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TheSeriesTitleGrowingChallenge
CoverTitle
ofSemiconductor
DesignSubtitleLeadership
MonthYear
ByAuthorName,AuthorName,andAuthorName
[Cover-Authorsstyle]
November2022
ByRamiroPalma,RajVaradarajan,JimmyGoodrich,
ThomasLopez,andAniketPatil
BostonConsultingGrouppartnerswithleadersinbusinessandsocietytotackletheirmostimportantchallengesandcapturetheirgreatestopportunities.BCGwasthepioneerinbusinessstrategywhenitwasfoundedin1963.Today,weworkcloselywithclientstoembraceatransformationalapproachaimedatbenefitingallstakeholders—empoweringorganizationstogrow,buildsustainablecompetitiveadvantage,anddrivepositivesocietalimpact.
Ourdiverse,globalteamsbringdeepindustryandfunctionalexpertiseandarangeofperspectivesthatquestionthestatusquoandsparkchange.BCGdeliverssolutionsthroughleading-edgemanagementconsulting,technologyanddesign,andcorporateanddigitalventures.Weworkinauniquelycollaborativemodelacrossthefirmandthroughoutalllevelsoftheclientorganization,fueledbythegoalofhelpingourclientsthriveandenablingthemtomaketheworldabetterplace.
TheSemiconductorIndustryAssociation(SIA)isthevoiceofthesemiconductorindustry,oneofAmerica’stopexportindustriesandakeydriverofAmerica’seconomicstrength,nationalsecurity,andglobalcompetitiveness.Semiconductors—thetinychipsthatenablemoderntechnologies—powerincredibleproductsandservicesthathavetransformedourlivesandoureconomy.ThesemiconductorindustrydirectlyemploysoveraquarterofamillionworkersintheUnitedStates,andUSsemiconductorcompanysalestotaled$258billionin2021.SIArepresents99%oftheU.S.semiconductorindustrybyrevenueandnearlytwo-thirdsofnon-USchipfirms.
Throughthiscoalition,SIAseekstostrengthenleadershipofsemiconductormanufacturing,design,andresearchbyworkingwithCongress,theAdministration,andkeyindustrystakeholdersaroundtheworldtoencouragepoliciesthatfuelinnovation,propelbusiness,anddriveinternationalcompetition.Learnmoreat.
ExecutiveSummary
Semiconductorsareubiquitous,poweringtechnologiesthatrangefromcellphonestotheMarsroversCuriosityandPerseverance,andeconomicallyimportant.In2021,worldwidesemiconductorsalestotaled$556billion.Semiconductordesign—whichincludesdesignofbothphysicalintegratedcircuitsandassociatedsoftware—accountsforroughlyhalfofallindustryR&Dinvestmentandvalueadd.1
UScompanieshaveplayedaleadingroleinsemiconductordesign,andasaresulttheUShasbenefitedfromavirtuouscycleofinnovation,enhancingitsabilitytoshapetechnicalstandards,strengthennationalsecurity,offerhigh-qualityemployment,andgeneratecompetitiveadvantagefororiginalequipmentmanufac-turers(OEMs)inadjacentindustries.(SeeExhibit1.)
Inrecentyears,however,theUS’sshareofdesign-relatedrevenueshasbeguntoshowsignsofadecline,droppingfromover50%in2015to46%in2020.2Otherregions,especiallySouthKoreaandChina,areseeinglocalgrowthintheirdesigncapabilities.Ouranalysisshowsthatatthecurrenttrajectory(thatis,ifplannerstakenoaction),theUSsharecouldfallto36%bytheendofthisdecadeasotherregionscapturealargershareoffuturegrowth.
ShouldtheUSaimtodefenditsleadershippositionindesign-andreaptheassociateddownstreambenefitsofdesignleadership,itwouldneedtoaddressthreechallenges.
