內(nèi)置，還是外置？測(cè)試數(shù)

14、據(jù)源的控制是內(nèi)置，還是外置？測(cè)試數(shù)據(jù)的處理是內(nèi)置，還是外置？Summarize what tests are to be conducted. This can be summarized from testing requirements.Describe in general howthese testing are conducted, the following should be explained:What are manual testing and what are automated testing?Is testing data source embedded in the

15、 system or provided from outside?Is the collection and processing of testing data achieved from inside or outside?Is the control of testing data collection device achieved from inside or outside?Is the control of testing data source achieved from inside or outside?Is the processing of testing data a

16、chieved from inside or outside?3、產(chǎn)品測(cè)試各階段的可測(cè)試性需求根據(jù)測(cè)試需求和策略（如具有內(nèi)置要求的測(cè)試），通過(guò)對(duì)具體產(chǎn)品特點(diǎn)的分析、 內(nèi)部訪談、參考公司內(nèi)部經(jīng)驗(yàn)案例并分析調(diào)研業(yè)界同類(lèi)產(chǎn)品，提出可測(cè)試性需求。Testability requirements should be listed with reference to testrequirements and strategy addressing those tests which have embedded requirements and the test strategy of each test

17、item.產(chǎn)品各階段的可測(cè)性需求內(nèi)容應(yīng)該包括以下幾個(gè)方面的內(nèi)容：Testability requirements should include the following contents:3.1 、硬件模塊和部件調(diào)試和測(cè)試的可測(cè)性需求Testability requirements of modules and parts debugging and testing 關(guān)注點(diǎn)在于能否提供方便的調(diào)試手段和支持調(diào)試測(cè)試的工具接口， 支持模塊和部 件的單獨(dú)調(diào)試和測(cè)試，主要考慮以下幾個(gè)方面的內(nèi)容：（1）提供支持模塊獨(dú)立運(yùn)行必要的信號(hào)輸入和輸出接口數(shù)據(jù)。（2）提供信號(hào)和數(shù)據(jù)流的自環(huán)和自給設(shè)計(jì)（3）提供模

18、塊和部件的離線加載功能4）提供模塊和部件的自測(cè)試設(shè)計(jì)（5）提供測(cè)試儀器和工具的測(cè)試接口或兼容性設(shè)計(jì) 。（6）提供直觀的調(diào)試結(jié)果信息上報(bào)監(jiān)控本部分需求來(lái)源于以往類(lèi)似單板硬件和部件的調(diào)試經(jīng)驗(yàn)、 采用新的器件和開(kāi)發(fā)技 術(shù)而帶來(lái)的新的需求、采用新的方法引申的需求、提高開(kāi)發(fā)調(diào)試效率引出的需求以 及來(lái)自?xún)?nèi)部訪談和調(diào)研分析的相應(yīng)需求。例如：產(chǎn)品設(shè)計(jì)了一塊業(yè)務(wù)板， 但需要時(shí)鐘板提供時(shí)鐘才能正常工作， 而提供時(shí) 鐘的單板也要調(diào)試，無(wú)法支持本單板的調(diào)試，這樣為了調(diào)試這塊單板就需要考慮時(shí) 鐘源的設(shè)計(jì)，可能我們需要在板內(nèi)提供一個(gè)晶振，或者利用鎖相環(huán)的壓控晶振分壓 設(shè)置提供時(shí)鐘，以支持單板的獨(dú)立調(diào)試。另外為了調(diào)試單板業(yè)

19、務(wù)是否正常，必要的 環(huán)回必須要支持，數(shù)據(jù)源需要有相應(yīng)的設(shè)計(jì)考慮。Thefocus here is whether easy debugging &testing measuresand debugging & testing equipment interface is available, which makes it easy to verify and locate where the problem comes from, and support the independent debugging & testing of modules and parts .

