SM設(shè)備原理與應(yīng)用

SMT設(shè)備原理與應(yīng)用

PrincipleandApplicationofSMTEquipment2010.9本課程主要講述內(nèi)容，時間安排，考試安排，實驗，輔導(dǎo)和平時考勤SMT工藝流程和相關(guān)設(shè)備SMT設(shè)備概述SummarizeSMT概述與發(fā)展趨勢4學(xué)時summaryandtrend焊膏組成與印刷的方式4學(xué)時solderpastecompositionandprintingtechnology印刷機原理與應(yīng)用6學(xué)時principleandapplicationofprinter貼片機原理與設(shè)備12學(xué)時principleandapplicationofplacementmachines波峰焊原理與應(yīng)用6學(xué)時principleandapplicationofwavesolderingoven再流爐原理與應(yīng)用6學(xué)時principleandapplicationofreflowsolderingoven檢測設(shè)備

4學(xué)時inspectionequipment本課程的主要內(nèi)容IncludingSMT生產(chǎn)線參觀（印刷機、再流爐）2學(xué)時VisitingSMTproductionline(printer,reflowoven)貼片機編程原理；2學(xué)時Mounter(placementmachines)program貼片設(shè)計性實驗。2學(xué)時Placementprocessdesignexperiment實驗內(nèi)容experimentcontent期末考試：開卷，占總分60%平時：20%（作業(yè)50%+考勤40%+特別貢獻10%）實驗：20%考試方式testrules聯(lián)系方式indachuan2009@，ldc2005@輔導(dǎo)時間和地點：地點：時間：每周輔導(dǎo)時間和聯(lián)系方式SMT概述與發(fā)展趨勢SummaryandTrendsSurfacemounttechnologywasdevelopedinthe1960sandbecamewidelyusedinthelate1980s.MuchofthepioneeringworkinthistechnologywasbyIBM.ComponentsweremechanicallyredesignedtohavesmallmetaltabsorendcapsthatcouldbedirectlysolderedtothesurfaceofthePCB.Componentsbecamemuchsmallerandcomponentplacementonbothsidesofaboardbecamefarmorecommonwithsurfacemountingthanthrough-holemounting,allowingmuchhighercircuitdensities.Surfacemountinglendsitselfwelltoahighdegreeofautomation,reducinglaborcostandgreatlyincreasingproductionrates.SMDscanbeone-quartertoone-tenththesizeandweight,andone-halftoone-quarterthecostofequivalentthrough-holeparts.SMT技術(shù)發(fā)展歷史和優(yōu)點

