PCB工程英文單詞模板

資料內(nèi)容僅供您學(xué)習(xí)參考，如有不當(dāng)或者侵權(quán)，請聯(lián)系改正或者刪除。1.附件:attached2.樣品:sample3.承認(rèn):approval4.答復(fù):answer;reply5.規(guī)格:spec6.與...同樣的:thesameas7.前版本:previousversion(oldversion)8.生產(chǎn):production9.確認(rèn):confirm10.再次確認(rèn):doubleconfirm11.工程問題:engineeringquery(EQ)12.盡快:ASAP(assoonaspossible)13.生產(chǎn)文件:productiongerber14.聯(lián)系某人:contactsomebody15.提交樣板:submitsample16.交貨期:deliverydate17.電測成本:ET(electricaltest)cost18.通斷測試:Openandshorttesting19.參考:referto20.IPC標(biāo)準(zhǔn):IPCstandard21.IPC二級:IPCclass222.可接受的:acceptable23.允許:permit24.制造:manufacture25.修改:revision26.公差:tolerance27.忽略:ignore(omit)28.工具孔:toolinghole29.安裝孔:mountinghole30.元件孔:componenthole31.槽孔:slot32.郵票孔:snapoffhole33.導(dǎo)通孔:via34.盲孔:blindvia35.埋孔:buriedvia36.金屬化孔:PTH(platingthroughhole)37.非金屬化孔:NPTH(noplatingthroughhole)38.孔位:holelocation39.避免:avoid40.原設(shè)計:originaldesign41.修改:modify42.按原設(shè)計:leaveitasitis43.附邊:wastetab44.銅條:copperstrip45.拼板強度:panelstrong46.板厚:boardthickness47.刪除:remove(delete)48.削銅:shavethecopper49.露銅:copperexposure50.光標(biāo)點:fiducialmark51.不同:bedifferentfrom(differfrom)52.內(nèi)弧:insideradius53.焊環(huán):annularring54.單板尺寸:singlesize55.拼板尺寸:panelsize56.銑:routing57.銑刀:router58.V-cut:scoring59.啞光:matt60.光亮的:glossy61.錫珠:solderball(solderplugs)62.阻焊:soldermask(solderresist)63.阻焊開窗:soldermaskopening64.單面開窗:singlesidemaskopening65.補油:touchupsoldermask66.補線:trackwelds67.毛刺:burrs68.去毛刺:deburr69.鍍層厚度:platingthickness70.清潔度:cleanliness71.離子污染:ioniccontamination72.阻燃性:flammabilityretardant73.黑化:blackoxidation74.棕化:brownoxidation75.紅化:redoxidation76.可焊性:solderability77.焊料:solder78.包裝:packaging79.角標(biāo):cornermark80.特性阻抗:characteristicimpedance81.正像:positive82.負(fù)片:negative83.鏡像:mirror84.線寬:conductorwidth85.線距:conductorspacing86.做樣:buildsample87.按照:asper88.成品:finished89.做變更:makethechange90.相類似:similarto91.規(guī)格:specification92.下移:shiftdown93.垂直地:vertically94.水平的:horizontally95.增大:increase96.縮小:decrease97.表面處理:SurfaceFinishing98.波峰焊:wavesolder99.鉆孔數(shù)據(jù):drillingdate100.標(biāo)記:Logo101.Ul標(biāo)記:UlMarking102.蝕刻標(biāo)記:etchedmarking103.周期:datecode104.翹曲:bowandtwist105.外層:outerlayer106.內(nèi)層:internallayer107.頂層:toplayer108.底層:bottomlayer109.元件面:componentside110.焊接面:solderside111.阻焊層:soldermasklayer112.絲印層:legendlayer(silkscreenlayeroroverlayer)113.蘭膠層:peelableSMlayer114.貼片層:pastemasklayer115.碳油層:carbonlayer116.外形層:outlinelayer(profilelayer)117.白油:whiteink118.綠油:greenink119.噴錫:hotairleveling(HAL)120.水金:flashgold121.插頭鍍金:platedgoldedge-boardcontacts122.金手指:Gold-finger123.防氧化:Entek(OSP)124.沉金:Immersiongold(chem.Gold)125.沉錫:ImmersionTin(chem.Tin)126.沉銀:ImmersionSilver(chem.silver)127.單面板:singlesidedboard128.雙面板:doublesidedboard129.多層板:multilayerboard130.剛性板:rigidboard131.撓性板:flexibleboard132.剛撓板:flex-rigidboard133.銑:CNC(mill,routing)134.沖:punching135.倒角:beveling136.倒斜角:chamfer137.倒圓角:fillet138.尺寸:dimension139.材料:material140.介電常數(shù):Dielectricconstant141.菲林:film142.成像:Imaging143.板鍍:PanelPlating144.圖鍍:PatternPlating145.后清洗:FinalCleaning146.疊層:layu