20、 The following contents should be taken into consideration:（1）Provide input & output data sources necessary for independent debugging & testing of modules and parts.(2) Provide loop back design and embedded data source for data flow.(3) Support off-line loading of modules and parts.(4) Provi

21、de self-tests of modules and parts.(5) Provide interface or compatibility design necessary for testing equipment and tools.(6) Provide visual way for reporting of debug results.Requirements here usually come from past board hardware and parts debugging & testing experience, new requirements brou

22、ght about by using new components and development technology, requirements brought about by new method, requirements brought about by raising development efficiency.3.2 、軟件模塊的調(diào)試和測(cè)試中的可測(cè)性需求Testability requirements of software module debugging and testing關(guān)注點(diǎn)主要在于按設(shè)置測(cè)試控制序列、 狀態(tài)觀測(cè)點(diǎn)和輸入輸出機(jī)制的需求， 主要 考慮以下幾個(gè)方面的內(nèi)

23、容：（1）提供軟件模塊調(diào)試測(cè)試的能控性設(shè)計(jì)，能通過(guò)輸入設(shè)定的測(cè)試序列使系統(tǒng) 處于某種特定的狀態(tài)或滿足某種特定條件的狀態(tài)。 主要考慮軟件模塊的調(diào)試測(cè)試控 制點(diǎn)的選擇和測(cè)試序列導(dǎo)入機(jī)制的設(shè)計(jì)。（2）提供軟件模塊調(diào)試測(cè)試的能觀性設(shè)計(jì)，能夠通過(guò)系統(tǒng)的輸出數(shù)據(jù)判定系統(tǒng) 是否處于某種特定的狀態(tài)或滿足某種特定條件的狀態(tài)。主要考慮軟件模塊的調(diào)試測(cè) 試觀察點(diǎn)的選擇和觀察裝置的設(shè)計(jì)。（3）軟件可測(cè)試性需求分為內(nèi)建、公共、產(chǎn)品特性等三類(lèi)，內(nèi)建測(cè)試能力與公共 可測(cè)試性需求合入產(chǎn)品包需求，在確定設(shè)計(jì)需求時(shí)，對(duì)具體產(chǎn)品特性需求分析的基 礎(chǔ)上，提出相應(yīng)的特性可測(cè)試性需求。三類(lèi)需求分別說(shuō)明如下：特性可測(cè)試性需求。 針對(duì)產(chǎn)品具

24、體特性測(cè)試的方便性提出的需求， 它們與特性緊 密相關(guān)，以特性樹(shù)的方式組織公共可測(cè)試性需求，例如：0沖內(nèi)存管理這些更具有公共性的部分。它們叫做公 共可測(cè)試性需求。也是以特性樹(shù)的方式組織。例如：內(nèi)存管理特性、隊(duì)列特性等等內(nèi)建測(cè)試能力需求。它是最具有公用性的部分。它們叫做內(nèi)建測(cè)試能力可測(cè)試 性需求。它描述了產(chǎn)品應(yīng)該具有的支持測(cè)試能力的需求。如：跟蹤機(jī)制需求、測(cè)試 接口需求等。這些需求的被實(shí)現(xiàn)，可以有力的支持前兩類(lèi)需求的實(shí)現(xiàn)。例如：我們 實(shí)現(xiàn)了跟蹤機(jī)制，就能更好的實(shí)現(xiàn)第一類(lèi)和第二類(lèi)中的哪些跟蹤需求。它們都需要 調(diào)用這里提供的機(jī)制來(lái)真正的完成跟蹤。The focus here is the requir

25、ements of setting up test control order, status observe point and input & output mechanism, The following contents should be taken into consideration:(1) Test controller of software module debugging & testing, which can make the system coming into or satisfying some special states.(2) The ob

26、servation of software module debugging & testing, usually the observation points and observation equipment are considered here, through which the system state can be visible by the output message, and we can know whether the system is under the certain state we need.( 3)Software testability requ

27、irements are classified into three type, and they are product feature-oriented testability requirements, build-in test capability and common testability requirements. build-in testcapability and common testability requirments will be add into IPD< end to end offering requirement>, and during a

