MPM-UP2000中文操作手冊-

EmergencyStop警急停止開關(guān) EmergencyStop警急停止開關(guān)TTemperature溫度控制表On電源啟動開關(guān)On電源啟動開關(guān)RelativeHumidity濕度控制表OffRelativeHumidity濕度控制表Off電源關(guān)閉開關(guān)Power電源燈Power電源燈StartCycStartCycle開始循環(huán)按鈕UP2000印刷機(jī)特性 視覺自動對準(zhǔn)裝置VisionAlignmentSystem慢速脫模功能SlowSnap-offFunction 可程式設(shè)定刮刀頭ProgrammingSqueegee 自動擦拭鋼板系統(tǒng)StencilWipper2.1關(guān)於印刷週期PrintingCycle 印刷週期包涵以下過程基板搬入LoadingBoard基板定位LocatingBoard視覺系統(tǒng)對位VisionAlignment印刷平臺上升ZTowerUP刮刀向前後刮印錫膏Printting慢速脫模SlowSnap-Off印刷平臺下降ZTowerDown基板搬出UnloadingBoard2.2硬體操作介面 軌跡球或螢?zāi)?TrackballorMonitor)Trackball軌跡球:移動螢?zāi)簧系闹笜?biāo)↖移動各軸數(shù)入數(shù)字、參數(shù)等等…..開機(jī)後,顯示如下的畫面以上(因軟體版本新舊不一樣而不同)Ultraprint2000內(nèi)全部馬達(dá),都是步進(jìn)馬達(dá),所以剛開機(jī)必需RESET重新回原點(diǎn)後才干開始使用。MPMCorporationMPMCorporation訊息先顯示區(qū)即時影像工作區(qū)關(guān)於訊息先顯示區(qū)即時影像工作區(qū)關(guān)於MPM公司資訊VACUUMMOTORVACUUMMOTORFRAMECLAMPUP/DOWN 啟動鋼板固定鈕 啟動真空馬達(dá)鈕 DISPENSESOLVENTSQUEEGEEDISPENSESOLVENTSQUEEGEECLAMPS 啟動刮刀座固定鈕 啟動溶劑幫浦鈕STENCILLIGHTSQUEEGEESTENCILLIGHTSQUEEGEEFLIP 啟動前後刮刀座鈕 啟動照鋼板燈泡鈕BOARDLIGHTSQUEEGEEBOARDLIGHTSQUEEGEEUP/DOWN 啟動刮刀組上下鈕 啟動照基板燈泡鈕WIPERPAPERVACUUMWIPERPAPERVACUUMMOTOR 啟動真空馬達(dá)閘門鈕 啟動捲紙馬達(dá)鈕.1下拉式功能表PrintAutoPrintManualPrintPassThroughDemoPrintSPCDataAutoPrint自動印刷模式ManualPrint手動印刷模式PassThrough將機(jī)器當(dāng)做輸送帶DemoPrint展示印刷模式SPCData生產(chǎn)統(tǒng)計(jì)過程資料1.AutoPrint自動印刷,機(jī)器會做印錫膏的動作PressSELECTtobeginor(按SELECT開始自動印刷)NexttochangeCycleLimits:NoLimit如下圖(按NEXT,以更換印刷片數(shù):不限制) PrintCycleLimits PrintCycleLimitsRollTrackballToChangeValuePrintCycleLimit:3PressExitWhenDone.PrintCycleLimits (印刷週期設(shè)定)RollTrackballToChangeValue (滾動軌跡球,以變更印刷片數(shù))PrintCycleLimit:3 (限定印刷週期:3片)最高999片PressExitWhenDone. (當(dāng)設(shè)定完成後，按EXIT)PAUSE 暫時停止印刷按鈕PAUSEDISPENSERPENDING DISPENSERPENDING※(必須在設(shè)定第2頁EnableButtons內(nèi)將Dispense打開為Yes)PPressSELECTtoraisesqueegeetoallowmoveroomwhenaddingpaste,orPressNexttocontinuePressSELECTtoraisesqueegee (按SELECT後刷刀會上昇，以便產(chǎn)生toallowmoveroomwhenaddingpaste, 足夠空間,讓操作員加錫)orPressNEXTtocontinue (按NEXT後在原地,讓使操作員加錫)WIPERPENDING WIPERPENDING ※(必須在設(shè)定第2頁EnableButtons內(nèi)將Wiper打開為Yes)SPCDATASPCDATA2.ManualPrint手動印刷,機(jī)器會做印錫膏的動作3.PassThrough將機(jī)器當(dāng)做輸送帶DemoPrint展示印刷模式5.SPCData生產(chǎn)統(tǒng)計(jì)過程資料CycleTime 顯示機(jī)器在印刷時所花的時間,如有擦拭,時間必加長CycleTimeIdleTime 機(jī)器在印刷時所等待送板與出板時間IdleTimeCorrection 顯示PCB板進(jìn)入印刷位置與鋼板對位時X、Y、THETA軸Correction修正值ShapeScore 視覺系統(tǒng)辨別PCB板與鋼板Mark點(diǎn)亮度接受值顯示圖表ShapeScoreAlignment 視覺系統(tǒng)辨別PCB板與鋼板Mark點(diǎn)X、Y修正補(bǔ)償顯示圖表Alignment2DData 2D錫面覆蓋率檢查顯示圖表(需有此項(xiàng)功能才干顯示)2DData3DData 3D錫膏厚度檢查顯示圖表(需有此項(xiàng)功能才干顯示)3DDataTemperature 顯示機(jī)器內(nèi)的溫度(需有ECU溫溼度監(jiān)控配備此項(xiàng)功能)TemperatureHumidy 