筆記本架構(gòu)及工作原理

筆記本架構(gòu)及工作原理撰稿：王小寒2006-3-1913-15.1ScreenZ-height:30-38mm(1.2-1.51)Weight:2.1-2.5kg(4.5-6Ibs)>14.1>ScreenZ-height:>=45mm(>=1.81)Weight:>3.2kg(>7Ibs)>13-15.1ScreenZ-height:38-45mm(1.5-1.71)Weight:2.5-3.4kg(5.5-7.5Ibs)8-12ScreenZ-height:variesWeight:<1.4-2.1kg(3-4.5Ibs)筆記本的分類移動(dòng)PCTransportable:全內(nèi)置Fullsize:輕薄型Thin&light:超輕薄Ultramobility總線關(guān)系框架圖處理器IntelPentiumMNewarchitecturetailoredforMobilitysegment,highperformancewithlowTDPSpecialI/Ocircuit,lowercore&I/OoperatingvoltageSpecificVcc_coreloadlineMobileIntelPentium4Desktopequivalentperformance&TDPwithenhancedProcessorpowermanagementAdvancedProcessorPowermanagementDeep/DeeperSleep(C3/C4),TM2,EISTuFCBGAforultraslimnotebookMobileProcessorMobile

processorPlatformPortabilityMobilityCPUMobileIntelPentium4PentiumMCoreVoltage(0.09umprocess)VariableVIDwith1.35VmaxVID(HFM),1.15V(BOM),0.8VDeeperSleep1.308V(HFM),0.956V(LFM)LV:1.052V(HFM),0.956V(LFM)ULV:0.892V(HFM),0.844(LFM)DeeperSleep:0.748VCoreVoltage(0.13umprocess)VariableVIDwith1.55VmaxVID(POM),1.2V(BOM),1.0VDeeperSleep1.308V(HFM),0.956V(LFM)LV:1.18V(HFM),0.956V(LFM)ULV:1.004V(HFM),0.844(LFM)DeeperSleep:0.748VPSB133/533MHZ;100/400MHZ100/400MHZPower94W24.5W;12W;7W英特爾品牌和處理器號(hào)CPU1、從RAM或Cache中讀取指令（Fetch）。2、將讀取的指令解成微指令（Decode）。3、執(zhí)行解碼后的微指令（Execute）。4、執(zhí)行后的結(jié)果存回記憶體中（WriteBack）。(CentralProcessingUnit)CPU執(zhí)行一個(gè)指令的過程分為四個(gè)步驟:北橋芯片MCH(MemoryControllerHub南橋芯片ICH(I/OControllerHub)迅馳、筆記本用P4IntelPentiumMProcessorPlatformChipsetFeatureSetMobileIntelPentium4ProcessorPlatformChipsetFeatureset使用芯片組的比較IntelPentiumMProcessorPlatformChipsetfeatureset續(xù)FeatureIntel855PMIntel855GMIntel855GMEPCIMasters666IDEATA66/100ATA66/100ATA66/100USBUSB2.0/1.1-6PortsUSB2.0/1.1-6PortsUSB2.0/1.1-6PortsPowerManagementGeyservitleIII,DeeperSleep,ACPIGeyservitleIII,DeeperSleep,ACPIGeyservitleIII,DeeperSleep,ACPIIntegratedLanMAC(w/10/100EthernetorHPNA)YESYESYESIntegratedAC’97ControllerAudio(6Channels)/ModemAudio(6Channels)/ModemAudio(6Channels)/ModemNorthHubPackage593micro-FCBGA732micro-FCBGA732micro-FCBGASouthHubPackage421mBGA421mBGA421mBGANorthHubIntel855PMIntel855GMIntel855GMESouthHub82801DBM82801DBM82801DBMSampleAvailabilityB-stepESnowN/AESnowProductionAvailabilityNowNowNowMobileIntelPentium4ProcessorPlatformChipsetfeaturesetFeatureIntel852PMIntel852GMEIntel852GMProcessorPositionedMobileIntelPentium4ProcessorIntelCeleronProcessorMobileIntelPentium4ProcessorIntelCeleronProcessorMobileIntelPentium4ProcessorMobileIntelCeleronProcessorIntelCeleronProcessorPSBSpeed533MHz/400MHz533MHz/400MHz400MHz#SODIMMS/MAXMemory2SO-DIMMS/2GBSystemMemory2SO-DIMMS/2GBSystemMemory2SO-DIMMS/1GBSystemMemoryMemoryTypeDDR333/266DDR333/266DDR200/266ECC/ParityYESYESNOGraphicsAGP4xAGP4xorIntegrated32-bit3D/2DgfxcorewithDynamicVideoMemoryTechnologyIntegrated32-bit3D/2DgfxcorewithDynamicVideoMemoryTechnologyMaxPanelDisplayResolutionN/ALVDS:UptoUXGA(1600*1200)Digital-AnalogConverterforCRT:QXGA(2048*1536)LVDS:UptoUXGA(1600*1200)Digital-AnalogConverterforCRT:QXGA(2048*1536)DualDisplayOptionsN/AConcurrent/SimultaneousConcurrent/SimultaneousSoftwareSupportN/AIntelExtremeGraphics2technologyIntelExtremeGraphicstechnology續(xù)FeatureIntel852PMIntel852GMEIntel852GMPCIMasters666IDEATA66/100ATA66/100ATA66/100USBUSB2.0/1.1-6PortsUSB2.0/1.1-6PortsUSB2.0/1.1-6PortsPowerManagementEIST,DeeperSleep,ACPIEIST,DeeperSleep,ACPIEIST,DeeperSleep,ACPIIntegratedLanMAC(w/10/100EthernetorHPNA)YESYESYESIntegratedAC’97ControllerAudio(6Channels)/ModemAudio(6Channels)/ModemAudio(6Channels)/ModemNorthHubPackage732micro-FCBGA732micro-FCBGA732micro-FCBGASouthHubPackage421mBGA421mBGA421mBGANorthHubIntel852PMIntel852GMEIntel852GMSouthHub82801DBM82801DBM82801DBMSampleAvailabilityQ1’03NowNowProductionAvailabilityQ2’03Q2’03Jan2003:SupportsMobileIntelPentium4Processor-M,&MobileIntelCeleronProcessorQ2’03:AddsupportforIntelCeleronProcessor奔騰M90納米制程技術(shù)

