smt工藝相關85m貼片元件焊接07m

1、工程師，高級工程師論壇1.0Contents目錄Page1111121.02.03.04.0Content Purpose Scope目錄目的范圍Description定義4.14.2Tools & Equipment工具和-Solder Joint for Surface Mounted Components表面貼裝元件的焊接4.2.14.2.24.2.34.2.44.2.54.2.64.2.74.2.84.2.94.2.104.2.114.2.124.2.134.2.14Reference Remarks3-78-910-1112-1516-1718-212223-2526-2728293

2、0-3132-3334-4243434343Chip Component Cylindrical Devices片狀元件-圓柱形元件-LCC DevicesPLCC DevicesSOIC Devices (Gull-Wing) -QFP Devices (Gull-Wing) -Flush TerminationsPartial Wraparound Terminations (Tantalum Capacitor) -Round ConductorSolder BallsSolder Splash & Solder Webs -Ball Array Grid(BGA)Illustratio

3、nIllustrationon Acceptable Soldering Requirementson RejectableSolderingRequirements5.06.07.08.0參考資料備注Revision History版本Approval 批準2.0Purpose目的This document provides the soldered joints acceptability requirements to be met for surface mounted components throughout the PCBA surface mount assembly本文件制定

4、了PCBA 表面貼裝過程中表面貼裝元件的焊接可接受要求。3.0Scope 范圍This document established the workmanship standard criteria for soldered joints of surface mounted components to be applied for PCBA throughout the soldering processes. Thestandards are explained ins by illustrations and descriptions本文件為表面貼切裝元件的焊接所制定的工藝標準規(guī)范適用于P

5、CBA 整個焊接過程。本標準在細節(jié)方面由插圖和描述作解釋。4.0Description定義4.1. Tools and Equipment 工具和Page 1 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇Refer to Creative Workmanship Standard (Docu. No.: 29000)參照創(chuàng)新工藝

6、標準(Docu. No.: 29000)4.2 Solder Joint For Surface Mounted Components表面貼裝元件的焊接4.2.1Chip Component片狀元件4.2.1.1 Minimum Solder Coverage覆蓋PREFERRED(1) Solder fillet is concave and wetted termination by 100% of the height (H) and 100% of the width (W).焊接帶呈現凹形并且終端高度和寬充分潤濕。Figure 4.1Page 2 of 43Corporate Qua

7、lity Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇ACCEPTABLE(1) The solder fillet extends at least 25% of the height (H) and 50% of the width (W).焊接帶延伸至50% 。高度的 25%和寬度的Figure 4.2REJECTABLE(1) Insufficient solder

8、 with fillet extends less than 25% of the height (H) and 50% of the width (W).焊接帶，不足高度的 25%和寬度和50% 。Figure 4.34.2.1.2um Solder CoveragePREFERRED(1) Solder fillet is concave and wettedthe termination by 100% of the height (H) and 100% of the width (W).焊接帶呈現凹形并且終端高度和寬充分潤濕.Figure 4.4Page 3 of 43Corpora

9、te Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇ACCEPTABLE(1) Connection area exhibits a concave solder fillet rising to the top of chip. Good wetting to chip and land surface.連接區(qū)域呈現出一個延伸到貼片元件上表面的凹形焊接帶。貼

10、片元件與焊盤潤濕良好。Figure 4.5REJECTABLE(1) Excessive solder overhang the land ornon-metallized portion for fillet. Evidence of non-wetting.a convex多余的焊料懸垂在焊盤或非鍍金屬表面 上，形成了一個凸形的焊接帶。明顯的潤濕不良。Figure 4.64.2.1.3 Voids, Blow Holes & Pin Holes空隙，氣泡與針孔PREFERRED(1) Solder is smooth, bright, shiny and continuous with n

11、o evidence of pin holes, blow holes or voids.焊接光滑、明亮有光澤并呈現出良續(xù)性，沒有明顯的針孔、氣泡或空隙。連Figure 4.7Page 4 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇ACCEPTABLE(1) The solder connection may exhibit

12、voids, blow hole or pin hole in which the surface area covers less than 50% of the component width (W).焊接處有空隙、氣泡或針孔，總體覆蓋面積小于元件寬度的 50% 。Figure 4.8REJECTABLE(1) The entire surface area of the voids, blow hole or pin holes cover more than 50% of the component width (W).整個表面區(qū)域有空隙、氣泡或針孔，總體覆蓋面積大于元件寬度的 50%

13、 。Figure 4.94.2.1.4 Tombstone 立碑PREFERRED(1) Chip component is mounted properly on the terminal pads with complete wetting of solder on the land surface and the end metallization of the component.貼片元件恰當的貼裝于終端 焊盤，并且元件終端和焊盤均潤濕良好。Figure 4.10Page 5 of 43Corporate Quality Assurance DepartmentCorporate Qu

