電路板PCB工程師英文EQ整理

1、1 基本信息（1） 問題：the board thickness(2.36+/-0.05mm) is too hard to control for us 對我們來說，板厚2.36+/-0.05mm太難管控 建議：Can we control the finished board thickness as 2.4+/-10%mm？Please comfirm! 請確認(rèn)我們可否控制完成板厚為2.4+/-10%mm？（2） 問題：As show in figure, manufacturing requirements specification, using 17 um (1/2 oz) bas

2、ed copper, finished surface copper: 46 um (0.00181 "); it is different from what shows 1oz for stackup.如下圖所示，制作說明要求使用17um基銅，完成銅厚46um.這跟疊構(gòu)中的1OZ銅厚不符.建議：Use 1 oz based copper, finished surface copper: 46 um (0.00181 ") 使用1oz基銅，完成銅厚46um.（3） 問題：As show in the below figure, outer copper is 1 oz.

3、We cant make sure whether the finished surface copper is 1 oz. 如下圖所示，外層銅厚為1OZ，我們不能確定完成銅厚是否為1OZ. 建議：Using Hoz base copper, finished surface 1 oz copper; 使用H oz基銅，成品銅厚為1oz.（4） 問題：The stack-up your company provided did not conform the requirements of impedance, and the inner layers need to use 3 Pre-pr

4、eg.貴司提供的疊構(gòu)不符合阻抗要求，且內(nèi)層需要用3張pp建議：Adjust the thickness of the Pre-preg and the core。See below. 調(diào)整芯板和PP的厚度，見下圖（5） 問題：The make-up like as the attachment （12PCS/PNL），in order to save the costing ,please confirm if can accept 3 X-OUT per panel? 如附件所示拼版（12pcs/PNL），為了節(jié)約成本，請確認(rèn)可否接受每個拼版內(nèi)有3個打叉板？ 建議：Accepted 3 X-

5、OUT per panel,but not exceed 5% of order quantity.And pack them separately when shipping. 接受每拼版出3個打叉板，但不超過總訂單數(shù)的5%，且出貨時把打叉板分開包裝.（6） 問題：As show in figure, Your company requirements according to level 3 standard controls, this requirement is too hard to control for us 如下圖所示，貴司要求按3級標(biāo)準(zhǔn)管控，我們較難管控. 建議：Contr

6、olled by level 2 standard production. 按2級標(biāo)準(zhǔn)管控生產(chǎn).（7） Please confirm the attached panel drawing.請確認(rèn)附件拼版圖（8） Above is our suggested stackup，please confirm. 上圖為我司建議疊構(gòu)，請確認(rèn).（9）問題：Your company have not provided the tolerance of board thickness，please confirm whether we could control it as 1.6mm+/-10%？貴司沒有提

7、供板厚公差，請確認(rèn)我司可否按1.6mm+/-10%來管控？（10）問題：We can't find the finish copper thickness and solder mask color in spec ,please provide. 我們在說明書中找不到完成銅厚和防焊顏色，請?zhí)峁?建議：Finish copper thickness:1oz, SM color: matte green 完成銅厚1OZ 防焊顏色：啞光綠色（11）問題：Please see Fig1,the number in gerber is different from "HIT-20-0

8、01200-001" in spec. 請看圖一，gerber中的料號跟說明書中的"HIT-20-001200-001"不相符. 建議：We will ignore this difference and follow the gerber file to produce this board. 我們將忽略這個不同點，然后按照gerber來制作. （12）問題：The customer requires use FR - 402 material, but we have not this kind of sheet material . 客戶要求使用FR-402

9、板材，但我們沒有這種板材. 建議：We will use our common material production，Please confirm！Like KB6160 or equivalent instead of FR-402. 我們將使用常用的板材生產(chǎn)，請確認(rèn).像KB6160或同等級的板材來代替FR-402. （13）問題：In order to avoid the panel board scraped in process, we would like to change the sharp corner to round angle as R1.0mm. 為了避免板子在生產(chǎn)過

10、程中刮花，我們將尖的角倒角為R1.0mm 的角. （14）問題：See below figure，50 Ohm impedance is controlled in the gerber, butthe e-mail indicated that had no controlled impedance;Actually, the calculation also cannot reach 50 Ohm impedance values . 見下圖，gerber中要求做50ohm阻抗控制，但郵件中說明不用做阻抗控制。事實上也達不到50ohm阻抗值. 建議：Ignore the impedance

