Wire bonding workmanship standard

1、Non Sticking on Pad 球起球起 REJECT Ball bond lifted from the bond pad.拒受標準拒受標準 : : 焊球脫離焊位 。DIELifted ball bond REJECT if gold ball did not stick on bond pad. Ball bond mark is observed on bond pad and gold ball is on the bondfinger. 拒受標準拒受標準 : : 焊球不能黏住焊位上。焊位上有咀印, 及腳仔上留有金球。 REJECT if gold ball did not s

2、tick on bond pad. Ball bond mark on bond pad is hardly seen, however, gold ball is observed on the bondfinger.拒受標準拒受標準 : : 焊球脫離焊位 。若焊位上咀印難以看見 , 但腳仔上亦會留有金球。DIEGold ball onbondfingerBall bond mark(uneven circular mark)Bond padDIEGold ball onbondfingerBond padBall bond mark ishardly seen on bond padSpe

3、c # : GETH0001-PRVisual Aid # 1 Rev. ACopy : 3/O Machines 12Size : 100% A4Non Sticking on Lead 腳腳起起 REJECT if stitch bond lifted from the bondfinger.拒受標準拒受標準: 腳焊口與腳仔脫離 。DIELifted stitch bondMisplaced Ball 球走位球走位 REJECT if 25% of ball bond is outside the bond pad area.拒受標準拒受標準: 焊球超出焊位外, 面積大過 25 % REJ

4、ECT if stitch bond lifted from the ring.拒受標準拒受標準: 腳焊口與環(huán)脫離。 Spec # : GETH0001-PRVisual Aid # 2 Rev. ACopy : 3/O Machines 12Size : 100% A4Bond Short 球踏線路球踏線路 REJECT if ball bond shorted to another ball bond. 拒受標準拒受標準 : 焊球與焊球互相連接。Lifted Meta0l 起鋁起鋁 REJECT if ball bond lifted together with the Aluminum

5、pad. 拒受標準拒受標準 : : 焊球連同鋁層脫離焊位。 REJECT if ball bond shorted to adjacent metallization not common to the bond pad. 拒受標準拒受標準 :焊球與不相通的鋁層線路連接。 ball to ball shortball short tometalDIELifted metalSpec # : GETH0001-PRVisual Aid # 3 Rev. ACopy : 3/O Machines 12Size : 100% A4Broken Wire 斷線斷線 REJECT if broken a

6、t ball neck. 拒受標準拒受標準 : : 焊球頸位上金線斷開。DIE REJECT if broken at any part of wire span. Some portion on gold wire observed on substrate surface. 拒受標準拒受標準 : : 金線上任何部份斷開。 在底板上仍然留有斷開的金線部份。DIEGold Ball BondDIEDIE REJECT if broken at any part of wire span.拒受標準拒受標準 : : 金線線長任何部份斷開。 REJECT if broken at stitch /

7、weld heel拒受標準拒受標準 : : 腳焊口頸位上金線斷開。BROKEN WIRE : REJECT if wire breaking/tearing at any point along its span from ball neck to wedge/stitch heel.斷線 : 拒受標準拒受標準 若焊球頸位至腳焊口頸位範圍內(nèi)，有金線斷開 。Break at ball neck Break at HeelSpec # : GETH0001-PRVisual Aid # 4 Rev. ACopy : 3/O Machines 12Size : 100% A4Wire Short 碰

8、線碰線WIRE SHORT : For SAME TIER, when viewed from top (X & Y) , REJECT if wire to wire separation along the wire span is less than 1.0 x wire diameter.碰線碰線拒受標準拒受標準 : 由上向下望 , 線與線之間距離小於 1 倍線直徑。 Depressed Wire 掃線掃線 Depressed Wire : REJECT if wire looping is deformed causing wire short.掃線拒受標準掃線拒受標準 :金

9、線弧度變形，引致碰線。DieDIE1 x WDDIE 1 x WDWIRE SHORT : For DIFFERENT TIER , REJECT if wire to wire separation ( Z ) between tiers is less than 1 x wire diameter.碰線拒受標準碰線拒受標準 : 多層線產(chǎn)品, 上層與下層距離小於 1 倍線直徑距離。Spec # : GETH0001-PRVisual Aid # 5 Rev. ACopy : 3/O Machines 12Size : 100% A4Wire Damage 線受損線受損 REJECT if d

10、iameter of wire is reduced to less than 75% of its original size. 拒受標準拒受標準 : 金線直徑受損 , 使直徑小於原有的 75%。 Tight Wire 線緊線緊 DIE1.0 x WD REJECT if clearance between the die edge and the wire is less than 1.0 x wire diameter 拒受標準拒受標準: 金線與晶粒邊距離小於 1.0 倍線 直徑。 REJECT if too tight that it makes a flat run from die

11、 to substrate with clearance between the die surface (outside ball periphery) and the wire less than 1.0 x wire diameter. 拒受標準拒受標準 : 若線緊與晶粒表面平行, 金線與晶粒面距離小於 1.0 倍線直徑。Au wire diameter 75% of weld/stitch area on bondfinger. 接受接受 : 如超過 75%面積焊接在腳上，可接受 。 REJECT : 75% stitch/weldon bondfinger.接受 : 如超過 75%面

12、積焊接在導上，可接受 。Critical weld/stitch areais marginally placed onbondfinger.難以分辨情況，用以上拒受標準。REJECT: if 75% stitch /weld onbondfinger.拒受 : 如少過 75%面積焊接在腳上，拒受 。Critical weld/stitch areais marginally placed onbondfinger.難以分辨情況，用以上拒受標準。Spec # : GETH0001-PRVisual Aid # 15 Rev. ACopy : 3/O Machines 12Size : 100%

13、 A4WRONG BONDING錯焊:REJECT if actual bonded unit is not connected as per build sheet.拒受拒受 : : 焊線與焊線圖不同。REBOND重焊: REJECT if more than 2 bond attempts on a bond pad.拒受拒受 : : 兩個焊球在同一焊位上。Note : traces of ball or stitch bonds visible on the bondfinger not in line with rest of the programmed 2nd bonds with

14、in the unit is not considered rebond, as, they are wire threading attempts.註：腳面的焊球印或腳焊口印，如不是與其餘的腳焊口印成一線時，這並非重焊，是由於穿線後燒球造成的。 BRIDGING METAL接鋁:REJECT if tool or ball impression on bond pad which causes squeezed metallization to bridge adjacent unglassivated metallization/scribe line except common connection.拒受拒受 : : 焊咀或焊球壓迫，使無玻璃保護的鋁層、焊位、切割通道連接在一起。MISORIENTED DIE晶粒錯方向:REJECT if die is not oriented as per build sheet.拒受拒受 : : 晶粒方向與焊線圖不同。DICE OFF晶粒起:REJECT if die is completely detached from the substrate cavity area.拒受拒受 : : 晶粒未完全按緊在晶粒黏附位上。POPPED DIE爆晶粒:REJECT if die is sheared