Challenge1:DesignandR&Dinvestmentneedsarerising.Aschipshavegrownmorecomplex,developmentcostshaverisen,especiallyforchipsmadeonleading-edgemanufacturingnodes.Today,theUSprivatesectorinvestsmoreindesignR&Dthananyotherregion’sprivatesectordoes,butgovernmentsaroundtheworldoffersignificantincentivestoattractadvanceddesign,andtheUSrisksfallingbehind.Inaddition,therelativelevelofpublicsup-portforR&DintheUSlagsthatofotherregions.Theover-allshareofsemiconductor--specificdesignandR&Dfundedbypublicinvestmentis13%intheUS,comparedtoanaver-ageof30%acrossmainlandChina,Europe,Taiwan,Japan,
andSouthKorea.BringingUSpublicinvestmentindesignandR&Dintolinewithinternationalpeers—including,forexample,directincentivessuchastaxcreditsforadvanceddesignandR&DperformedintheUS—willhelpensurealevelplayingfieldfordesignintheUSrelativetootherregions.
Challenge2:Thesupplyofdesigntalentisdwindling.Althoughmostoftheworld’ssemiconductordesignengi-neerstodayarebasedintheUS,theUSsemiconductordesignindustryfacesashortageofskilledworkersandisontracktoseethisshortageincreaseto23,000designersby2030,giventrendsinthenumberofscience,technology,engineering,andmathematics(STEM)graduatesandthenumberofexperiencedengineersleavingtheindustry.Publicandprivatesectorsmustworktogethertoencour-agemoreUSworkerstoenterthefieldofdesign,aswellastoencourageexperienceddesignersnottoleavethefieldorthecountry.Further,theprivatesectormustcontinuetoenhancetheproductivityofitsworkforcebydevelopinganddeployingnewtoolsandprioritizingthehighestvalue--addR&Danddesign.
Challenge3:Openaccesstoglobalmarketsisunderpressure.SalesaretheultimatesourceoffundingforinvestmentinR&D,buttariffs,exportrestrictions,andotherfactorsthreatenUSsemiconductorplayers’accesstoglobalmarkets,implicitlyputtingR&Dreinvestmentatrisk.Seculartrendsmayreversesomeelementsofglobalization,butensuringthatmarketsremainasopenaspossiblewillbenefittheUS,whichgainssignificantlyfromfreetradeandhasthemosttolosefromproliferatingrestrictions.
Industryvalueaddistheamountbywhichthevalueofanarticleincreasesateachstageofitsproduction,exclusiveofinitialcosts.
Designrevenuecalculationsarebasedonfablesscompaniesandestimatedshareofintegrateddevicemanufacturer(IDM)revenuesattributabletodesign.
BOSTONCONSULTINGGROUP X THESEMICONDUCTORINDUSTRYASSOCIATION 1
TheUSprivatesectorislikelytoinvest$400billionto$500billionoverthenexttenyearsindesign-relatedactivities,includingR&Dandworkforcedevelopment.Buttomaintainleadershipoverthecomingdecade,theUSneedscomple-mentarypublic-sectorinvestmentsaimedataddressingthekeychallengeslaidoutabovetostrengthenboththedomes-ticsemiconductorindustryandthecountryasawhole.
Further,theleverageprovidedbypublic-sectorinvestmentswouldbesubstantial.OuranalysissuggeststhateachpublicdollarinvestedindesignandR&Dwouldinduceadditionalprivate-sectorinvestmentindesignandR&D,ultimatelyyielding$18to$24ofdesign-relatedsales.3
Asaresult,publicinvestmentindesignandR&Dofapprox-imately$20billionto$30billionthrough2030(includinga$15billionto$20billiondesigntaxincentive)wouldyieldincrementaldesign-relatedsalesofabout$450billionovertenyears,whilealsosupportingtrainingandemploymentforabout23,000designjobsand130,000indirectandinducedjobs,andfortifyingtheUSleadershippositioninsemiconductordesign.