顯示機(jī)器內(nèi)的濕度(需有ECU溫溼度監(jiān)控配備此項(xiàng)功能)HumidySaveSaveInfo 將生產(chǎn)統(tǒng)計(jì)過程資料存入磁片ClearAll ClearAll 將生產(chǎn)統(tǒng)計(jì)過程資料全部刪除 PanLeft PanLeft 將擴(kuò)大過資料與圖形向左邊移動 PanRight PanRight 將擴(kuò)大過資料與圖形向右邊移動 ZoomZoomIn 將生產(chǎn)統(tǒng)計(jì)過程資料內(nèi)(值及曲線)擴(kuò)大與縮小圖形 ReturntoMainMenuReturntoMainMenu 回到主畫面按鈕SPSPCOptionsTeachTeachBoardTeachVisionDeviceLayoutTeachIDTeachCustomBGATeachOffsetMovesTeachVisionOffsetTeachBoard做一片PCB板新程式TeachVision做一片PCB新程式的Mark點(diǎn)DeviceLayout做2D檢查時,所要檢查零件TeachID做辨識鋼板身分TeachCustomBGA編輯自行設(shè)計(jì)的BGA零件檔案TeachOffsetMoves設(shè)定〞印刷前的焊墊〞與〞印刷後的焊墊〞位置修正值TeachVisionOffset設(shè)定〞視覺系統(tǒng)〞位置修正值1.TeachBoard重做新程式AbouttobeginTEACHoperation(開始設(shè)定操作)PressSELECTtoteachanewboardor(按SELECT,設(shè)定新基板)PressNEXTtocontinueonthisboardsetup(按NEXT,繼續(xù)這基板的設(shè)定)按SELECT之後，出現(xiàn)以下訊息視窗：CAUTION,ThemachinemustmovetoCAUTION,ThemachinemustmovetoTEACHPOSITIONbeforeteachcanbeginThemachineisnowgoingtomove.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachinemustmoveto(警告,設(shè)定開始前,機(jī)器必須移動到TEACHPOSITIONbeforeteachcanbegin〞設(shè)定位置〞)Themachineisnowgoingtomove.(機(jī)器即將移動)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)1.1選擇BoardParameters進(jìn)入PCB參數(shù)設(shè)定BoardParameters HardwareRequired:BoardParameters BoardBoardParameters基板(PCB)參數(shù)設(shè)定(PCB)基板X軸方向長度(PCB)基板Y軸方向?qū)挾?PCB)基板厚度PCB板PCB板Y XEnterEnterBoardDimensionsintosetupmenu.ClickonYsizetoadjustTrackWidth.PressDonewhenfinished.EnterBoardDimensionsintosetupmenu.(輸入基板X、Y、厚度)ClickonYsizetoadjustTrackWidth.(點(diǎn)取Y方向尺寸，可調(diào)整軌道寬度)PressDonewhenfinished.(當(dāng)你做完上述之步驟，按Done)點(diǎn)取Xsize，輸入基板寬度Xsize，按EXIT完成輸入，單位mm。例14.5cm=145mm點(diǎn)取Ysize輸入基板寬度Ysize，按EXIT之後出現(xiàn)如下訊息視窗：AbouttoadjusttheTRACKWIDTHfortheboard.AbouttoadjusttheTRACKWIDTHfortheboard.PressNEXTtoContinue,orEXITtoQuit.AbouttoadjusttheTRACKWIDTHfortheboard.(調(diào)整基板的軌道寬度)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：ThisisthecurrentTrackwidthThisisthecurrentTrackwidthPressSELECTtofineadjustPressNEXTtoacceptThisisthecurrentTrackwidth(這是目前的軌道寬度)PressSELECTtofineadjust(按SELECT微調(diào)軌道寬度)PressNEXTtoaccept(按NEXT，接受目前的軌道寬度)如果，你按SELECT之後，出現(xiàn)以下訊息視窗：JogACTIVE…JogACTIVE…TRKWIDTH PressNEXTtoquit(調(diào)整完後，按EXIT)JogACTIVE…(這段訊息告訴你，用Jog方式去調(diào)整基板的軌道寬度)TRKWIDTH PressNEXTtoquit(調(diào)整完後，按NEXT)點(diǎn)取Thickness，輸入基板厚度。使用游標(biāo)卡尺測量。PressDonewhenfinished.(當(dāng)你做完上述之步驟，按Done)StencilDimensions鋼板尺寸設(shè)定參數(shù)鋼板尺寸EnterstencilinnerdimensionEnterstencilinnerdimensionPressDonewhenfinished.Enterstencilinnerdimension(輸入內(nèi)部鋼板尺寸)PressDonewhenfinished.