14、ality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇ACCEPTABLE(1) Chip component mounted sideways is permissible provided that there is a complete wetting of solder on the land surface and the end metallization of the component.貼片元件貼裝移位但仍潤濕良好。(2) Hei

15、ght of sideway mounted component isnot theum for the whole PCBA.貼裝移位的元件的高度不是整個PCBA 的最大高度。Figure 4.11REJECTABLE(1)Chip component standing on one side of the terminal pad (tombstoning).立碑Height of sideway mounted component is um for the whole PCBA.貼裝移位的元件的高度是整個PCBA 的最大高度。(2)Figure 4.12Page 6 of 43Corp

16、orate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇4.2.2Cylindrical Devices 圓柱形元件4.2.2.1 Minimum Solder Coverage最少焊錫覆蓋W = Termination Width H= Termination Height=Diameter of Cylindrical Device Diameter o

17、f Cylindrical DevicePREFERRED(1) Solder fillet is concave and wetted the termination by 100% of the height (H) and 100% of the width (W).呈現出凹形焊接帶且終端潤濕良好。Figure 4.13ACCEPTABLE(1) Solder fillet extends at least 50% of the height (H) and 50% of the width (W) of the device.焊接帶至少延伸至高度的 50%和寬度的50% 。Figure

18、 4.14REJECTABLE(1) Insufficient solder with fillet extends less than 50% of the height (H) and 50% of the width (W) of the device.，焊接帶不能延伸至元件高度和寬度的50%Figure 4.15Page 7 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Co

19、mponents)Date:工程師，高級工程師論壇4.2.2.2um Solder Coverage 最大焊錫覆蓋W = Termination Width H = Termination Height=Diameter of Cylindrical Device Diameter of Cylindrical DevicePREFERRED(1) Solder fillet is concave and wetted the termination by 100% of the height (H) and 100% of the width (W).呈現出凹形焊接帶且終端潤濕良好。Figu

20、re 4.16ACCEPTABLE(1) Solder fillet is slightly convex but does not overhang the termination or land with evidence of proper wetting.焊接帶呈現出輕微凸起但焊盤或終端沒有懸垂，呈現出適當的潤濕。Figure 4.17REJECTABLE(1) Excessive solder overhangs the land ortermination fora convex fillet.多錫，焊錫懸垂在焊盤與終端上形成了一個凸形焊接帶。Figure 4.184.2.3LCC

21、 DevicesPage 8 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇7.2.3.1 Minimum Solder CoveragePREFERRED(1) Solder wetting extends to the top of the castellation fora concave solder fillet (F)

22、.焊錫潤濕至接帶。頂端，形成了一個凹形焊Figure 4.19ACCEPTABLE(1) Solder fillet is evident and extends at least 25% of the castellation height (H) equal to 50% of the fillet height (F).形高度的 25%相當于焊接帶延伸至焊接帶高度的 50% 。Figure 4.20REJECTABLE(1) Insufficient solder with fillet extends less than 25% of the castellation height (

23、H) and 50% of the fillet height (F).，焊接帶延伸少于高度的 25%即少于焊接帶高度的 50% 。Figure 4.214.2.3.2um Solder Coverage多錫Page 9 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇PREFERRED(1) Solder wetting exte

24、nds to the top of the castellation fora concave solder fillet (F).焊錫潤濕至接帶。頂端，形成了一個凹形焊Figure 4.22ACCEPTABLE(1) Solder fillet is slightly convex with evidence of proper wetting. Solder does not overhang the castellation or land area. 焊接帶輕微凸起但適當潤濕。焊錫沒有懸垂在或焊盤上。Figure 4.23REJECTABLE(1) Excessive solder o

25、verhangs the castellation or land area fora convexfillet. No evidence of proper wetting.多余焊錫懸垂于或焊盤上形成了一個凸形焊接帶。明顯潤濕不良。Figure 4.244.2.4PLCC Devices4.2.4.1 Minimum Solder CoveragePage 10 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Su

26、rface Mounted Components)Date:工程師，高級工程師論壇PREFERRED(1) Solder fillet is evident and extends onto the inner surface of the lead and covers all four sides of the lead and land.焊接帶明顯且延伸到引腳內表面并且引腳四面和焊盤潤濕良好。(2) Solder fillet extends 25% up the lead height (H).焊接帶延伸至引腳高度的 25% 。Figure 4.25ACCEPTABLE(1) Sold

27、er fillet is evident on at least 3 sides of the lead with solder cover at least 50% of the lead width (W).至少引腳的三面覆蓋有焊錫形成了明顯的焊接帶且至少為引腳寬度的 50% 。(2) Solder fillet must extend at least 10% up the lead height (H).焊接帶至少延伸至引腳高度的 10% 。Figure 4.26REJECTABLE(1) Insufficient solder cover less than 3 sides of t