28、nalysis of product design requirements, product feature-oriented testability requirements will be analyzed based on analysis of product feature requirements.feature-oriented testability requirements, which are proposed according to the actual features of a product. Such requirements are strongly rel

29、ative to the feature of a products, and they are organized by different mon testability requires. such as memory management functions in a OS, they are common to the public and not feature-oriented to a particular product, they are called the common testability requirements. such require

30、ments could be organized by a feature-tree as well, such as memory management feature, queue feature, and etc.build-in-test capability requirements. they are the most commonpart of a testing facility, and be called build-in-test capability requirements. such requirements depicted the product under c

31、onstruction should support a certain kind of testing capability.for example, if we implement a tracking facility, it could well support the tracking and interfacing requirements from the above two kind of testability requirements. as the figure shownbelow are the infrastructure of the build-in-test

32、facilities:本部分需求主要來(lái)源于測(cè)試策略、經(jīng)驗(yàn)總結(jié)以及內(nèi)部訪談和調(diào)研分析。 軟件可 測(cè)試性需求的分析詳細(xì)過(guò)程與方法，參見(jiàn)測(cè)試部相關(guān)支撐流程。Requirements here usually come from test strategy ,experience, interview. from R&Dtest dept., you can get detailed supporting process and technical guide for software testability requirements.3.3 、系統(tǒng)聯(lián)調(diào)中的可測(cè)性需求需求的關(guān)注點(diǎn)主要是能夠提供

33、一些手段，這些手段是可以暴露問(wèn)題、發(fā)現(xiàn)問(wèn)題、 定位問(wèn)題產(chǎn)生原因，解決問(wèn)題、以及驗(yàn)證解決效果的測(cè)試手段，主要考慮以下幾個(gè) 方面的內(nèi)容：（1）測(cè)試數(shù)據(jù)源設(shè)計(jì)2）業(yè)務(wù)和控制數(shù)據(jù)流的監(jiān)控和變更設(shè)計(jì)3）子系統(tǒng)和模塊的故障分段環(huán)回及定位設(shè)計(jì)（4）子系統(tǒng)和模塊的自測(cè)試設(shè)計(jì)（5）測(cè)試儀器和工具的測(cè)試接口或兼容性設(shè)計(jì)（6）測(cè)試結(jié)果的記錄、分析和結(jié)果上報(bào)設(shè)計(jì)例如：系統(tǒng)聯(lián)調(diào)中如何區(qū)分不同單板、 不同模塊之間的故障， 出了故障后問(wèn)題是 出在這個(gè)單板 / 模塊還是出在與之接口的那個(gè)單板 / 模塊，是我們經(jīng)常遇到的一個(gè)問(wèn) 題。需要考慮相應(yīng)設(shè)計(jì)支持問(wèn)題的分段 / 分層定位。Testability requirements

34、of joint system debuggingThe focus here is to provide some means, which can help us to learn about and find out the problems, find the reason of the problem, as well as solving methods and effectiveness of the problems. The following contents should be taken into consideration:(1) The design of test

35、ing data source(2) The design for inspection and modification of system business flow and control data flow.(3) Segment loop and diagnose design for sub-systems and modules.(4) The self-test design for sub-systems and modules.(5) The design of interface or compatibility design necessary for testing

36、equipment and tools.(6) The recording, analyzing and reporting of testing result.本部分需求主要來(lái)源于聯(lián)調(diào)經(jīng)驗(yàn)、聯(lián)調(diào)測(cè)試策略以及內(nèi)部訪談和調(diào)研分析。Requirements here usually come from joint debugging experience and strategy,3.4 、系統(tǒng)驗(yàn)證測(cè)試中的可測(cè)性需求 系統(tǒng)驗(yàn)證測(cè)試是驗(yàn)證產(chǎn)品各種指標(biāo)性能是否達(dá)到設(shè)計(jì)要求， 在不同環(huán)境下的指標(biāo) 容限如何，包括指標(biāo) / 接口層測(cè)試、功能 / 性能層測(cè)試、子系統(tǒng) / 模塊層測(cè)試、應(yīng)用層 測(cè)試、用戶層測(cè)試，