首款投入生產(chǎn)的移動(dòng)式處理器應(yīng)變硅首次投入生產(chǎn)體系結(jié)構(gòu)增強(qiáng)增強(qiáng)的數(shù)據(jù)預(yù)取功能、寄存器訪問管理器2MB低功耗二級(jí)高速緩存前代產(chǎn)品的兩倍1.40億個(gè)晶體管前代產(chǎn)品的兩倍迅弛移動(dòng)技術(shù)示意圖開機(jī)流程圖解時(shí)序圖單用電源主板電壓時(shí)序OnlypuginAC時(shí)序圖開機(jī)時(shí)序Pushpowerbutton時(shí)序圖系統(tǒng)復(fù)位時(shí)序SystemReset故障例舉不啟動(dòng)

NoBoot屏花、屏閃或者暗屏

LCDFail(LCDNoDisplayLCDDisplayNoise)加不上電

NoPower不啟動(dòng)NoBoot檢查CPU、RAM、HDD、FDD、CD-ROM、Adaptor、BAT是否正常VCC3、VCC、+12V、VDD3、Vdd1.8、VCC_CORE、VCCT、V_CPU、V_IO電源是否對(duì)地更換BIOSU22（有可能FlashBIOSFail）查閱ServiceManualswitchorjumpersetup是否設(shè)定正確CPUsocketU9&RAMsocketCN24CN25是否BADClockGeneratorICICS9248-135U26是否正常工作，輸出相對(duì)ClockSystemClockICOSCY614.318MHZ利用DEBUGCARD找出問題點(diǎn)查HD0-HD#63、HA3-HA31各訊號(hào)線排阻，CPUCLK、PCICLK、SDRAMCLK之Systemclock。CPURST#、PCIRST#、AC_RESET#之RESET訊號(hào)。LPC_ISAcontrolICW83626FU28ISABUS訊號(hào)。屏花、屏閃或暗屏檢查L(zhǎng)CD是否正常、無(wú)破裂，InverterBoard是否BADLCDSwitchSW7Setup是否正確，BIOSSetup是否正確LCDFPCCable&InverterCable是否BADLCD變色時(shí)檢查組裝是否不良LCDCONCN15&InverterCONCN12是否BADLCDVCC電源是否正常，SI3456DVQ8control，VCC給Inverter電壓BEADL48是否BADLCDcontrolICTiSN42LVD84AU21是否正常工作RN6、RN8、RN54-RN550歐8pin是否BAD查DACAVDDC、DACAVDDB、ECLKAVDD、DCLKAVDD、R0+-、R1+-、R2+-、RCLKIN+-訊號(hào)亂碼查MD0-MD63訊號(hào)，RN10-RN13、RN18、RN25-RN28、RN33、RN37-RN40、RN56-RN57等排阻LCDFAIL(LCDNoDisplay,LCDDisplayNoise)加不上電NoPower檢查AD/DCAdaptor是否正常PowerJackCON1&FUSEPF1是否BADPowerSwitchSW5是否BADVDD1.8ControlICMAX1714PU13&VCC、VDD3ControlICMAX1632PU11是否正常工作RTCCLK32.768MHZY1是否振蕩。更換后無(wú)振蕩BGA問題AD、B+、VCC3、VCC、+12V、VDD、VDD3、VDD1.8、Vcc_CORE、VCCT電源是否對(duì)地查VR_PWRGD、PWRGD、PWROK、PWR_ON#、SYSPWGD、VDD_ON訊號(hào)電源管理AdvancedPowerManagement(APM)

BIOS-basedsystempowermanagementOShasnoknowledgeofwhatAPMdoesWidevarietyofimplementatonsandfunctionalityNouniformuserexperienceAdvancedConfigurationa