Exhibit1-MarketLeadershipinSemiconductorDesignConfersMultipleAdvantages
Virtuouscycle
Abilitytoshape
Stronger
High-quality
Benefits
ofinnovation
standards
security
employment
forOEMs
Leadershipattracts
Firstmovershavean
Nationalsecurity
Theaverageannual
Closecollaboration
globaltalentand
advantageinsetting
benefitsfrom
incomeofworkers
betweenOEMsand
contributestoacycle
andleveragingthe
improveddefense
employedin
localdesignteams
ofinnovationand
benefitsofglobal
systemsatlowerrisk
semiconductordesign
createscompetitive
reinvestment
technicalstandards
oftamperingand
was$170,000,
advantage
disruption
comparedtotheUS
medianof$56,000
Source:BCGanalysis.
ThesecalculationsassumethateachpublicdollarinvestedindesignandR&Dinducesanadditional$2to$3ofprivate-sectorR&DinvestmentandthateachincrementaldollarofR&Dyields$6ofincrementalsales.
2 THEGROWINGCHALLENGEOFSEMICONDUCTORDESIGNLEADERSHIP
TheGrowingChallengeofSemiconductorDesignLeadership
Semiconductorsarecriticaltothefunctioningofthemodernworlddrivingeconomiccompetitiveness,nationalsecurity,andtechnologiesrangingfrom
moderndefensecapabilitiestoautonomousvehicles.Thesemiconductorindustryisofhighstrategicimportanceandsemiconductormanufacturingisincreasinglythefocusofindustrialpoliciesacrossmajoreconomies.
Beforesemiconductorsorchipscanbemanufactured,however,theymustbedesigned,andthisreportfocusesonthedesignofsemiconductors.
Westartbylayingoutwhatsemiconductordesignisandwhyitisimportant,andwediscusstheUS’shistoryinthisdomainaswellasthebenefitsthatdesignleadershiphasconferred.Despiteitshighvalue,leadershipindesignisnotinevitable,andtodaytheUSfacesthreekeychallengestomaintainingitspositionasamarketleader:increasingdifficultyandR&Dintensityassociatedwithsemiconductordesign;ashortageofdomestictalent;andthreatstoglobalmarketaccessthatenableongoingreinvestmentindesign.
WeestimatetheimpactofthetalentshortageonUSdesignleadershipandthepossiblebenefitsandreturnsofpotentialpoliciestheUScouldpursueifitchosetosustainleadershipinsemiconductordesign.
BOSTONCONSULTINGGROUP X THESEMICONDUCTORINDUSTRYASSOCIATION 3
DesignIsaCriticalPartoftheSemiconductorValueChain
Inbuildingahouse,architectsandbuildingengineersworktogethertodesignthehigh-levellayoutof,forexample,acolonialorpost-modernhome.Theseprofessionalsdeter-minewheretopositionroomsandwindowstocreateaspacethatmeetstheirclient’sneeds.Architectsandbuild-ingengineersmustconsiderarangeoftradeoffs—forex-ample,betweenlivingspaceandstoragespace—andlayoutthedetailedframing,plumbing,electrical,andotherconsid-erationsthatmakeahomelivable.Allofthispreparatoryworkmustoccurbeforeactualconstructioncanbegin.
Similarly,beforesemiconductorscanbemanufactured,theymustbedesigned.Andjustastradeoffsarenecessaryinhomedesign—forexample,betweenopennessandprivacy—chipdesignrequirestradeoffsbetweensuchdesirableobjectivesasperformanceandpowerefficiency,theprocessingofgeneralinstructionsandtheprocessingofhighlyspecializedinstructions,andinputsofdigitaldataandinputsofreal-worldanalogdata.
Andjustasexpertiseindesigningsingle-familyhomesdoesnotqualifyanarchitecttodesignaskyscraper,theskillsneededtodesignchipsfordifferentapplicationsareinmanycasesnotfungible.(See“KeySemiconductorDesignTechnologies,”intheAppendix.)Further,chipdesigncanbeamassiveundertakingthatrequireslargeteams—sometimesincludinghundredsofhighlyskilleddesignengineers,eachwithdifferentspecialties—tocol-laborateforyearsbeforeadesigniscompleteandreadyforproduction.Historically,theUShasledtheworldinsemiconductordesign.(SeeExhibit2.)