37、其關(guān)注點(diǎn)主要在于系統(tǒng)驗(yàn)證測(cè)試各種測(cè)試項(xiàng)目能否實(shí)現(xiàn)、實(shí)現(xiàn) 是否方便、出現(xiàn)問(wèn)題是否可以定位。 主要考慮以下幾個(gè)方面的內(nèi)容：（1）系統(tǒng)業(yè)務(wù)功能測(cè)試的可實(shí)現(xiàn)性和方便性（2）性能指標(biāo)測(cè)試與瓶頸定位的可實(shí)現(xiàn)性和方便性（3）系統(tǒng)告警功能驗(yàn)證測(cè)試的可實(shí)現(xiàn)性和方便性（4）系統(tǒng)容限 / 容錯(cuò)/極限性能測(cè)試的可實(shí)現(xiàn)性和方便性（5）協(xié)議跟蹤與驗(yàn)證測(cè)試的可實(shí)現(xiàn)性和方便性。例如：針對(duì)系統(tǒng)驗(yàn)證測(cè)試中測(cè)試工作量比較大、 重復(fù)次數(shù)較多的問(wèn)題， 往往需要 考慮對(duì)自動(dòng)測(cè)試的支持，提供自動(dòng)統(tǒng)計(jì)功能或者相應(yīng)的函數(shù)接口，便于自動(dòng)測(cè)試設(shè) 計(jì)和執(zhí)行。對(duì)于異常容錯(cuò)測(cè)試往往需要考慮相應(yīng)的硬件接口或函數(shù)接口支持。有時(shí) 候接口指標(biāo)測(cè)試時(shí)需要考慮測(cè)試

38、儀器輔助信號(hào)的設(shè)計(jì)，提供測(cè)試儀器所需要的時(shí)鐘 等信號(hào)接口供測(cè)試儀器使用。Testability Requirements for SVTSystem verification test is used for verifying whether the different standard performance can meet design requirements and what is the standard limit tolerance level in different environment. The system verification test generally i

39、nclude specification and interface test, function and performance test, sub-system and module test, application test and consumer test. The focus here is whether the different system verification test items can be achieved, as well as the convenience for achieving, and whether problems can be diagno

40、sed. The following contents should be taken into consideration:(1) The reliability and convenience of system function test.(2) The reliability and convenience of specification test, system performance test and bottleneck positioning.(3) The reliability and convenience of system alarm function verifi

41、cation test.(4) The reliability and convenience of system tolerance test, error tolerance and limit performance test.(5)The reliabilityand convenience of protocol tracking andverification test.本部分需求主要來(lái)源于測(cè)試策略、經(jīng)驗(yàn)總結(jié)以及內(nèi)部訪談和可測(cè)性調(diào)研分析。Requirements here usually come from debugging experience and strategy, in

42、terview.3.5 、整機(jī)安裝后的上電自測(cè)試可測(cè)性需求整機(jī)安裝后的上電自測(cè)試主要是用于驗(yàn)證整機(jī)系統(tǒng)的配置正確性、 子系統(tǒng)和部件 的有效性，以及驗(yàn)證系統(tǒng)的完備性、數(shù)據(jù)配置的正確性，這里的可測(cè)性需求關(guān)注點(diǎn) 在于如何提高測(cè)試自動(dòng)化程度、縮短測(cè)試時(shí)間、如何提高測(cè)試的故障覆蓋率、減少 漏測(cè)率。 主要考慮以下幾個(gè)方面的內(nèi)容：（1）測(cè)試數(shù)據(jù)源設(shè)計(jì)（2）業(yè)務(wù)通路用外部程序控制的設(shè)計(jì)（3）業(yè)務(wù)通路的環(huán)回及故障定位設(shè)計(jì)4）各單板自檢測(cè)試設(shè)計(jì)5）數(shù)據(jù)自動(dòng)配置工具設(shè)計(jì)(6) 運(yùn)行狀態(tài)監(jiān)控及測(cè)試結(jié)果的記錄、分析和上報(bào)設(shè)計(jì)例如：整機(jī)測(cè)試的自動(dòng)化對(duì)生產(chǎn)效率提高非常重要， 所以一般需要提供整機(jī)安裝 后自測(cè)試功能，包括提供

