分析案例rk3188ic規(guī)格書mlk031a

Product ModuleFirstMLK031AisanewgenerationofSDIOWifiproductsmodule.AccordwithWifiwirelessnetworkstandardSDIOmodule,thebuilt-inwirelessnetworkprotocolIEEE802.11protocolstack,andTCP/IPprotocolstack,saveelectricityin controlprocedures.EmbeddedRISCcoreforbettersystemlevelmanagement;Coexistence:802.15.2.externalthree-wirecoexistenceschemetosupportadditionalwirelesssuchas3G,GPSandWiMAX.Selfcalibration;Integratedswitchingregulatorenablesdirectconnectiontobattery.Best-in-classcurrentconsumptionperformance;In ligentBT/WLANcoexistenceschemethatgoesbeyondPTAsignaling(forexample,transmitwindowanddurationthattakeintoaccountofprotocolexchangesequence,frequency,etc.).MLK031AisthesmallsizeandlowpowermoduleforIEEE802.11b/g/nwirelessLAN.CDT-K46620isbasedonMTK6628solution.2.4GHzsinglestream802.11b/g/nBluetooth:UART,FM:UART,Audio,GPS:802.11d/h/kSecurity: Feedback,20/40MHzcoexistence(PCO),unscheduledPSMPSupports802.11wprotectedmanagedInterface:SDIO2.0(4-bit&1-BluetoothBlockAsimplifiedblockdiagramoftheCDT-K46620SiPmoldingmoduleisdepictedinthefigurebelow.Theconnectionsbetweeninternalmodules,aswellas,externalinterfacescanbefoundasbelow:Figure--MT6620functionalblock umtothedevicecanoccur.Functionoperationisnotguaranteedunderthesethelong-termreliabilityofthedevice.<Table1AbsoluteumRatings>.OtherDonotuseorstoremodulesinthecorrosiveatmosphere,especiallywherechloridegas,sulfidegas,acid,alkali,saltorthelikearecontained.Also,avoidexposuretoStorethemoduleswherethetemperatureandrelativehumiditydonotexceed5to40℃and20to60%.Assemblethemoduleswithin6Checkthesolderingabilityincaseof6monthsModelProductComboNetworkIEEE802.11b/g/n,BT4.0+HS,FMT/Rx,HostSDIO/UART/Audio/PCM/Temperature-60℃~+-45℃~Operating:10~95%(Non- Storage:5~PCB15mmX15WiFiIEEE802.11HostBluetooth2.1+EDR3.0+HScomplianceV4.0LowHost FM HostAudio Audio GPSHostHost8.OperatingStandardTestTheTestforelectricalspecificationshallbeperformedunderthefollowingconditionunlessotherwisespecified.AmbientconditionTemperature:25℃±5℃.Humidity:65%±5%Powersupply3.3V(±5%)inputpowerattheCurrentconsumptionover mendedrangeofsupplyvoltageandconditionsislikeWhenit’stested,itmustbedmorethan2times alElectricalDCRFCharacteristicsforIEEE802.11b(11MbpsmodeunlessotherwiseRFCharacteristicsforIEEE802.11g(54MbpsmodeunlessotherwiseRFCharacteristicsforIEEE802.11gn(MCS7modeunlessotherwiseBluetoothBluetoothSpecificationConditions:VBAT=3.3V;FMFMSpecification(TBD)Conditions:VBAT=3.3V;SystemperformanceforSDIOHostInterfaceProtocolSDIO25MHzTimingPinPinDefinitionI/OPower123I45I6Datapinof7Datapinof8CMDpinof9CLKpinofDatapinofDatapinofOIIExternalGPSsyncORTCxtal/external32khzclockinputMechanicalEnvironment貼片WIFIA、客戶在開鋼網(wǎng)時(shí)一定要將WIFI模塊焊盤的大，請(qǐng)按1比1再向外擴(kuò)大0.7Mm比例來(lái)開，厚度按0.12Mm。B、WIFI模塊在上線貼片前建議烘烤12小時(shí)以上，溫度在120+-5度C、烘烤OK后建議馬上上線，不要一烘烤OK后就將全部WIFI模