(當(dāng)你做完上述之步驟，按Done)1.2選擇Worknest進(jìn)入印刷工作平臺參數(shù)設(shè)定Worknest HardwareRequired:Worknest Board,Tactile,VacuumChucksPleaseremovethestencil.Pleaseremovethestencil.Squeegeewillnowmoveback.PressSELECTwhenready.Pleaseremovethestencil.(請移開鋼板)Squeegeewillnowmoveback.(刮刀組現(xiàn)在將移動到後面)PressSELECTwhenready.(準(zhǔn)備好後按SELECT)按NEXT之後，出現(xiàn)以下訊息：Now,adjustthevacuumrearandsideplatesNow,adjustthevacuumrearandsideplatesIfyouhaveadedicatedworkholder,installitnowPressNEXTtoContinue,orEXITtoQuit.Now,adjustthevacuumrearand(現(xiàn)在請調(diào)整後隔板和側(cè)(左右)隔板)sideplatesIfyouhaveadedicatedworkholder,(假設(shè)有使用專用PCB板支撐架,請現(xiàn)在installitnow把他裝上)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)按NEXT之後，出現(xiàn)以下訊息：TheZTOWERisabouttoloadTheZTOWERisabouttoloadtotoolingheightPressNEXTtoContinue,orEXITtoQuit.TheZTOWERisabouttoload(Z軸上升到toolingheight的位置)totoolingheightPressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息：IfyouhaveXsnuggers,adjustsnuggerpinsnow.IfyouhaveXsnuggers,adjustsnuggerpinsnow.PressNEXTtoContinue,orEXITtoQuit.IfyouhaveXsnuggers,adjustsnuggerpinsnow.(假設(shè)有使用X方向夾板,請調(diào)整好)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息：CAUTION,ThemachineisnowgoingtoCAUTION,ThemachineisnowgoingtoCenteritselfforthissizeboard.TheYAXISisabouttomoveforward.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingto(注意,機(jī)器現(xiàn)在將移動到基板Centeritselfforthissizeboard.中心點(diǎn))TheYAXISisabouttomoveforward.(Y軸即將移動到前面(基板中心點(diǎn))PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)BoardParameters基板(PCB)參數(shù)設(shè)定PCB停於中心印刷位置值Loadspeed 432進(jìn)板軌道皮帶轉(zhuǎn)速值(數(shù)字越大,轉(zhuǎn)速越快)Unloadspeed 381出板軌道皮帶轉(zhuǎn)速值(數(shù)字越大,轉(zhuǎn)速越快)Enterboardloadingparameters.Enterboardloadingparameters.Clickondetentfieldtotest.PressDonewhenfinished.Enterboardloadingparameters.(輸入PCB進(jìn)板參數(shù))Clickondetentfieldtotest.(點(diǎn)取detent,測試PCB停於中心印刷位置值)PressDonewhenfinished.(按Done完成全部動作)1.3.選擇TeachBoardstops進(jìn)入基板停止位置參數(shù)設(shè)定TeachBoardstops HardwareRequired:TeachBoardstops ,Stencil,TactileTeachingBoardstop-Y TeachingBoardstop-YPlaceaboardontheinputtrack.Placeaboardontheinputtrack.PressSELECTtoContinue.Placeaboardontheinputtrack.(請將PCB板放到軌道輸入端)PressSELECTtoContinue.(按SELECT繼續(xù))你按SELECT之後，出現(xiàn)開始做板邊視窗：Jogtotheleadingedgeoftheboard.Jogtotheleadingedgeoftheboard.Stay1/2inchinfromtherails.PressEXIT!Jogtotheleadingedgeoftheboard.(請將十字游標(biāo)移動到基板板邊Stay1/2inchinfromtherails.PressEXIT!中間位置後,按EXIT離開)※此動作最主要是讓視覺系統(tǒng)內(nèi)基板停止感應(yīng)器,感應(yīng)基板是否停止在印刷平臺中心點(diǎn)位置選擇TeachBoardstops-X進(jìn)入PCB板停止到印刷平臺中心點(diǎn)位置參數(shù)設(shè)定與PCB板和鋼板對位Mark點(diǎn)) TeachingBoardstop-X TeachingBoardstop-XIstheboardcenteredcorrectly?PressSELECTtoacceptlocation.Istheboardcenteredcorrectly?PressSELECTtoacceptlocation.PressNEXTto-locateboard.PressEXITtoabortprocess.Istheboardcenteredcorrectly?