11、 control. 忽略阻抗控制. （15）問題：There is no 60mil core on our store，we will adjust the stackup as below fig. B show. 我們倉庫沒有60mil的芯板，我們將調(diào)整疊構(gòu)，如圖B所示. （16）問題：It is too hard to keep conductor widths and spacing within 15% of data for us. 要將線寬距控制在+/-15%，對我們來說太難了 建議：We suggest to relax it as +/-20% to process . 我

12、們建議放寬到+/-20% （17）問題：You do not specify the incept standard. We will follow IPC-A-600G Class2 and IPC-6012B Class2 to build this board. 貴司沒有指明驗收標(biāo)準(zhǔn)，我們將根據(jù)IPC2級標(biāo)準(zhǔn)來生產(chǎn)板子. （18）問題：It doesnt specify thickness of Ni and Au. 沒有說明鎳和金的厚度. 建議：We will control as : Ni: 3-6um min and Au0.05um 我們將管控為：鎳最少3-6um，金0.05um

13、 （19）問題：We cant input the four files（see below fig.） by our software 用我們的軟件打不開下圖的4個文件. 建議：We will ignore the four files. 我們將忽略這4個文件. （20）問題：We are not sure the surface finish of this board，because the requirement of two files are different.（See below pictures.） 我們不能確定這個板的表面處理，因為2個文件的要求不同.（見下圖） 建議：We

14、 will follow immersion gold to produce.( Au:0.05um(min),Ni:3-6um) 我們將按沉金制作.（金厚最少0.05um，鎳厚3-6um） （21）問題：Please see below picture, the dimension between the gerber and the drawing is different. 請看下圖，圖紙和gerber的尺寸不一樣. 建議：We will follow gerber file to produce. 我們將依gerber制作. （22）問題：We dont know the usage

15、of these file ,and we think them have nothing to do for PCB manufacture. 我們不知道這些文件的用處，我們認(rèn)為他們對PCB生產(chǎn)沒有影響. 建議：We will ignore it. 我們將忽略他們. （23）問題：We don't have the standard of the " BS EN0249-2-12:1994" in hand. 我們沒有" BS EN0249-2-12:1994"的標(biāo)準(zhǔn)控制. 建議：We will ignore this standard and

16、 follow IPC-4101B standard to produce. 我們將忽略這個標(biāo)準(zhǔn)，然后按IPC-4101B標(biāo)準(zhǔn)來生產(chǎn). （24）問題：In the future, for the same series, if we meet the same questions like as above, we will use the answer directly 后續(xù)問題中，如有類似以上問題，我們將直接使用這次的回復(fù)來生產(chǎn).2 文字（1） 問題：Some fonts are close to pads, into holes or outside of the board outli

17、ne.一些文字太靠近pad，進孔或到了板外.建議：We will move them if possible, otherwise we'll clip them, please confirm. 如果可能，我們將文字移動，否則我們會修剪文字，請確認(rèn).（2） 問題：We will add the UL,including our logo and date code(WWYY) at free area on the top silkscreen layer. 我們將在頂層文字的空曠位置添加UL，包括我們的標(biāo)記和周期.（3）問題：In order to identify the boa

18、rd easily, we would like to add our internal part number on the breakaway rails.（or near our company UL） 為了更好地區(qū)分板子，我們想要在工藝邊上添加我司料號.（或在我司UL附近）（4）問題：We turn the logo to "BLDT D-B" on the bottom silkscreen or not?Please confirm. 請確認(rèn)我們可否將底層文字的UL改為"BLDT D-B"？ （5）問題：You request to add

19、UL and date code（WWYY）on the appointed position , but the drawing without appointed position 。We will add our company UL and date code（WWYY） on bottom silkscreen layer as below fig. 貴司要求在指定位置添加UL和周期（WWYY），但圖紙上沒有標(biāo)出指定的位置.我們將在底層文字添加我司UL和周期(WWYY)，見下圖. （6）問題：Some White oil block are printed on the pads,

20、it will affect the solderability of the pads. 一些白油塊在pad上，這會影響pad的焊接性能. 建議：We will modify the legend to avoid them exposing on the pads. 我們將修剪文字來避免他們上pad.(7) 問題：Some fonts are too close to the outline,it may cause the fonts to be incomplete after manufacturing. 一些文字太靠近外形線，這可能會導(dǎo)致加工后文字出現(xiàn)殘缺. 建議： Reduce

21、the font size to accommodate the tight space if possible，otherwise accept the incomplete fonts. 如果可能的話，縮小文字到一個小空間內(nèi)，否則就接受文字殘缺.（8） 問題：Tthere is no enough space for adding the UL and date code on the top silkscreen layer 頂層文字不夠空間添加UL.和周期建議：A：We will add them on the bottom silkscreen layer. B：We will ad