Well-designedchipsenableautomobilestooperatesafely,advancedmedicalequipmenttopreserveorsavelives,andmilitaryradarsystemstodetectdangers.Semiconductordesignhashelpedmakevirtuallyallsectorsoftheecono-my,fromfarmingtomanufacturing,moreeffectiveandefficient.Semiconductordesignhasalsobeenpivotalinnewinnovations,suchasartificialintelligence(AI),thataretransformingentireareasoftechnologyandtheeconomy.
Whensemiconductordesignimproves,allapplicationsthatusesemiconductorsbenefitaswell.Conversely,whensemiconductordesignstagnates,allrelatedapplicationssuffertoo.Inaddition,designinnovationisfundamentaltofuturesemiconductorimprovements.Asphysicalscalingdifficultiescontinuetoincrease,design-relatedinnovationssuchasnewarchitecturesandheterogeneousintegrationwillbeincreasinglyimportant.Heterogeneousintegrationwillimproveperformancebyallowingdesignerstochooseamongthebestpossiblemanufacturingtechnologiesfordifferentelementsofeachchip(forexample,powerman-agementonsiliconcarbide,analogfunctionson28nm,andhigh-performancelogiconleading-edgenodesizes)anddeliverlevelsofoverallperformancethatwerepreviouslyimpossible.
Designisthekeyactivitythatdifferentiatesonesemi-conductorfromanotherandguideshowrawsiliconwafersbecomestate-of-the-artchips,soit’snosurprisethatde-signrequiressignificantR&Dinvestment.(See“SummaryoftheSemiconductorValueChain”intheAppendix.)Infact,theR&Dintensityofdesignisabout20%,andtheR&DintensityofEDAandcoreIPisgreaterthan30%,comparedtoabout10%forwaferfabricationandequip-mentproduction.
4 THEGROWINGCHALLENGEOFSEMICONDUCTORDESIGNLEADERSHIP
Exhibit2-TheUSIstheLongstandingLeaderinSemiconductorDesign
Industry
R&Dintensity2
Revenueshareof2021worldwidetotal,byregion1(%)
value-add(%)
(revenue%)
Design
>10%ofrevenues
Logic
28
20
64
8
9
4
4
11
(mostlyfabless)
Memory
8
9
27
59
7
5
(mostlyIDM)
14
14
DAO3
37
18
13
6
19
4
Designsubtotal
50
17
46
9
7
21
9
8
3
34
EDAandcoreIP
72
20
3
2
2
2
US
Europe
MainlandChina
SouthKorea
Japan
Taiwan
Other
Sources:CapitalIQ;SIAFactbook2022;BCGanalysis.
Note:DAO=discrete,analog,andother;EDA=electronicdesignautomation;IP=intellectualproperty.Becauseofrounding,notallbarsegmenttotalsaddupto100%.
1Theregionalbreakdownisbasedoncompanyrevenuesandheadquarterslocation.DesignrevenuesarebasedonfablesscompaniesandestimatedshareofIDMrevenuesattributabletodesign.
2R&DintensityismeasuredasR&Ddividedbyrevenue.
3Discrete,analog,optoelectronics,sensors,andothers.
DesignIsComplexandIncludesMultipleDifferentTypesofFirmsandActivities
Semiconductordesigninvolvestwotypesofactivities:hardware-designandsoftwaredevelopmentwork.Hard-waredesignisamultistepprocessencompassingproductdefinitionandspecification,systemdesign,integratedcircuitdesign,andpost-siliconvalidation.(SeeExhibit3.)Softwaredevelopmententailsthecreationoffirmware—atypeoflower-levelsoftwarethatbypasses(forexample)theoperatingsystemofanenddevice,likealaptop,toprovideinstructionsdirectlytoachip.Asdesigngrowsmorecom-plex,itbecomesanincreasinglyiterativeprocess—-especiallyforleadingplayers—thatoccursinparallelinordertosurfaceissuesearlier,optimizeoverallsystem-levelperformance,anddecreasetimetomarket.