(基板有無正確停止到印刷平臺中心點(diǎn)位置)PressSELECTtoacceptlocation.(按SELECT接受目前位置)PressNEXTto-locateboard.(按NEXT調(diào)整基板正確停止到印刷平臺中心點(diǎn)位置)PressEXITtoabortprocess.(按EXIT中止這一項(xiàng)步驟)你按NEXT之後，出現(xiàn)以下視窗：(將基板往前及往後送到印刷平臺中心點(diǎn)位置)你按SELECT之後，出現(xiàn)以下訊息：Pleaseinsertastencil.Pleaseinsertastencil.PressNEXTtocontinue!Pleaseinsertastencil.(請放入鋼板)PressNEXTtocontinue!(按NEXT繼續(xù))你按NEXT之後，出現(xiàn)以下訊息及視窗：Jogtoanytargetontheboard!Jogtoanytargetontheboard!Centertheobject.PressEXITJogtoanytargetontheboard!(請移動到基板上任一個對位Mark點(diǎn))Centertheobject.PressEXIT(對正Mark中心點(diǎn)，按EXIT離開)你按EXIT之後，出現(xiàn)以下訊息及視窗：Jogtothesametargetonthestencil!Jogtothesametargetonthestencil!Centertheobject.PressEXITJogtothesametargetonthestencil!(請移動到鋼板上任一個對位Mark點(diǎn)Centertheobject.PressEXIT ，對正Mark中心點(diǎn)，但必須與基板上Mark點(diǎn)一樣,按EXIT離開)※但如果X軸方向,超過軟體保護(hù)極限會出現(xiàn)以下訊息,可能需重做對位點(diǎn)。WarningMessageWarningMessageXAXIS–SOFTWARELIMITWARNING!PressNEXTtoContinue.選擇Calc.Pre-Boardstops-X進(jìn)入基板X方向停止位置參數(shù)設(shè)定Calc.Pre-Boardstop-X Calc.Pre-Boardstop-XPreboardstoppositionlearnedPreboardstoppositionlearnedPressSELECTtocontinuePressDonewhenfinished.Preboardstoppositionlearned(機(jī)器自行計(jì)算基板停止位置)PressSELECTtocontinue(按SELECT繼續(xù))PressDonewhenfinished.(當(dāng)你做完上述之步驟，按Done)選擇Stencil進(jìn)入測鋼板高度參數(shù)設(shè)定Stencil HardwareRequired:Stencil Board,Stencil,Tactile,Pleaseinstallastencilnow.TheFRAMECLAMPSwillactivatewhenPleaseinstallastencilnow.TheFRAMECLAMPSwillactivatewhenyoupressNEXT.PressNEXTtoContinue,orEXITtoQuit.Pleaseinstallastencilnow.(請現(xiàn)在放入鋼板)TheFRAMECLAMPSwillactivatewhen(按NEXT後,啟動鎖住鋼板)youpressNEXT.PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息及視窗：ThenextstepistosetSTENCILHEIGHT.PressNEXTtoContinue,orEXITtoQuit. ThenextstepistosetSTENCILHEIGHT.PressNEXTtoContinue,orEXITtoQuit.ThenextstepistosetSTENCILHEIGHT.(然後進(jìn)行測鋼板高度)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息及視窗：CAUTION,Themachineisnowgoingtomove.STAYCLEAR.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingtomove.STAYCLEAR.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingto(警告,機(jī)器現(xiàn)在要移動,內(nèi)部不能有 move.STAYCLEAR.任何東西,需清除)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息及視窗：PressSELECTtoJOGthesensorclearofpasteorstecilapertures,orPressNEXTtoCONTINUE.PressSELECTtoJOGthesensorclearofpasteorstecilapertures,orPressNEXTtoCONTINUE.PressSELECTorNEXTtoContinue. PressSELECTtoJOGthesensorclearof(按SELECT移動偵測感應(yīng)器,勿 pasteorstecilapertures,碰到鋼板上錫膏及鋼板上PAD孔) orPressNEXTtoCONTINUE.