盤中孔工藝與空洞的關(guān)系

深圳市福英達(dá)工業(yè)技術(shù)有限公司/一站式錫膏解決方案供應(yīng)商Detailedexplanationoftherelationshipbetweenthehole-in-diskprocessandvoidsInPCBdesign,viaisacommonconnectionthatconnectsdifferentlayersofwiringorprovidesaplaceforcomponentstobesoldered.Therearevarioustypesofvia,oneofwhichisviainpad(viainpad),thatis,theviaispunchedontheSMDorBGApad,andthentheholeispluggedwithresinandplatedwithalayerofcopperonthesurface,sothattheholeisnotvisibleonthepad.AdvantagesandDisadvantagesofVidinPadVidinPad(VidinPad)isthebasicstructureofHDI(HighDensityInterconnect)boards,anditsadvantagesareobvious:reducethedistancebetweenboardsandsignaltransmissiondistance,whichisbeneficialtoreducesignalinterferenceandloss;platingfilledwithcoppersolidholescaneffectivelyreducetheparasiticsignalsintheholesandparasiticinductance,whichisconducivetothetransmissionofhigh-frequencysignals;effectivelyreducethethicknessofthefinishedboard,andincreasethedensityofthewiringperunitarea,andsoon.Buttheholeinthediskalsohassomedisadvantages,suchashighcost,longproductioncycle,easytoproducebubblesandsoon.Oneofthemostseriousproblemsisthevoid,i.e.,thebubbleorgapformedinsidethesolderjoint.Voidscanaffectthemechanicalstrengthandthermalconductivityofthesolderjoint,leadingtopoororfailedsoldering.Therefore,careneedstobetakentoavoidorminimizethecreationofvoidswhendesigningandmanufacturinghole-in-disks.TranslatedwithDeepL.com(freeversion)Causesofcavities:1.Inadequateorunevenresinplugging.Resinpluggingisoneofthekeyprocessesforhole-in-disk,whichrequirestheover-holetobecompletelyfilledandcuredtopreventsolderpastefromflowingintotheover-hole.Inadequateorunevenresinpluggingcanresultintrappedairinsidetheholeorgapscausedbyshrinkageoftheresin.Thesespacescanbefilledwithsolderpasteduringsolderingandformvoids.2.Theplatingcapisnotflatorfirm.Platingcapisintheresinafterpluggingholesinthepadsurfaceplatedwithalayerofcoppertoincreasethesolderingareaandwettability.Iftheplatingcapisnotflatornotfirm,willleadtosolderpasteandcopperlayerbetweenthegaporseparationphenomenon,thesegapsorseparationwillalsoformahole.3.Thesolderpasteitselfcontainsoxygenorotherimpurities.SolderpasteisusedtoconnectcomponentsandPCBmetalmaterials,itusuallycontainsacertainproportionoffluxandotheradditives.Thesefluxesandadditivesathightemperatureswillhaveachemicalreactionorvolatilization,resultinginoxygenorothergases.4.Inappropriatesolderingtemperature.Solderingtemperatureisanimportantfactoraffectingthefluidityandwettabilityofsolderpaste.Ifthetemperatureistoohighortheheatingtimeistoolong,itwillleadtoexcessiveoxidationorvolatilizationofthesolderpaste,generatingalargeamountofgas;ifthetemperatureistoolowortheheatingtimeistooshort,itwillleadtopoorfluidityofthesolderpasteorsolidifytooquickly,hinderingthegasdischarge.Howtoavoidtheproblemofhollowholesinthedisk1.Optimizetheresinholepluggingprocess.Resinholepluggingprocessneedstocontrolthetypeofresin,viscosity,temperature,pressure,timeandotherparameterstoensurethattheresincanfullyanduniformlyfilltheholes,anddonotproduceshrinkageorcrackingaftercuring.2.Optimizetheplatingcapprocess.Platingcapprocessneedstocontrolthecompositionoftheplatingsolution,temperature,concentration,current,timeandotherparameterstoensurethattheplatinglayercanbeflatandfirmlycoveredinthepads,andwiththeresinandthesubstratehasgoodadhesion.Atthesametime,itisnecessarytochooseasuitablecopperreductionmethodtoremoveexcesscopperandkeepthesurfaceflat.3.Selectandusetheappropriatesolderpaste.TheselectionanduseofsolderpasteneedtoconsideritscompatibilitywiththecomponentsandPCB,wettability,oxidization,volatilityandothercharacteristics,inordertoreducethegenerationofgasandresidue.4.Optimizethesolderingtemperatureandtime.Solderingtochoosetheappropriatereflowtemperatureandtimetoensurethatthesolderpasteisfullyw