43、各單板的自檢測(cè)試，系統(tǒng)業(yè)務(wù)通路的遍歷自測(cè)試設(shè)計(jì)支持 等等，自測(cè)試的問(wèn)題定位應(yīng)該盡量定位到板級(jí)，而且測(cè)試用的數(shù)據(jù)源應(yīng)該盡量采用 內(nèi)置設(shè)計(jì)，避免試用昂貴的外部?jī)x器。Testability Requirement for Power On Self TestWhole set power on self test after installation not only verify theconfiguration correctness of the whole set system, effectiveness of subsystem and part, but also the comple

44、teness of system and correctness of data configurations. The focus here is how to improve the degree of test automation, howto shorten the test time, improve the test coverage, and reduce the problems missed out in test. The following contents should be taken into consideration:(1) The design of tes

45、ting data source.(2) The design of external program control for business channels.(3) The loop back and troubleshooting design . for business channels.(4) Self-test of different board or card.(5) The design of data automatic configuration tools.本部分其可測(cè)性需求主要來(lái)源于測(cè)試策略、經(jīng)驗(yàn)總結(jié)以及內(nèi)部訪談和調(diào)研分析。Requirements here us

46、ually come from test strategy , experience, interview.3.6 、在線例行測(cè)試的可測(cè)性需求在線例測(cè)用于實(shí)現(xiàn)定時(shí)對(duì)系統(tǒng)的功能和關(guān)鍵性能進(jìn)行檢測(cè)， 確保系統(tǒng)和部件運(yùn)行 的正確性。單板更換、軟件升級(jí)與配置數(shù)據(jù)變更之后進(jìn)行系統(tǒng)功能性能的測(cè)試，驗(yàn) 證變更后系統(tǒng)的正確性。主要考慮以下幾個(gè)方面的內(nèi)容：1）測(cè)試數(shù)據(jù)源設(shè)計(jì)（2）通道的分層逐段環(huán)回設(shè)計(jì)（3）單板硬件（芯片） 的在線測(cè)試設(shè)計(jì)（4）測(cè)試監(jiān)控及測(cè)試結(jié)果的記錄、分析和上報(bào)設(shè)計(jì)例如：提供例測(cè)命令，實(shí)現(xiàn)對(duì)設(shè)備的全面在線測(cè)試，包括例測(cè)啟動(dòng)設(shè)置、例測(cè)模 式范圍選擇、例測(cè)結(jié)果記錄上報(bào)、例測(cè)故障診斷定位等。Test

47、ability Requirement for On-line Routine TestThe objective of on-line routine test is to conduct test on the system function and key performance regularly to ensure the correctness of system and parts operation. System function performance test when board change, software upgrade and configuration da

48、ta change happen to verify the system correctness after the changes. The following contents should be taken into consideration:（1）The design of testing data source.(2) The design of layered and segmented loop back.（3）The on-line routine test for board hardware（chip）.（4）The recording, analyzing and r

49、eporting of testing result.本部分可測(cè)性需求主要來(lái)源于測(cè)試策略、經(jīng)驗(yàn)總結(jié)以及內(nèi)部訪談和調(diào)研分析。Requirements here usually come from test strategy , experience, interview.3.7 、單板和部件故障診斷測(cè)試的可測(cè)性需求單板和部件的故障診斷測(cè)試關(guān)注點(diǎn)主要是如何提高故障定位的有效性、準(zhǔn)確性， 方便性。主要考慮以下幾個(gè)方面的內(nèi)容：（1）單板和部件的獨(dú)立運(yùn)行設(shè)計(jì)（2） 通道的分層自環(huán)與環(huán)回診斷設(shè)計(jì)（3）單板硬件初始化及自檢診斷設(shè)計(jì)4）測(cè)試儀器和測(cè)試工具的兼容性設(shè)計(jì)5）故障診斷樹(shù)及故障定位到芯片級(jí)的診斷設(shè)計(jì)考