(按NEXT馬上開始在本位置偵測鋼板高度)PressSELECTorNEXTtoContinue.(按SELECT或NEXT繼續(xù))你按SELECT之後，出現(xiàn)以下訊息及視窗：JOGACTIVE…JOGACTIVE…SQUEEGEESTROKEPressEXITtoquit.JOGACTIVE…(移動現(xiàn)在刮刀行程位置)SQUEEGEESTROKEPressEXITtoquit.(按EXIT離開)你按NEXT與EXIT之後，出現(xiàn)以下訊息及視窗：Locatingtheboard…Locatingtheboard…CAUTIONCAUTION：Autoheightsensorinprogress. Pleasewait…(開始載入PCB,自動偵測鋼板高度)StencilheightFOUND.StencilheightFOUND.PressNEXTtoContinue.StencilheightFOUND.(完成偵測鋼板高度)PressNEXTtoContinue.(按NEXT繼續(xù)下一步驟)選擇Squeegee進(jìn)入測刮刀高度與刮刀行程參數(shù)設(shè)定Squeegee HardwareRequired:Squeegee SqueegeeBlades,Stencil,TactileThisUtilitywillsettheSQUEEGEEheight.ThisUtilitywillsettheSQUEEGEEheight.PressNEXTtoContinue,orEXITtoquit.ThisUtilitywillsettheSQUEEGEEheight.(使用測刮刀高度)PressNEXTtoContinue,orEXITtoquit.(按NEXT繼續(xù),按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：Pleaseinstallastencilnow.Pleaseinstallastencilnow.TheREAMECLAMPSwillactivatewhenyoupressNEXT.PressNEXTtoContinue,orEXITtoquit.Pleaseinstallastencilnow.(現(xiàn)在請放入鋼板)TheREAMECLAMPSwillactivatewhen(按NEXT之後,啟動鋼板固定夾)youpressNEXT.PressNEXTtoContinue,orEXITtoquit.(按NEXT繼續(xù),按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：Youmustnowinstallthesqueegeeblade.Youmustnowinstallthesqueegeeblade.PressNEXTtoContinue,orEXITtoquit.Youmustnowinstallthesqueegeeblade.(你現(xiàn)在必須安裝刮刀)PressNEXTtoContinue,orEXITtoquit.(按NEXT繼續(xù),按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：CAUTION,ThemachineisnowgoingtoCAUTION,ThemachineisnowgoingtoMovetheZTOWERandcycletheSQUEEGEEUPandDOWN.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingto(注意,機(jī)器的Z軸和刮刀上下將MovetheZTOWERandcycle會移動)theSQUEEGEEUPandDOWN.PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：PressSELECTtofindStencilHeightPressSELECTtofindStencilHeightorNEXTtoBypass.PressNEXTtoContinue,orEXITtoQuit.PressSELECTtofindStencilHeight(按SELECT之後,再測一次鋼板高度orNEXTtoBypass.按NEXT之後,不測鋼板高度)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：PressSELECTtoJOGthesensorclearofPressSELECTtoJOGthesensorclearofpasteorstencilaperturesorpressNEXTtoCONTINUE.PressSELECTorNEXTtoContinue.PressSELECTtoJOGthesensorclearof(按SELECT移動偵測感應(yīng)器,勿pasteorstencilapertures碰到鋼板上錫膏及鋼板上PAD孔)orpressNEXTtoCONTINUE.(按NEXT馬上開始在本位置偵測刮刀高度)PressSELECTorNEXTtoContinue.(按SELECT或NEXT繼續(xù))你按SELECT之後，出現(xiàn)以下訊息及視窗：JOGACTIVE…JOGACTIVE…SQUEEGEESTROKEPressEXITtoquit.JOGACTIVE…(移動現(xiàn)在刮刀行程位置)SQUEEGEESTROKEPressEXITtoquit.(按EXIT離開)你按NEXT與EXIT之後，出現(xiàn)以下訊息及視窗並開始測前後刮刀高度：Levelingfrontblade.Levelingfrontblade.Levelingrearblade.Levelingrearblade.CAUTIONCAUTION：Autoheightsensorinprogress. Pleasewait…(開始偵測刮刀高度。