Hardwaredesignersusebothnewandestablishedtech-niquesinthedesignprocess.Whendrivinginnovations,designersgeneratenew,specializeddesignsthatenablespecificapplicationstoleveragethelatestadvancesindesignandrelatedtechnologies.Designerswilloftenuseexisting,reusablearchitecturalbuildingblocks(coreIP)tosimplifyandacceleratecreationoftheoveralldesign.Inallcases,designersusehighlyadvancedEDAsoftwaretoautomatethedesignprocessandensurethatchipdesignscanbemanufacturedondistinctandoftenproprietaryfabricationprocesses.Sinceasinglechipcanhousebillionsoftransistors,state-of-the-artEDAtoolsareindispensablefordesigningmodernsemiconductors.(See“TypesofSemiconductorDesignActivities”intheAppendix.)
BOSTONCONSULTINGGROUP X THESEMICONDUCTORINDUSTRYASSOCIATION 5
Manykindsofcompaniesengageinsemiconductordesign,buttheyfallintofourmaincategories:
FablessCompanies.Responsibleforroughlyhalfofdesign-relatedvalueadd,thesecompaniesfocusonchipdesign.Theypartnerwiththird--partymerchantfoundriestofabricate(thatis,manufacture)theirchips.
IntegratedDeviceManufacturers(IDMs).Responsi-bleforabouthalfofdesign-relatedvalueadd,IDMsbothdesignandmanufacturechips.WithinIDMs,designandmanufacturingteamsworktogethertobringnewchipstomarket,usuallyatin-housefabricationfacilities.
OriginalEquipmentManufacturers(OEMs).OEMs,suchasautomakers,alsoplayaroleinsemiconductordesign.Theyusesemiconductorsasinputsforotherproducts.SomeOEMshavebeguntodesigntheirownchips,chieflyfortheirownproducts.Forexample,acloudcomputingprovidermaydesigncustomchipswithspe-cificfeaturesthatexecutespecifictasksverywell.4OEMsareagrowingpresenceinchipdesignandincreasinglyparticipateinthesameproductandtalentmarketsthatfablesscompaniesandIDMstapfortheirneeds.
EDA/IPProviders.EDAcompaniesaretrustedinter-mediariesbetweendesigncompaniesandfoundries,providingdesigntools,referenceflowsandsomeser-vices.USleadershipinEDAtoolsconferssignificantben-efitstoUSsemiconductordesign,asresearchershavegreateraccesstoautomationtools,totheengineersbe-hindthosetoolsandtosupportforexperimentationwithnewdesignconcepts.Third-partyIPprovidersdesignandlicenseIPbuildingblocks(processors,libraries,memo-ries,interfaces,sensors,andsecurity).
Inadditiontotheseplayers,designservicescompanies—whichcanbethird-partyprovidersorin-houseteamsatmanufacturers—performavaluablefunctionindevelopingandoptimizingnewdesigns.Inparticular,fablesscompa-niesoftenworkcloselywithagivenfoundry’sdesignser-vicesteamtoensurethecompatibilityofitsdesignswiththefoundry’sfabricationprocesses.(Seethesidebar“SpotlightontheFabless-FoundryEcosystem.”)Closecollaborationiscritical,asscalingupnewprocessesin-volvesinherentuncertaintiesinmodelingandreachingtargetmanufacturingyields.
Exhibit3-TheSemiconductorHardwareDesignProcessConsistsofFourMajorStages
1
2
3 4
Productdefinitionand Architecture/system
specification design
Productmanagement,system Systemarchitectsdefine
architecture,andcustomer block-levelarchitectureforthe
defineinitialproduct designandmayleverage
requirements previousIP
Integratedcircuitdesign
Multidisciplinarye?ort:
Logic:Initialanaloganddigitaldesign
Circuit:Digitalsynthesisanddesignfortest
Layout:Routingandmaskgeneration
Verification
Verificationengineersverifydesignfunctionalityandtimingthroughsimulation
Post-siliconvalidation
Validationengineersvalidatephysicaldevicefunctionalityacrossextremeworkingconditions
Sources:WhiteHouse100DaySupplyChainReviewReport;BCGanalysis.