22、d them on the top soldermask layer. A：在底層文字添加 B：在頂層防焊添加（9） 問題：Some legend are not mirrored on the bottom sides. 在底層中，有一些文字沒有鏡像. 建議：A：we will follow geber to produce and accept the legend are inverse.B:we will mirror it.A：我們將依gerber生產(chǎn)，要接受反字.B：我們將鏡像制作.（10） 問題：The legend is very close to dummy copper p

23、ads in the working gerber. 在工作稿中的文字太靠近焊盤. 建議：A:We will shave the dummy copper pads to avoid the illegible legend.B: Follow working gerber to build,and the illegible legend is acceptable A：我們將削銅粒來避免文字模糊. B：依工作稿制作，接受文字模糊. （11）問題：In order to avoid the silkscreen is missing, we will add the check patter

24、ns on the breakaway rail. 為了防止漏印文字，我們將在工藝邊添加測試圖案.3 防焊（1） 問題：Spacing between IC pads are 6.7mil and 7.5mil. We need 7.8mil to keep the solde rmask dam.Becausethe solder mask ink are blue color which is out of our capability to build the blue solder mask dam. IC之間的距離是6.7和7.5mil，我們需要7.8mil的距離來做防焊橋.因為防焊

25、顏色為藍色，這樣距離的藍油橋超出我們的制程. 建議：We suggest canceling the solder mask dam where the IC spacing is less than 7.8mil and make gang relief. Please confirm is that acceptable. 我們建議在小于7.8mil的地方取消做防焊橋，然后按開通窗制作.請確認(rèn)是否接受.（2） 問題：Spacing between the BGA PAD and via hole is only 9.8mil, and there's solder mask dam

26、. The spacing is too small to keep dam. BGA到過孔的距離只有9.8mil，而且要做防焊橋.這個距離太小，不能做橋. 建議：We will remove the via's (not the BGA pads) openings 我們將移除過孔的開窗（不是BGA的開窗）.（3） 問題：The 29mil component holes without solder mask openings on bottom sides,the solder mask ink will flow into holes 29mil的元件孔在底面沒有開窗，油墨會進

27、孔. 建議：A) We add solder mask openings for hole, Make sure the oil is not on the PAD and not flow into the hole.B) We follow the GERBER to do ,Please confirm the solder mask ink will flow into holes are accepted. A：我們將為這些孔添加防焊開窗，確保油墨不上pad和油墨不進孔.B：我們根據(jù)gerber制作，請確認(rèn)可接受油墨進孔. （4）問題：See below figure,there i

28、s one pad on the bottom paste layer, but it without soldermask opening on the bottom solder layer. 見下圖.貼片層上有一個pad沒有開窗. 建議：A：follow the gerber. B:Add soldermask opening that is 8mil bigger than the pad. A：依gerber制作. B：加一個比pad大8mil的開窗. （5） 問題：The 1.0mm holes with soldermask opening on the top solderma

29、sk layer ,but the bottom layer.Please comfirm our suggestion 1.0mm的孔在頂層有開窗，但底層沒開窗。請確認(rèn)我們的建議. 建議：A：Follow the gerber to process. 按gerber生產(chǎn). B：Add the soldermask opening for the holes on the bottom layer，the size is the same as the top. 在底層添加開窗，大小跟頂層一樣.（6） 問題：The soldermask opening of dia.0.40mm holes

30、is only 8mil bigger than the via holes. 直徑0.40mm的孔防焊開窗只比過孔大8mil.建議：A：Cancel the soldermask opening of via holes，the via holes plugged with solder mask is accepted. 取消過孔的防焊開窗，接受過孔塞油. B：follow the gerber，and accept solder mask into the hole but no plugging 依gerber制作，接受油墨入孔，但不塞孔.（7） 問題：The two dia.3.2m

31、m holes are specified as PTH in drill chart .But the soldermask opening is less than the pads on bottom soldermask layers.分孔表上直徑3.2mm的孔是制作為PTH，但在底層防焊層里，開窗比pad小.建議：We will follow gerber to produce，and allow the solder mask encroach onto these pads. 我們將根據(jù)GERBER生產(chǎn)，然后接受油墨上pad.（8） 問題：Some solder mask ope

32、ning for the fiducial mark is too big that it caused nearboring trace exposed in the working gerber. 一些光學(xué)點的開窗太大，導(dǎo)致工作稿中他們鄰近的導(dǎo)線露銅. 建議：We will trim the solder mask opening to avoid the trace exposed. 我們將修改防焊開窗來避免銅線外露.（9） 問題：There is no solder mask opening on one side for the via hole 16mil. 16mil的孔有一面防