測前刮刀時,偵測感應(yīng)器先下降碰到鋼板後,前刮刀下降,第一次先壓平刮刀,第二次自動偵測前刮刀高度;測後刮刀時,偵測感應(yīng)器先下降碰到鋼板後,後刮刀下降,第一次先壓平刮刀,第二次自動偵測後刮刀高度)(測完刮刀高度後,開始設(shè)定刮刀行程)AbouttosetSQUEEGEESTROKE.AbouttosetSQUEEGEESTROKE.PressNEXTtoContinue,orEXITtoquit.AbouttosetSQUEEGEESTROKE.(開始設(shè)定刮刀行程)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)YoumustnowjogtotheRearsqueegeeposition.YoumustnowjogtotheRearsqueegeeposition.PressNEXTtoContinue,orEXITtoquit.YoumustnowjogtotheRearsqueegeeposition.(你必須現(xiàn)在移動後刮刀位置)PressNEXTtoContinue,orEXITtoquit.(按NEXT繼續(xù),按EXIT離開)JOGACTIVE…JOGACTIVE…SQUEEGEESTROKEPressEXITtoquit.(開始移動刮刀行程,完畢按EXIT離開)Youmustnowjogtothefrontsqueegeeposition.Youmustnowjogtothefrontsqueegeeposition.PressNEXTtoContinue,orEXITtoquit.Youmustnowjogtothe(你必須現(xiàn)在移動前刮刀位置)Rearsqueegeeposition.PressNEXTtoContinus,orEXITtoquit.(按NEXT繼續(xù),按EXIT離開)JOGACTIVE…JOGACTIVE…SQUEEGEESTROKEPressEXITtoquit.(開始移動刮刀行程,完畢按EXIT離開)選擇PrintParameters進(jìn)入印刷參數(shù)設(shè)定PrintParameters HardwareRequired:PrintParameters NoneSqueegee刮刀設(shè)定參數(shù)刮刀向下壓力[(刮刀長度X1.2)/2.2]刮刀碰到鋼板後再向下壓之距離PrintSpeed 25刮刀印刷行程之速度Entersqueegeeprintingparameters.(輸入刮刀印刷參數(shù))(thisaffectsfrontANDrearsqueegees)(包涵前後刮刀)PressDonewhenfinished.(按Done完成)BoardParameters基板(PCB)參數(shù)設(shè)定PCB與鋼板之間隙(數(shù)字越大,間隙越大)ToolingType Unier. Dedicat.治具 不使用治具 使用治具 EnterSnapoffintosetupmenu.(輸入PCB與鋼板之間隙印刷參數(shù))SettozeroforCONTACTprinting.(接觸式印刷時，請?jiān)O(shè)為〞0”)PressDonewhenfinished.(按Done完成)SlowSnopoff慢速脫模參數(shù)設(shè)定Enabled No Yes不使用慢速脫模使用慢速脫模脫離鋼板前延遲時間慢速脫模之距離Speed 1 2 3 4 5 6慢速脫模速度 1脫模速度5mil/s 2脫模速度10mil/s 3脫模速度15mil/s 4脫模速度20mil/s 5脫模速度25mil/s 6脫模速度30mil/sEnterSlowsnapoffparameters.(輸入慢速脫模參數(shù))PressDonewhenfinished.(按Done完成)TEACHisnowcomplete.(程式現(xiàn)在設(shè)定完成)PressSELECTtosavenow,or(按SELECT現(xiàn)在存入檔案)PressNEXTtocontinue.(按NEXT繼續(xù)回主畫面按SELECT之後,出現(xiàn)存入檔案鍵盤畫面PressNEXTtocontinue.(按NEXT繼續(xù),回主畫面)2.TeachVision做一片PCB新程式的Mark點(diǎn)abouttoenterVISIONTEACHoperation.abouttoenterVISIONTEACHoperation.PressNEXTtoContinue,orEXITtoQuit.abouttoenterVISIONTEACHoperation.(即將進(jìn)入視覺系統(tǒng)設(shè)定操作)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息：Placeaboardoninputtrack.Placeaboardoninputtrack.PressNEXTtoContinue,orEXITtoQuit.Placeaboardoninputtrack.(請將基板放到軌道輸入端)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息：Locatingtheboard…Locatingtheboard…ADDorDELETEtargetstochangethe(新增或刪除,所指Mark點(diǎn)位置或變更目currentvisionlayout.前Mark點(diǎn)位置)PressEXITwhenyouareFINISHED.(當(dāng)你已完成Teachvision按EXIT)ADD 增加一個Mark點(diǎn)ADDDELETE 刪除一個Mark點(diǎn)DELETEVIEW 辨視做完的PC板與鋼板Mark點(diǎn)VIEWZOOMIN 將點(diǎn)選到位置擴(kuò)大與縮小ZOOMIN你按ADD之後，出現(xiàn)以下訊息：Areyoutrainingsyntheticfiducials?Areyoutrainingsyntheticfiducials?SELECTforYES,NEXTforNOAreyoutrainingsyntheticfiducials?