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CapillaryDesignConsiderationsChoosingTherighttoolforyourprocessVersion2(Oct,2001)1CapillaryDesignVersion2(OctPresentationTopicsCapillarydesignconsiderationsGeneralgeometryBondingcyclestepsThecapillaryandtheballbondingprocessApplicationDemandsBasicTerminology2PresentationTopicsCapillarydFactorsaffectingcapillarydesign
PackagetypeDesignConsiderationsBonderTypePadPitchLoopHeightPadOpen1stbondtargetWireDiameter3FactorsaffectingcapillarydeBasicTerminologyPad
SizePad
open1stbonddiameterPadspacingPad
pitch4BasicTerminologyPadSizePadoGeneralDimensions
Play->5CapillaryParametersFA–FaceAngleOR–OuterRadiusH–HoleCD–ChamferDiameterT–TipDiameterICA–InnerChamferAngleOD–OuterDiameterCA–ConeAngleL–LengthBTNKH–BottleneckHeightBTNKA–BottleneckAngle5GeneralDimensionsPlay->5CapWireBondingCycleFreeairballiscapturedinthechamferCapillaryrisestoloopheightpositionLoopformation1stbondformationHeat2ndbondformationHeatFreeAirBallformationCreationofthetaillengthDisconnectionofthetail6WireBondingCycleFreeairbalTheCapillaryandtheballBondingProcessFirstBondCD,Hole,ICAngleSecondBond
Tip,FA,ORLooping
Hole,ICType,ICAngle77TheCapillaryandtheballBonPresentationSubjectsCapillaryDefinitionChamferdiameter(CD)FaceAngle(FA)OuterRadius(OR)ConeAngle(CA)Tipdiameter(T)BottleneckHeight(BTNKH)BottleneckRadius(BTNKR)Length(l)InnerChamferAngle(ICA)Hole(H)8PresentationSubjectsCapillaryTipsizeVsPitchPitch[μm][μm]0100200300400500600024681012TipPitchSTDFPUFP[mils]3.97.811.815.719.723.69TipsizeVsPitchPitch[μm][TipDiameterandConeAngleselectionPitch-120μmLoopHeight-8.0milCap-STDPadPitch10TipDiameterandConeAngleseFirstBond
-1stbondformationaffectedby:Tip,CD&ICVolume
VFAB=Vsquash+VCD+Vneck
V
FABV
SquashV
CDV
Neck11FirstBond-1stbondf90Vs120AnglecomparisonICVolumeaffectsondifferentapplicationsICVolumeisafunctionof:CD,HandICAICAngleselection1290Vs120AnglecomparisonICEffectofInnerChamferAngle-900vs.1200
FirstBond-ICAngleWireDiameter:1[mil]ChamferDiameter:2.5[mil]F.A.B:2.7[mil]BallHeight:0.7[mil]ICAngle=9003.5[mil]ICAngle=12003.8[mil]13EffectofInnerChamferAngleBallHeightVs.ShearStrengthApparentAreaShearstrengthforunitarea:-ShearStrength-ContactAreaContactAreaisaffectedbyball-flatnessorballheight
-FlatterballhaslargercontactareaShearstrengthContactArea14BallHeightVs.ShearStrengthHolediameterselectionHoleselectionforSTD&BTNKCapsWireClearance=HoleDiameter-WireDiameter..15HolediameterselectionHoleseHoleselectionforFP&UFPCapsWireClearance=HoleDiameter-WireDiameterPitchRangeWireDiameterHoleCD(um)(Mil)Rec.Min.Min60+1.001.301.201.50550.901.201.101.35500.801.100.951.20450.700.950.851.1035ContactK&SBondingToolsHoleDiameterselection16HoleselectionforFP&UFPCaHoleVsWirediameter
WireHoleAbove12010080-9070605045120100806040200[μm]Pitch[μm]STDFAFB-FCFDFEFFFG0.81.572.363.153.944.72
[mils]17HoleVsWirediameterWireHolSecondBond-TipandFAselectionTipFAORTip[mil] RecommendedFA10andabove 0° to 4°8.0to4.3 4° to 8°4.3to2.8 8° to11°2.8andlower 4° to 8°18SecondBond-TipandFAsele