33、焊沒開窗. 建議：A：Plug these via holes with solder mask ink. B：Add solder mask opening both sides for the via hole 16mil. A:塞孔制作. B：16mil的孔雙面開窗.4 線路（1） 問題：Fab spec indicates controlled impedance, but doesn't indicate the trace width/gap and which layer(s). 說明書要求控制阻抗，但沒有指明阻抗線是哪層和線寬距. 建議：Please provide,

34、or please confirm if we can ignore the impedance request 請?zhí)峁蛘埓_認(rèn)我們是否可以忽略這個阻抗要求（2） 問題：The fiducial marks are isolated so they can easily peel off during production. 光學(xué)點是孤立的，所有生產(chǎn)時容易脫落.建議：We will add the protective copper ring around them. Please confirm is that acceptable. 我們將在他們周圍添加保護環(huán)。請確認(rèn)可否接受. （3）

35、問題：Vias to be covered per the additional requirement. 過孔制作方式按照特別要求. 建議：there are 8mil, 10mil and 12mil holes, so we will treat all of them as "vias", plug and cover them with solder mask by removing the solder mask openings on both sides if any, and leave the other holes (24mils and greate

36、r) solder mask as design, correct? 我們把8mil, 10mil和12mil的孔定為過孔，在每一面通過去掉防焊開窗來使他們?nèi)停裨O(shè)計那樣把其他的孔（24mil或更大的）開窗制作，正確嗎？（4） 問題：3 tooling holes (3.2mm NPTH) to be added on rails per the additional requirement. 按照特殊要求添加3個3.2mmNPTH在工藝邊上.建議：We suggest adding tooling holes on all 4 corners of the rails to provide

37、 more flexibilities during PCB manufacturing and assembly, and add 3 fiducials (1mm round pads, 3mm solder mask openings) on 3 corners to be "fool-proof", is that acceptable? 我們建議在工藝邊的4個角添加定位孔，來使更適合PCB生產(chǎn)和裝配.在3個角上添加3個光學(xué)點（1mm大小，3mm開窗）來防呆，能接受嗎？ （5） 問題：In order to facilitated in production， we

38、 will remove the no-function isolated pads on the inner layers. 為方便生產(chǎn)，我們將刪除內(nèi)層里一些無功能的孤立pad. （6）問題：Some solder mask openings are very big and exposing the surrounding copper planes. 一些防焊開窗太大，會導(dǎo)致銅皮外露. 建議：We will reduce the solder mask openings to our default pad opening size, and if there's still a

39、 risk of exposing the surrounding copper, we will shave the copper plane a little to avoid exposure, is that acceptable? 我們將會對不正常的防焊開窗縮小，如果仍然有銅外露的風(fēng)險，我們將會削一點銅皮來避免外露，能接受嗎？ （7）問題：Outer layers to be 2.1mil (1.5oz, we consider it as nominal) per provided stackup, but due to the tight spacing (5.8mil only

40、) on this design we can only use 0.5oz base copper. 所提供的疊構(gòu)中，外層銅厚為2.1mil（1.5oz，我們認(rèn)為這是近似值），但由于設(shè)計上緊密的線距（只有5.8mil），我們只能用0.5oz的基銅來制作. 建議：We will use 0.5oz base copper and plate to minimum 1oz copper on outer layers, is that acceptable? 我們將使用0.5oz底銅，然后外層最少電鍍到1oz銅厚，這能接受嗎？（8） 問題：Inner layers to be 2oz per p

41、rovided stackup, but the spacing on inner layers is tight, also we can't follow the provided stackup on the dielectric thickness under outer layers because they are too thin for 2oz copper.根據(jù)所提供的疊構(gòu)，內(nèi)層要做2oz，但是內(nèi)層的線太密，滿足外層的阻抗的條件下，我們不能使用所提供的疊構(gòu).因為在2oz的銅厚條件下，介電物質(zhì)太薄了. 建議：Option A: to use 1oz copper on

42、inner layers, and we don't need to change the stackup and impedance trace widths;Option B: to use 2oz copper on inner layers, but need to change the stackup and impdance trace widths. 建議A：內(nèi)層使用1oz銅厚，這樣我們就不需要調(diào)整疊構(gòu)和阻抗線的線寬. 建議B：內(nèi)層使用2oz銅厚，但需要調(diào)整疊構(gòu)和阻抗線的線寬. （9）問題：The PAD is too closed to the outline, whi