(你要選擇自設(shè)Mark點(diǎn)嗎？)SELECTforYES,NEXTforNO(按SELECT要；按NEXT不要)※當(dāng)你按SELECT後,需要輸入自設(shè)選擇Mark點(diǎn)長、寬、高、尺寸等..)※當(dāng)你按NEXT後,依影像視覺系統(tǒng)自行判別Mark點(diǎn))按SELECT之後，出現(xiàn)以下視窗：※當(dāng)你按SELECT後,需要輸入自設(shè)選擇Mark點(diǎn)長、寬、高、尺寸等..)ADDfiducialfortheBOARD(增加Mark點(diǎn)到PCB上)PleaseSELECTthetypeoffiducialadd.(請選擇Mark點(diǎn)型式)PressDONEwhenfinished.(按DONE完成)按NEXT之後，出現(xiàn)以下視窗：Movethetrackballpointertothearea(移動軌跡球指到PC板上Mark點(diǎn)位置後,whereatargetistobeAddedand按SELECT後，影像視覺系統(tǒng)會移動到你thepressSELECT. 所指的位置)按SELECT之後，出現(xiàn)以下視窗：JOGtoBoardTarget(移動到PC板上Mark點(diǎn))PressNEXTforcontrastON,EXITtofinish.(按NEXT調(diào)整對比,按EXIT完成)按EXIT之後，出現(xiàn)以下視窗：BoardTarget1(PC板上第一個Mark點(diǎn))Adjusting:Position(調(diào)整搜尋範(fàn)圍框大小、尺寸)X:(搜尋範(fàn)圍框X方向)Y:(搜尋範(fàn)圍框Y方向)PleaseDefinetheBOARDTARGET.(請定義基板上Mark點(diǎn)收尋範(fàn)圍的位置與尺寸)PressNEXTtoalternatebetweenPOSITION(按NEXT變換搜尋範(fàn)圍框位置、尺adjustmodeandSIZEadjustmode.寸並調(diào)整)PressSELECTwhenDONE.(按SELECT完成)按SELECT完成後,會出現(xiàn)做第二個Mark點(diǎn)的訊息PressSELECTforMultiModelTeachorPressSELECTforMultiModelTeachorPressNEXTforSingleModelTeach.當(dāng)做完第一個Mark點(diǎn)時,如果第二點(diǎn)與第一點(diǎn)形狀大小,都不一樣時按SELECT；如果第二點(diǎn)與第一點(diǎn)形狀大小,都一樣時按NEXT,此訊息主要是減少定義搜尋範(fàn)圍框時間)按SELECT全部做完後，出現(xiàn)以下PC板上Mark點(diǎn)視窗：ADDorDELETEtargetstochangethe(新增或刪除,所指Mark點(diǎn)位置或變更目currentvisionlayout.前Mark點(diǎn)位置)PressEXITwhenyouareFINISHED.(當(dāng)你已完成Teachvision按EXIT)按EXIT之後,出現(xiàn)存入檔案鍵盤畫面3.DeviceLayout做2D(錫膏覆蓋率)檢查時,所要檢查零件AbouttobeginDeviceLayoutTEACH.AbouttobeginDeviceLayoutTEACH.PressNEXTtoContinue,orEXITtoQuit.AbouttobeginDeviceLayoutTEACH.(即將開始做2D檢查的零件之設(shè)定)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)按NEXT之後,出現(xiàn)以下視窗畫面ADDorDELETEDevice(新增或刪除,所指2D零件點(diǎn)位置或變更目前位置)Tochangethecurrent.PressEXITwhenyouareFINISHED.(當(dāng)你已完成DeviceLayout按EXIT)ADD 增加一個2D檢查點(diǎn)ADDDELETE 刪除一個2D檢查點(diǎn)DELETEZOOMIN 將點(diǎn)選到位置擴(kuò)大與縮小ZOOMIN你按ADD之後，出現(xiàn)以下訊息視窗：PleaseSELECTthetypeofdevicetobeadded.(請選擇新增2D零件型式)PressEXITtoquit.(按EXIT離開)選擇QFP零件時MovethetrackballpointertotheAreaMovethetrackballpointertotheAreaWherethedeviceistobeaddedandPressSELECTMovethetrackballpointertotheArea(移動軌跡球,按SELECT點(diǎn)選到PCWherethedeviceistobeaddedand板上QFP零件位置)PressSELECT按SELECT之後,出現(xiàn)以下訊息視窗畫面JOGtotheclosestHorizontalendpad.(移動虛線,選擇QFP第一點(diǎn)水平Theobjectshouldbecentered.PAD點(diǎn))PressEXITwhenyouareFINISHED.(按EXIT完成)PleaseDEFINEtheENDpadofthisdevice.PleaseDEFINEtheENDpadofthisdevice.PressNEXTtoalternatebetweenPOSITIONAdjustmodeandsizeadjustmode.PressEXITwhenyouareFINISHED.PleaseDEFINEtheENDpadofthisdevice.(請PAD點(diǎn)前後框起來)PressNEXTtoalternatebetweenPOSITION(按NEXT調(diào)整框位置、尺寸)Adjustmodeandsizeadjustmode.PressEXITwhenyouareFINISHED.