BTNKSelectionCA:20CA:30Example:Pitch-110μmLoopHeight-10.0mil19BTNKSelectionCA:20CACapillary
Length=0.375”0.437”
AutomaticM/CCapillaryLengthSelection20CapillaryLengthAutomaticM/CCCommonDesignPitch[μm]100120Above050100150200250300350400450500550[μm]WireHoleCDTip1stBond21CommonDesignPitch[μm]100120AFP&UFPDesignPitch[μm]020406080100120140160180Pitch[um]4550607080100WireHoleCDTip1stBond[μm]22FP&UFPDesignPitch[μm]02040PresentationSubjects
FaceAngle&ORTradeOffInnerChamferAngle(ICA)InnerChamferType(ICT)CapDesignVsBondingProcess
ICPortion23PresentationSubjectsFaceAngLoopingWhichcapillarytochoosefordifferentkindofloops?24LoopingWhichcapillarytochooLooping-ICTypeDoubleICSupportsthemostcommonLoopShapeapplications25Looping-ICTypeDoubleICSuLooping-D/ICinfluenceD/ICsupportStandard,Highandcomplexloops26Looping-D/ICinfluenceD/ICLooping-IRTypeInnerRadiusChamferUsefulforLong&LowloopingLoopShape27Looping-IRTypeInnerRadiuCapillary: MS416FC-0212-R35Loopheight: 100μmnominalWires: 30μmFP2Die: 80μmfinepitchTQFPLooping-IRinfluenceaveragestd.minmaxfinepitchTQFP25751.771792.5-3TSSOP30995.1861094.8-5.2LoopHeight[μm]WireDiameter[μm]PackageTypeWireSpan[mm]AverageExample:28Capillary: MS416FC-0212-R35FAandORTrade-off29FAandORTrade-off29SecondBondComparison
30SecondBondComparison3SecondBondComparisonForce:12USG:40.5Avg.Pull7.32Force:12USG:40Avg.Pull6.85FA=15FA=11FA=4Force:10USG:80Avg.Pull7.45FAComparisonteston60μmBGAPlatformPower:[MAmp]Force:[gr.]Pull:[gr.]31SecondBondComparisonForWDICDefinitionTipCDFAORWDHICApplicationMinICRecommendedSTDBTNKFPUFP0.3[mil]0.2[mil]0.15[mil]0.12[mil]32WDICDefinitionTipCDFAORWDHICATipeffecton2ndbondTip5.2Tip4.3Tip1.9Tip6.033Tipeffecton2ndbPresentationSubjects
MaterialSpecialDesigns
PackagingandCodingCapillaryFeatures34PresentationSubjectsMaterialCapillaryFeaturesD/ICIRMaterialSIGMAFlickerTBRHDHWTipFinishPackagingWearResistLengthSpecial35CapillaryFeaturesD/ICIRMateriBulkDensity(gr/cm3):3.95-3.97VickersHardness(KgF/mm2):1900-2000Avg.grainsize(um):1.1-1.5BulkDensity(gr/cm3):>4.06VickersHardness(KgF/mm2):1900-2200Avg.grainsize(um):<1.0ToughenedAlumina*StandardAlumina*TAwasintroducedtothemarketbyMicro-Swissin1995CapillaryMaterial36BulkDensity(gr/cm3):3.95-3.9SurfaceEffectsMatteFinishVs.PolishPolishedcapillaryMattefinishedcapillary37SurfaceEffectsMatteFinishVsWearresistCapillariesHardLeadFrameBonding
UndernormalbondingconditionsthecapillarymaterialdoesnotwearoutInmanycases,bondingonPalladiumLeadFramecausesacapillarymaterialwear,andshortservicelifeTheCoatedsurfacetreatmentCapillaryNoMaterialWear!!Regular38WearresistCapillariesHardLeTBR-TailBondReinforceForcontamination&shorttailssolution39TBR-TailBondReinforce39HDCapillaryDeepAccesscapillary:
Forthosecaseswherethe2ndbondshouldbelocatedveryclosetothepackagewall.40HDCapillaryDeepAccesscapillSideCut&DoubleSideCut-HWDeepAccesscapillary:Forthosecaseswherethe2ndbondshouldbelocatedveryclosetothepackagewall.41SideCut&DoubleSideCut-HFlickerCapillaryForhighfrequencyandlow-temperaturebondingprocessAdvantages:
Strong2ndbondstitchpullWiderprocesswindowLowerbondingtemperature50%shorterbondingtime42FlickerCapillaryForhighfreq
CapillaryFor70μmbondpadpitchorlowerAdvantages:
Acompletesystemsolution)USG/transducer/Capillary)Betteron-padperformance.Uptoa3μmreductionin1stbonddiameter.Upto0.5μmreductionin1stbonddiameterStandardDeviation.Highershear-uptoa25%increaseinshearresults.Efficientenergytransfer-uptoa50%reductioninpowerapplied.Increasemoldingprocessyieldusingthickwires.PatentPending.43CapillaryFor70μSpecialpackagingandcodingCorkcolorcodedforeasyidentificationAspace-saving50-unitpackageColorcodedcapillaries44SpecialpackagingandcodingCoCapillaryDesignConsiderationsChoosingTherighttoolforyourprocessVersion2(Oct,2001)45CapillaryDesignVersion2(OctPresentationTopicsCapillarydesignconsiderationsGeneralgeometryBondingcyclestepsThecapillaryandtheballbondingprocessApplicationDemandsBasicTerminology46PresentationTopicsCapillarydFactorsaffectingcapillarydesign
PackagetypeDesignConsiderationsBonderTypePadPitchLoopHeightPadOpen1stbondtargetWireDiameter47FactorsaffectingcapillarydeBasicTerminologyPad
SizePad
open1stbonddiameterPadspacingPad
pitch48BasicTerminologyPadSizePadoGeneralDimensions
Play->49CapillaryParametersFA–FaceAngleOR–OuterRadiusH–HoleCD–ChamferDiameterT–TipDiameterICA–InnerChamferAngleOD–OuterDiameterCA–ConeAngleL–LengthBTNKH–BottleneckHeightBTNKA–BottleneckAngle49GeneralDimensionsPlay->5CapWireBondingCycleFreeairballiscapturedinthechamferCapillaryrisestoloopheightpositionLoopformation1stbondformationHeat2ndbondformationHeatFreeAirBallformationCreationofthetaillengthDisconnectionofthetail50WireBondingCycleFreeairbalTheCapillaryandtheballBondingProcessFirstBondCD,Hole,ICAngleSecondBond
Tip,FA,ORLooping
Hole,ICType,ICAngle5151TheCapillaryandtheballBonPresentationSubjectsCapillaryDefinitionChamferdiameter(CD)FaceAngle(FA)OuterRadius(OR)ConeAngle(CA)Tipdiameter(T)BottleneckHeight(BTNKH)BottleneckRadius(BTNKR)Length(l)InnerChamferAngle(ICA)Hole(H)52PresentationSubjectsCapillaryTipsizeVsPitchPitch[μm][μm]0100200300400500600024681012TipPitchSTDFPUFP[mils]3.97.811.815.719.723.653TipsizeVsPitchPitch[μm][TipDiameterandConeAngleselectionPitch-120μmLoopHeight-8.0milCap-STDPadPitch54TipDiameterandConeAngleseFirstBond
-1stbondformationaffectedby:Tip,CD&ICVolume
VFAB=Vsquash+VCD+Vneck
V
FABV
SquashV
CDV
Neck55FirstBond-1stbondf90Vs120AnglecomparisonICVolumeaffectsondifferentapplicationsICVolumeisafunctionof:CD,HandICAICAngleselection5690Vs120AnglecomparisonICEffectofInnerChamferAngle-900vs.1200
FirstBond-ICAngleWireDiameter:1[mil]ChamferDiameter:2.5[mil]F.A.B:2.7[mil]BallHeight:0.7[mil]ICAngle=9003.5[mil]ICAngle=12003.8[mil]57EffectofInnerChamferAngleBallHeightVs.ShearStrengthApparentAreaShearstrengthforunitarea:-ShearStrength-ContactAreaContactAreaisaffectedbyball-flatnessorballheight