Forexample,Graviton,afamilyofchipsdesignedbyAmazonWebServices,includesfeaturesthatallowchipstorefreshtheirfirmwaretoaddressissueswithoutdisturbingcustomersthatareusingthemachineforotherpurposes.
6 THEGROWINGCHALLENGEOFSEMICONDUCTORDESIGNLEADERSHIP
SpotlightontheFabless-FoundryEcosystem
Inthemid-1980s,largeandverticallyintegratedIDMs(integrateddevicemanufacturers)performedallsemi-conductordesignandfabrication.Seekingtooffsetthehighcapitalexpenditurerequiredforfabricationequipment,IDMsbegantomakeunusedmanufacturingcapacityavailabletosmallercompaniestokeeptheirfabsbusy.Whilethisenabledsomecompanieswithdesignexpertisetoproducechipswithoutoperatingtheirownfabs,itre-mainedasmallpartofIDMs’businesses.IDMsoftenpreferredtoownthedesignstheyfabricated,andtheyfounditdifficulttobalancetheneedsofinternalandexter-nalcustomers.
In1987,Dr.MorrisChangsensedanopportunityand—inpartnershipwiththeTaiwanesegovernmentandPhilipsSemiconductor—launchedTaiwanSemiconductorManufac-turingCompany(TSMC),theworld’sfirst“pure-play”foundry(oneinvolvedexclusivelyinmanufacturingandnotinproductdesign).TSMCassureditscustomersthatasadedicatedfoundry,itwouldnotcompetewiththemindesign.
TSMCadoptedalow-costpricingstrategythatdependedonhigh-volumeproductionforprofitability.Althoughitsacrificedearlyprofits,thecompany’smarketshareforfabricationrapidlygrew,allowingittorecoupitslargecapitalexpendituresandinvestinnext-generationtechnol-ogynodes.TSMCwasamongthecompaniesthatbenefit-edfromtheTaiwanesegovernment’sbroadsupportforthesemiconductorindustry,throughR&Dassistance,work-forcetraining,theestablishmentofhigh-techcorporateparks,andmore.
AlthoughboththeIDMmodelandthefoundrymodelhavetheiradvantages,theemergenceofpure-playfoundriesloweredbarrierstoentryfordesigncompaniesandrevolu-tionizedtheindustry,leadingtotheemergenceoffablesssemiconductordesignfirms.Freeofthelargecapitalex-pendituresofmanufacturing,fablesscompaniescouldfocustheirexpertiseandresourcesoninnovationsinde-signandpartnerwithdedicatedfoundriesforfabrication.
BOSTONCONSULTINGGROUP X THESEMICONDUCTORINDUSTRYASSOCIATION 7
Becausethetechnologyofsemiconductordesignevolvescontinually,designleadersmustleveragenewandfuturetechnologiesthatarecriticalfordesigninnovation,includingthese:
HardwareandSoftwareCo-design.Assystemsbe-comemorecomplex,designersleveragepracticessuchasdesigntechnologyco-optimization(DTCO)andsystemtechnologyco-optimization(STCO)toensurethatanimprovementinoneareadoesnotcreateproblemsforoverallsystem-levelperformance.“Shift-left”designprin-ciplespermitparallelsoftwareandhardwaredevelop-mentbyleveragingvirtualprototypinganddigitaltwins.
AI-BasedDesign.Designerscanmorequicklyandeffectivelymeetpower,performance,andareatargetsbyleveragingAI-basedtools.ReinforcementlearningandotherAIalgorithmscanautomatelessconsequentialde-signtasks,freeingengineerstofocusonmoreadvancedtasksanddecisions.