HistoryandbenefitsSMpDIALECTExpandedFormChinesSMDSurfaceMountDevices(active,passiveandelectromechanicalcomponents)表面貼裝器件SMTSurfaceMountTechnology(assemblingandmontagetechnology)表面貼裝技術(shù)SMASurfaceMountAssembly(moduleassembledwithSMT)表面裝配SMCSurfaceMountComponents(componentsforSMT)表面貼裝組件SMPSurfaceMountPackages(SMDcaseforms)表面貼裝元件封裝形式SMESurfaceMountEquipment(SMTassemblingmachines)表面貼裝設(shè)備常用術(shù)語TermsChipResistorMELFMetalElectrodeFaceresistorschipcapacitorchipinductordiscretesemiconductorSOChipCarrierPlasticLeadlessChipCarrierLeadlessCeramicChipCarrierQuadFlatPackageBallgridarraySOSmallOutline(4to28pins)小外形結(jié)構(gòu)SOPSmallOutlinePackage(case)小外形封裝SODSmallOutlineDiode小外形封裝分立二極管SOTSmallOutlineTransistor小外形封裝分立三極管SOICSmallOutlineIntegratedCircuit小外形集成電路CCChipCarrier芯片載體LCCLeadlessChipCarrier無引線芯片載體PLCCPlasticLeadlessChipCarrier塑封無引線芯片載體LCCCLeadlessCeramicChipCarrier無引線陶瓷芯片載體MELFMetalElectrodeFaceBonding金屬電極柱形電阻QFPQuadFlatPackage四邊引腳扁平封裝BGAballgridarray球柵陣列封裝Thesolderjointcon?gurationsoftheICpackagescanberepresentedby?vemajorcategoriesGullwingleads翼型引腳J-leaddesignJ型引腳Butt-leads對接引腳leadlessBall-lead球形引腳Typesofsurfacemountassemblytechnology表面組裝技技術(shù)的類型型TypeIsurfacemountboardshaveSMCsonlyforbothsidesoftheboardsTypeIIboardshavebothSMCsandTHCsononesideoftheboardandchipcomponentsontheothersideTypeIIISMThaveTHCsononesideoftheboardandchipcomponentsontheothersideSurfacemountsolderingprocess表面組裝焊焊接類型Wavesoldering適用于通孔孔裝配技術(shù)術(shù)THT和通孔元件件THC為了減小陰陰影效應(yīng)（（shadowingeffect）,通常采用雙雙波峰技術(shù)術(shù)（dualwave）,前面是湍流波（turbulentwave）用于確保保所有的引引腳潤濕，，后面的層流波（laminarwave）用于焊接接波峰焊僅適適用于小的的SMCs，大的SMCs和行間距依依然是存在在橋接（bridge）和焊錫不不足等問題題reflowsoldering使用預(yù)配置好的焊膏（solderpaste）進行焊接，焊膏本身可以作為粘接劑焊膏用模版印刷到PCB上采用貼片機進行元件放置在回流爐（reflowoven）中多個溫區(qū)進行整體加熱焊接reflowsolderingsolderpasteservesnotonlyasasoldermaterial,butalsoasaglue.thedepositionofsolderpasteisusuallyconductedbythestencilorscreenprinting,dispensing,orpin-transferringprocesses.Thepremetereddepositionofsoldermaterialontothesitestobesolderedensuresaconsistentsoldervolumeforthejoints,andaccordinglyeliminatestheinsuf?cientsoldervolumeproblemsduetotheshadowingeffectencounteredbywavesoldering.Inaddition,thispremeteredsolderdepositionalsoreducestheincidenceofbridging.AdvantagesofsolderpastetechnologyinSMTtheuseofmassre?owprocessallowsawell-controlledgraduateheatingpro??le,thuseliminatingpotentialdamageoftheSMCsduetothethermalshockcausedbythewavesolderingtheuseofsolderpasteallowsthepossibilityofstepsoldering.thesolderingperformanceofsolderpasteisnotsensitivetothetypeofsoldermaskusedonthePCBs.Forthewavesolderingprocess,asoldermaskwithasmooth?nishisfoundtocausesolderballandbridgingproblems.AdvantagesofsolderpastetechnologyinSMT技術(shù)發(fā)展趨趨勢SurfacemounttechnologytrendsTechnologydrivingforceSmallerFasterHighercomplexityLowerpowerLowercostSpeedprocessingspeedincreasesapproximately?vetimesinevery5years;resultsfromreductioninbothon-chipdelayinsemiconductorsandpackagingdelaythisimprovementinspeediscloselyassociatedwithminiaturizationofICcomponents,asdemonstratedbythesimultaneousreductioninlinewidthsICtransistorintegrationThecomplexityofsemiconductorchipscanbemeasuredbytransistorintegration.microprocessorintegrationhasincreasedby2000××sinceitsintroductionin1970ThisincreaseincomplexityofsemiconductorchipsessentiallydrivestheevolutionofcorrespondingpackagingandassemblytechnologyComplexityPincountnumberthepincountnumberwillincreasealmost100××fromthethrough-holetechnologyintheearly1980stomodules/systempackaginginthelate1990s.ComplexityICfeaturesizeDiscretecomponentsizeMiniaturizationAreaarraypackagesPressureofspeed,complexity,andminiaturizationhavedriventheperipheralpackagedesigndownto0.3mm(16mil)pitchforQFP[17]therapidlyincreasingdefectrateassociatedwithminiaturizationofperipheraldesignwasrecognizedveryquicklyasthebottleneckinfurtherimprovementsinperformance.theassemblydefectrate(ppm)ofQFPisastrongfunctionofthepitchsize.Thedefectrateis25to40ppmfor50milpitch,andgraduallyincr