50、慮（6 ）診斷測(cè)試監(jiān)控及測(cè)試結(jié)果的記錄、分析和上報(bào)設(shè)計(jì)例如：在現(xiàn)場(chǎng)定位時(shí)我們系統(tǒng)的故障怎么定位到一塊單板， 在維修測(cè)試怎么定位 到一個(gè)芯片是我們經(jīng)常面對(duì)的一個(gè)問(wèn)題，需要我們?cè)谠O(shè)計(jì)初期進(jìn)行充分的可測(cè)性分 析，并提供足夠的可測(cè)性設(shè)計(jì)支持，以及考慮提供故障自動(dòng)診斷設(shè)計(jì)。Testability Requirement for Board and Parts Failure Diagnostic TestThe requirement of board and parts failure diagnostic test covers mainly troubleshooting which is loc

51、ated to chip level, independent operation requirement of board and parts as well as the layered loop back, board hardware initialization and self test, board auto loop and loop back. In addition, the compatibility of test equipment and test tools should be taken into consideration.本部分其可測(cè)性需求主要來(lái)源于測(cè)試策略

52、、經(jīng)驗(yàn)總結(jié)以及內(nèi)部訪談和調(diào)研分析。Requirements here usually come from test strategy , experience, interview.4、可測(cè)試性需求總結(jié)對(duì)以上各方面的可測(cè)性設(shè)計(jì)需求進(jìn)行統(tǒng)計(jì)和總結(jié)，完成以下可測(cè)性需求列表（參 見(jiàn)： E2E_Template_End to End Offering Requirements Template 端至U端產(chǎn)品包 需求模板）,該過(guò)程中主要完成重復(fù)需求的合并，并結(jié)合業(yè)界先進(jìn)和歷史經(jīng)驗(yàn)對(duì)需 求列表進(jìn)行分析，對(duì)優(yōu)先級(jí)別高的需求重點(diǎn)說(shuō)明，給出需求的排序Testability requireme nts summa

53、ryCount up and summarize testability requirements with a table and analyze with reference to the leading companies in the industry and lessons learned. Those with high priority should be especially emphasized. ( Using <E2E_Template_End to End OfferingRequirements Template>, Lotus 1-2-3Table).序

54、號(hào)合并后的可測(cè)性需求該需求的相關(guān)好處基本需求最好滿足的需求(Y/N)(Y/N)1PIC扣板設(shè)計(jì)專(zhuān)用的調(diào)試板，為 這類(lèi)單板提供業(yè)務(wù)流、控制或 接口，以方便該類(lèi)單板的調(diào)測(cè)?？梢灾С謫伟宓莫?dú)立調(diào)試和測(cè)試，提高調(diào)試和測(cè)試效率NY2在單板上提供均勻分布的地針或接地點(diǎn)方便信號(hào)測(cè)試NY3提供上電對(duì)關(guān)鍵芯片的自檢測(cè) 試，測(cè)試結(jié)果通過(guò)指示燈顯示 并同時(shí)上報(bào)控制臺(tái)。便于調(diào)測(cè)和現(xiàn)場(chǎng)維護(hù)YN4單板提供EERPROM于系統(tǒng)軟硬件版本、生產(chǎn)序列號(hào)的集中保存便于維護(hù)和故障定位分析YN5提供LCD顯示板顯示系統(tǒng)運(yùn)行狀態(tài)和告警信息便于故障監(jiān)測(cè)和定位NY6系統(tǒng)提供例行測(cè)試功能，能對(duì) 設(shè)備的系統(tǒng)、部件、單板等部 分的軟件和硬件定期進(jìn)行全面便于故障檢測(cè)YN的檢測(cè)7SerialThe requireme ntsTestabilityTheaffects ofEsse ntialRecommeNo.descripti on fromrequireme ntstestab