28、he lead and 50% of the lead width (W).，引腳覆錫少于 3 面且每面少于引腳寬度的 50% 。(2) Solder fillet extends less than 10% of the lead height (H).焊接帶沒有延伸至引腳高度的 10% 。Figure 4.27um Solder Coverage4.2.4.2多錫Page 11 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Pa

29、rt 2 : Surface Mounted Components)Date:工程師，高級工程師論壇PREFERRED(1) Solder fillet is evident and extends onto the inner surface of the lead and covers all four sides of the lead and land with no evidence of overhang.焊接帶明顯且延伸至引腳的內表面，引腳四面和焊盤沒有焊料懸垂。(2) Solder fillet extends 25% up the lead height (H).焊接帶延伸至

30、引腳高度的 25% 。Figure 4.28ACCEPTABLE(1) Solder fillet is evident and covers all four sides of the lead and solder overhang the land must not be greater than 50% of the lead width (W).焊接帶明顯并且引腳四面覆有焊錫，焊錫懸垂不得超過引腳寬度的 50% 。(2)um solder fillet extends up the leadis 50% of the lead height (H).最大焊接帶為引腳高度的 50% 。

31、Figure 4.29REJECTABLE(1) Solder fillet overhangs the land more than 50% of the lead width (W) with no evidence of proper wetting.焊接帶懸垂在焊盤上，大于引腳寬度的50% ，明顯的潤濕不良。(2) Excessive solder extends more than 50% up the lead height (H).多余焊錫超出引腳高度的 50% 。Figure 4.30Page 12 of 43Corporate Quality Assurance Depart

32、mentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇4.2.4.3Unsoldered Connection & Bridging未焊接與橋接PREFERRED(1) Good wetting of solder within the boundaries of the pad. The wetting angle of the solder to the component and to the pad is

33、less than 90 degrees.焊盤分界線潤濕良好。元件與焊盤之間的焊接潤濕角小于 90。Figure 4.31REJECTABLE(1) No wetting or bonding between the lead and the terminal pad.在引腳與終端焊盤之間沒有潤濕或沒有結合物。Figure 4.32REJECTABLE(1) Solder projects beyond the pad or leadfora short circuit between adjacentpads, leads or traces.焊錫突出焊盤與引腳，在相鄰的焊盤、引腳或跡線之間

34、形成短路。Figure 4.33Page 13 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇4.2.5SOIC Devices ( Gull-Wing )4.2.5.1 Minimum Solder Coverage最少焊錫覆蓋PREFERRED(1) Solder fillet is evident and wetted on

35、 all four sides of the lead and land.焊接帶明顯 ，引腳四面與焊接面潤濕良好。Figure 4.34ACCEPTABLE(1) At least 50% of perimeter of each lead have good wetted solder fillets with solder cover at least 50% of the lead side (L), 50% of the lead width (W) and 50% of the lead thickness (T).每個引腳周長至少 50% 焊接帶潤濕良好， 且至少引腳長寬高的 50

36、%覆有焊錫。(2) Must have sufficient solder to form a properly wetted fillet.必須形成一個適當潤濕的焊接帶。Figure 4.35REJECTABLE(1) Insufficient solder cover less than 50% of perimeter of the lead with solder cover less than 50% of the lead side (L) and / or less than 50% of the lead width (W) and / or less than 50% of

37、the lead thickness (T).，每個引腳周長少于 50% 焊接帶潤濕且引腳長寬高覆錫少于 50% 。Figure 4.364.2.5.2um Solder Coverage多錫Page 14 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇PREFERRED(1) Solder fillet is evident a

38、nd wetted on all four sides of the lead and land.焊接帶明顯且引腳四面與焊接面潤濕良好。Figure 4.37ACCEPTABLE(1) Solder wetted on all sides of the lead and extends less than 50% of the distance (D)between the upper and lower bs.引腳的所有面均潤濕，且小于上下彎曲點間距離的 50% 。um height of the solder joint (H) is 3 times the lead thickness

39、(T).焊點的最大高度是引腳厚度的 3 倍。(2)Figure 4.38REJECTABLE(1) Excessive solder cover the whole lead and extends more than 50% of the distance (D) between the upper and lowerbs.整個引腳多錫覆蓋，且超出上下彎曲點之間距離的 50% 。(2) The height of the solder joint (H) is greater than 3 times the lead thickness (T).焊點高度大于引腳厚度的 3 倍。Figure

40、 4.39Page 15 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇4.2.6QFP Devices ( Gull-Wing )4.2.6.1 Minimum Solder CoveragePREFERRED(1) Solder fillet is evident and wetted on all four sides of