43、ch will induce the copper exposed after process. Pad太靠近外形線，會導(dǎo)致加工后出現(xiàn)銅外露的現(xiàn)象. 建議：Shave the copper keep to the outline 8mil to avoid the copper exposed. 削銅保持距離外形線8mil，防止銅外露. （10） 問題：See your company provide the SPC, we are not sure whether to need to increase the fiducial mark on the breakaway rail.(Bec

44、ause the breakaway rail have not fiducial mark in the GERBER)根據(jù)貴司提供的說明書，我們不確定是否需要在工藝邊上添加光學(xué)點.（因為gerber中的工藝邊上沒有光學(xué)點）建議：A) We will add the 2.0mm fiducial mark and 3.0mm solder mask opening of fiducial marks on breakaway rails（see fig）.B） Do not need add fiducial mark on the breakaway rail,follow the ger

45、ber to do.A：我們將在工藝邊上添加2.0mm的光學(xué)點，開窗3mm.（見圖）B：不需要再工藝邊上加光學(xué)點，按gerber制作.（11） 問題：We will add the V-cut testing pads to avoid V-cut being missed. 我們將添加V-CUT測試pad來防止漏V-CUT.（12）問題：In order to balance the plating electric current, we would like to add dummy copper foil （copper pads）on the breakaway rails. 為了平

46、衡電鍍的電流，我們想要在工藝邊上添加銅皮.（銅pad） （13）問題：See below figure，the copper is too close to the outline，it would cause the copper exposed. 見下圖，銅皮到外形線太近，這會導(dǎo)致銅皮外露. 建議：A：accept exposed copper. B：shaving the copper，keep it 10mil from outline and 16mil from V-CUT line.A：接受露銅.B：削銅，使之距離外形線10mil，距離V-CUT線16mil. （14）問題：In

47、ner and outer layers in the gerber have meaningless line. Gerber的內(nèi)層和外層存在無意義的線. 建議：A：follow the gerber. 依gerber制作. B：Delete the meaningless line 刪除無意義的線. （15）問題：This board is a bare board without copper.we will build without fiducials. 這是一個光板，我們將不加光學(xué)點.5 金手指（1）問題：In order to plate the gold on finger.W

48、e will add the leading plating line as the below picture. 為了電金手指，我們將添加如下圖的電鍍線.（2） 問題：We found the area of gold finger have solder mask dam in the Gerber. 我們在gerber中發(fā)現(xiàn)金手指位置有阻焊橋. 建議：To aviod the solder mask dam affects the function gold finger,we will cancel it and add the full solder mask opening for

49、 the area of gold finger. 為了避免阻焊橋影響金手指的功能，我們將刪除阻焊橋和在金手指位置開通窗.（3） 問題：No specify the depth tolerance of gold finger bevel edge. We will build gold finger bevel edge depth tolerance as ±0.2mm. 沒有說明金手指斜邊的公差，我們將按+/-0.2mm制作.（4） 問題：The gold finger is too close to the outline.It will cause the copper e

50、xposed.金手指太靠近外形線，這會導(dǎo)致銅外露.建議：A:To clip gold finger to get 52mil (min) space to avoid copper exposed.B: Follow Gerber to do, please accept copper exposed.A：修剪金手指，保證離外形最少有52mil的距離，防止銅皮外露.B：依GERBER制作，請接收銅外露.（5） 問題：It does not specify the bevel angle tolerance. 沒有說明斜邊角度的公差. 建議：The bevel angle as ±5&

51、#176; to control. 斜邊角度按+/-5°來管控.（6） 問題：The gold finger outside is the breakaway rail ，we can't make the gold finger chamfer.金手指邊沿是工藝邊，我們做不了金手指的斜邊.建議：A：Canel the breakaway on gold finger side. B：Don't make the gold finger bevel edge. A：在金手指那邊取消工藝邊. B：不做金手指斜邊.6 鉆孔丶成型 （1）問題：The0.35mm holes

52、 diameter tolerance :±0.05mm is too hard to control. 0.35mm的孔公差+/-0.05mm太難管控. 建議：This kind of holes diamater tolerance：±0.076mm 這類孔的公差為+/-0.076mm （2）問題：The quantity of holes are different between excel spec and gerber file. Excel文檔跟gerber的孔數(shù)不同. 建議：We will follow gerber file to do and ignore the difference 我們將根據(jù)gerber來制作，忽略這個不同點. （3）問題：some data can't measure in drawing , suggest to ignore it and follow the GERBER to do。 圖紙上的一些數(shù)據(jù)測量不了，建議忽略他們，然后根據(jù)gerber來制作. （4）問題：Customer did not identify the