2.5D/3DDesigns,Chiplets,andHeterogeneousIntegration.Astheadoptionofnewprocesstechnolo-giesslows,designengineershavebeenmovingtonewdesign,integration,andpackagingtechnologiesthathelpimproveperformanceandreducecostandpower-consumption.Heterogeneousintegrationpermitsin-creaseduseofhighlyspecializeddesignstofurtherimproveperformance.
SecureDesign.Increasedscrutinyonthesecurityofsemiconductordesignsispromptingdesignerstoplacemoreemphasisonsecurehardwaremodulesandtodevelopenhancedtools,methods,andencryption.Designingsecurityintosemiconductorsatthehardwarelevelensuresthatsystemsbehaveasexpected,preventsfaults,andenhancescybersecurity.
ToDate,theUShasEnjoyedtheBenefitsofLeadingtheWorldinSemiconductorDesign
Asof2021,46%ofsemiconductorindustryrevenueswereattributabletothedesignactivitiesofUS-headquarteredcompanies,nearly2.5timesasmuchasanyotherindivid-ualregion.USmarketleadershipindesignismostpro-nouncedinlogic,generating64%ofdesign-relatedrevenuesinthatsector,butitalsoextendstothedesignofdiscrete,analog,andother(DAO)devices,whereUS-headquarteredcompaniesgenerate37%ofdesign-relatedrevenues.Onlyinmemory,whereSouthKoreanfirmsgenerate59%ofalldesign--relatedrevenues,doestheUSnothaveamarketleadingposition,asdetailedinExhibit2.
8 THEGROWINGCHALLENGEOFSEMICONDUCTORDESIGNLEADERSHIP
Semiconductorshelpautomobilesoperatesafely,advancedmedicalequipmentsavelives,andmilitaryradarsystemsdetectdangers.
Marketleadershipinsemiconductordesignconfersmultipleadvantages,includingthefollowing:
AVirtuousCycleofInnovation.Leadershipindesignsupportsavirtuouscycleofinnovation.Forexample,designleadershiphasenabledfirmsintheUStoattractandtrainatalentedforeign-bornworkforce.Thecontribu-tionsandinnovationsofthisworkforcegenerateprofitsthatcompaniescanreinvestinR&Dtodrivecontinuedexpansionoftheworkforceandfutureinnovations.
GreaterAbilitytoShapeStandards.Inanytechnicaldomain,standardssupportinteroperabilityandenablecompaniestomoreeasilycollaborateacrossthesupplychain.Often,firmsthatleadindesignarethefirsttodevelopproductsthatrequirestandards(aswasthecasewithWi-Fi,Bluetooth,and5Gwireless),andthisenablesthemtoplayaleadingroleinreachingconsensusonwhatstandardsaresetandtorapidlydevelopexpertiseinoptimaldesignforagivensetofstandards.Regionswithmanyleadingdesignfirmswillbeatarelativead-vantageinsettingandleveragingthebenefitsoftechni-calstandards.
StrongerSecurity.Designleadershipoffersnationalsecurityadvantagesintwodimensions.First,regionswithdesignleadershiphaveaccesstomoreadvanced
semiconductorchipsthatcangivedefenseandweaponssystemsgreaterefficacy.Second,regionswithdesignleadershipmaybeatlowerriskofmalicioustamperingandsupplychaininterdiction—forexample,byprotect-ingcriticaldesigninformationandenablingtraceabilityandcontrolofdesignIP.
ExpandedHigh-QualityEmployment.Designleader-shipsupportshigh-qualityemploymentdirectlyviahighwagesandindirectlyviahighemploymentmultiples.
Forexample,in2020,theaverageannualincomeforUSworkersemployedinsemiconductordesignwasabout$170,000comparedtoaUSmedianofabout$56,000.
AdvantageforOEMsinAdjacentIndustries.OEMsintechnology-heavyindustriesrelyextensivelyonsemi-conductorsinthesystemstheydesign.Becausecollabo-rationwithinasharedgeographyandculturalcontextisofteneasier,OEMscancreatecompetitiveadvantagebyworkingdirectlywithmarket-leadingchipdesignersandemployingpracticessuch
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