41、 the lead and land.焊接帶明顯，引腳四面與焊接面潤濕良好Figure 4.40ACCEPTABLE(1) At least 50% of perimeter of each lead have good wetted solder fillets with solder cover at least 50% of the lead side (L), 50% of the lead width (W) and 50% of the lead thickness (T).每個引腳周長至少 50% 焊接帶潤濕良好， 且至少引腳長寬高的 50%覆有焊錫。(2) Must have

42、sufficient solder to form a properly wetted fillet.必須形成一個適當的焊接帶。Figure 4.41REJECTABLE(1) Insufficient solder cover less than 50% of perimeter of the lead with solder cover less than 50% of the lead side (L), less than 50% of the lead width (W) and / or 50% of the lead thickness (T).，每個引腳周長少于 50% 焊接帶

43、潤濕且引腳長寬高覆錫少于 50% 。Figure 4.42Page 16 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇4.2.6.2um Solder Coverage多錫PREFERRED(1) Solder fillet is evident and wetted on all four sides of the lead

44、and land.焊接帶明顯且引腳四面與焊接面潤濕良好Figure 4.43ACCEPTABLE(1) Solder wetted on all sides of the lead and extends less than 50% of the distance (D)between the upper and lower bs.引腳的所有面均潤濕，且小于上下彎曲點間距離的 50% 。um height of the solder joint (H) is 3 times the lead thickness (T).焊點的最大高度是引腳厚度的 3 倍。(2)Figure 4.44REJEC

45、TABLE(1) Excessive solder cover the whole lead and extends more than 50% of the distance (D) between the upper and lowerbs.多錫覆蓋整個引腳，且大于上下彎曲點間距的 50% 。(2) The height of the solder joint (H) is greater than 3 times the lead thickness (T).焊點高度大于引腳厚度的 3 倍。Figure 4.45Page 17 of 43Corporate Quality Assuran

46、ce DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇4.2.6.3Cold Solder Joint & Flux Residue冷焊與助焊劑殘留物PREFERRED(1) Solder is smooth, bright, continuous and feathered to a thin edge indicating proper flow and wetting action.焊接光滑

47、、明亮連續(xù)性良好，有一個羽翼狀的顯示出良與潤濕。Figure 4.46REJECTABLE(1) Solder connection exhibiting poor wetting and a grayish, porous / lumpy appearance due to insufficient heat, inadequate cleaning prior to soldering or excessive impurities in the solder.焊接顯示出潤濕不良，灰暗、多孔狀/粗糙，這是由于加熱不足或焊接前沒有清潔或焊料中有過多的雜質。Figure 4.47REJECTA

48、BLE(1) Flux is entrapped between lead and land, reducing or preventing metallic continuity. 引腳與焊接面間有助焊劑，降低或阻礙了金屬間的熔合。Figure 4.48Page 18 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇4.2.6.4

49、Conductor & Pad Lifted And Lead Unsoldered 導線與焊盤和引腳未焊PREFERRED(1) Solder is smooth, bright, continuous and feathered to a thin edge indicating roper flow and good wetting action.焊接光滑、明亮、連續(xù)性，有一個羽翼狀的，呈現出良與潤濕。(2) Land area has total adhesion to board base laminate with no evidence of heat related damag

50、e.焊接區(qū)域總體粘著在基板上，沒有加熱引起的損壞。Figure 4.49REJECTABLE(1) No wetting or bonding between the lead and the terminal pad.在引腳與終端間沒有潤濕或形成結合物。Figure 4.50REJECTABLE(1) Land area and / or lead separating from base laminate due to overheating of connection.由于焊接過熱而導致焊接區(qū)域和/或引腳與基板分離。Figure 4.51Page 19 of 43Corporate Qu

51、ality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程師，高級工程師論壇4.2.7Flush Terminations4.2.7.1 Solder CoveragePREFERRED(1) Solder fillet is evident along the entire length of the termination.整個終端長度形成一個焊接帶。(2) No evidence of

52、lead detachment.引腳沒有明顯的分離。Figure 4.52ACCEPTABLE(1) Solder fillet is evident and covers at least 50% of the termination length (L).焊接帶明顯，至少終端長度的 50%覆有焊錫。(2) If the lead is partially detached, at least 75% of the termination length (L) must be attached and soldered.如果引腳部分分離，至少終端長度的 75%接觸焊錫。Figure 4.53

53、REJECTABLE(1) Insufficient solder covers less than 50% of the termination length (L).，引腳覆錫少于 50% 的引腳長度。(2) If the lead is partially detached, less than 75% of the termination length (L) is attached and soldered.如果引腳部分分離，少于終端長度的 75%接觸焊錫。Figure 4.54Page 20 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29