-FlatterballhaslargercontactareaShearstrengthContactArea58BallHeightVs.ShearStrengthHolediameterselectionHoleselectionforSTD&BTNKCapsWireClearance=HoleDiameter-WireDiameter..59HolediameterselectionHoleseHoleselectionforFP&UFPCapsWireClearance=HoleDiameter-WireDiameterPitchRangeWireDiameterHoleCD(um)(Mil)Rec.Min.Min60+1.001.301.201.50550.901.201.101.35500.801.100.951.20450.700.950.851.1035ContactK&SBondingToolsHoleDiameterselection60HoleselectionforFP&UFPCaHoleVsWirediameter
WireHoleAbove12010080-9070605045120100806040200[μm]Pitch[μm]STDFAFB-FCFDFEFFFG0.81.572.363.153.944.72
[mils]61HoleVsWirediameterWireHolSecondBond-TipandFAselectionTipFAORTip[mil] RecommendedFA10andabove 0° to 4°8.0to4.3 4° to 8°4.3to2.8 8° to11°2.8andlower 4° to 8°62SecondBond-TipandFAsele
BTNKSelectionCA:20CA:30Example:Pitch-110μmLoopHeight-10.0mil63BTNKSelectionCA:20CACapillary
Length=0.375”0.437”
AutomaticM/CCapillaryLengthSelection64CapillaryLengthAutomaticM/CCCommonDesignPitch[μm]100120Above050100150200250300350400450500550[μm]WireHoleCDTip1stBond65CommonDesignPitch[μm]100120AFP&UFPDesignPitch[μm]020406080100120140160180Pitch[um]4550607080100WireHoleCDTip1stBond[μm]66FP&UFPDesignPitch[μm]02040PresentationSubjects
FaceAngle&ORTradeOffInnerChamferAngle(ICA)InnerChamferType(ICT)CapDesignVsBondingProcess
ICPortion67PresentationSubjectsFaceAngLoopingWhichcapillarytochoosefordifferentkindofloops?68LoopingWhichcapillarytochooLooping-ICTypeDoubleICSupportsthemostcommonLoopShapeapplications69Looping-ICTypeDoubleICSuLooping-D/ICinfluenceD/ICsupportStandard,Highandcomplexloops70Looping-D/ICinfluenceD/ICLooping-IRTypeInnerRadiusChamferUsefulforLong&LowloopingLoopShape71Looping-IRTypeInnerRadiuCapillary: MS416FC-0212-R35Loopheight: 100μmnominalWires: 30μmFP2Die: 80μmfinepitchTQFPLooping-IRinfluenceaveragestd.minmaxfinepitchTQFP25751.771792.5-3TSSOP30995.1861094.8-5.2LoopHeight[μm]WireDiameter[μm]PackageTypeWireSpan[mm]AverageExample:72Capillary: MS416FC-0212-R35FAandORTrade-off73FAandORTrade-off29SecondBondComparison
74SecondBondComparison3SecondBondComparisonForce:12USG:40.5Avg.Pull7.32Force:12USG:40Avg.Pull6.85FA=15FA=11FA=4Force:10USG:80Avg.Pull7.45FAComparisonteston60μmBGAPlatformPower:[MAmp]Force:[gr.]Pull:[gr.]75SecondBondComparisonForWDICDefinitionTipCDFAORWDHICApplicationMinICRecommendedSTDBTNKFPUFP0.3[mil]0.2[mil]0.15[mil]0.12[mil]76WDICDefinitionTipCDFAORWDHICATipeffecton2ndbondTip5.2Tip4.3Tip1.9Tip6.077Tipeffecton2ndbPresentationSubjects
MaterialSpecialDesigns
PackagingandCodingCapillaryFeatures78PresentationSubjectsMaterialCapillaryFeaturesD/ICIRMaterialSIGMAFlickerTBRHDHWTipFinishPackagingWearResistLengthSpecial79CapillaryFeaturesD/ICIRMateriBulkDensity(gr/cm3):3.95-3.97VickersHardness(KgF/mm2):1900-2000Avg.grainsize(um):1.1-1.5BulkDensity(gr/cm3):>4.06VickersHardness(KgF/mm2):1900-2200Avg.grainsize(um):<1.0ToughenedAlumina*StandardAlumina*TAwasintroducedtothemarketbyMicro-Swissin1995CapillaryMaterial80BulkDensity(gr/cm3):3.95-3.9SurfaceEffectsMatteFinishVs.PolishPolishedcapillaryM
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