(按EXIT完成)JOGtotheclosestVerticalendpad.(移動虛線,選擇QFP第一點(diǎn)垂直Theobjectshouldbecentered.PAD點(diǎn))PresswhenyouareFINISHED.(按EXIT完成)PleaseDEFINEtheENDpadofthisdevice.PleaseDEFINEtheENDpadofthisdevice.PressNEXTtoalternatebetweenPOSITIONAdjustmodeandsizeadjustmode.PressEXITwhenyouareFINISHED.PleaseDEFINEtheENDpadofthisdevice.(將PAD點(diǎn)前後框起來)PressNEXTtoalternatebetweenPOSITION(按NEXT調(diào)整框位置、尺寸)Adjustmodeandsizeadjustmode.PressEXITwhenyouareFINISHED.(按EXIT完成)按EXIT之後,影像視覺系統(tǒng)自動搜尋QFP4.TeachID做辨識鋼板身分當(dāng)有兩片一樣機(jī)種鋼板,一種為有IC零件,而另一種無IC零件,先做辨識鋼板身分以防放錯料。5.TeachCustomBGA編輯自行設(shè)計(jì)的BGA零件檔案版本)這個軟體能編輯自訂BGA，這個功能可達(dá)到50個X50的尺寸，計(jì)2500個PAD點(diǎn)，或單邊最大為100個PAD點(diǎn)，但是不能超過最大2500個PAD點(diǎn)。※編輯自訂一個新BGA視窗有十一個控制鈕。NEW 編輯一個新BGA。LOAD 載入已經(jīng)存檔BGA檔案。SAVE 儲存已經(jīng)編輯完成一個新BGA檔案。DELETE 刪除已經(jīng)編輯完成BGA檔案。IMPORT 從磁片載入一個BGA檔案。EXPORT 將BGA檔案儲存到磁片。POINT 以個別方式選擇一個PAD點(diǎn)增加或刪除。AREA 以一個區(qū)域方式來增加或刪除PAD點(diǎn)。FILL 增加之前已經(jīng)移走的任何PAD點(diǎn)。ZOOM 將BGA圖形顯示擴(kuò)大與縮小。RESIZE 改變BGAPAD點(diǎn)陣列數(shù)尺寸。EXIT 離開編輯自訂一個新BGA視窗。6.TeachOffsetMovesPAD點(diǎn)與印刷完錫膏點(diǎn)設(shè)定位置點(diǎn)版本)當(dāng)有印偏時先Teach所印偏PAD點(diǎn)位置。7.TeachVisionOffsetPAD點(diǎn)與印刷完錫膏點(diǎn)自動修正補(bǔ)償(修正完)做完印偏PAD點(diǎn)位置後,進(jìn)入影像視覺系統(tǒng),點(diǎn)取印偏兩個PAD點(diǎn),螢?zāi)簧蠒兴褜た?紅色框是點(diǎn)取印偏錫膏,黑色框是點(diǎn)取零件PAD點(diǎn),當(dāng)在Supervisor模式下做完此功能後,再到設(shè)定第一頁內(nèi)Vision下,X、Y、ThetaOffset值會改變；當(dāng)在Maintenance模式下做此功能後會改變內(nèi)部Vision值。版本)※所以不要在Maintenance模式下做此功能。FileLoadFileSaveFileDeleteFileBackupSystemRestoreSystemFileUploadFileDownloadSaveTimingFileLoadFile載入已存入程式檔案SaveFile存入程式檔案DeleteFile刪除程式檔案BackupSystem備份機(jī)器內(nèi)部資料及存入程式檔案RestoreSystem恢復(fù)備份機(jī)器內(nèi)部資料及存入程式檔案到機(jī)器內(nèi)硬碟FileUpload將已存入程式檔案存到磁片F(xiàn)ileDownload將磁片內(nèi)檔案回存入機(jī)器內(nèi)硬碟SaveTimingFile將目前程式檔案有關(guān)時間參數(shù)存入到磁片1.LoadFile載入已存入檔案上、下頁捲軸棒所選的程式程式總數(shù)程式顯示區(qū)上、下頁捲軸棒所選的程式程式總數(shù)程式顯示區(qū)確定取消確定取消PressSELECTonscrollbartogoup/down.PressSELECTonscrollbartogoup/down.PressNEXTonscrollbartopageup/down.PressSELECTonscrollbartogoup/down.(在捲軸棒,按SELECT上下捲動)PressNEXTonscrollbartopageup/down.(在捲軸棒,按NEXT翻頁)操作程序：1.在程式顯示區(qū)找尋你所要的程式,利用捲軸棒來捲動或翻頁程式顯示區(qū),然後點(diǎn)取你所要的程式。 2.點(diǎn)取的程式會顯示在『所選的程式』位置。 3.點(diǎn)取OK〔確定〕按鈕,表示要叫出程式。CANCEL〔取消〕按鈕,表示不要叫出程式。2.SaveFile儲存入檔案 當(dāng)你點(diǎn)取File功能表上的SaveFile出現(xiàn)如下畫面。畫面說明 FRANK:一個程式名稱 BACKSP:倒退消除鍵 ENTER:輸入確認(rèn)按鈕0~9數(shù)字鍵、26個英文字母鍵、1個空白鍵、1個『-』符號鍵:程式命名用Enterfilename.(輸入檔案名稱)Press<ENTER>whendone.(按ENTER輸入檔案名稱完成或按EXIT離開)OrEXITtoabort.ConfirmoverwriteConfirmoverwriteOKtooverwritefileOKtooverwritefile：FRANK？OKCANCELOKCANCEL(按OK後寫入檔案名稱)3.DeleteFile刪除已存入檔案程式總數(shù)上、下頁捲軸棒所選的程式程式顯示區(qū)程式總數(shù)上、下頁捲軸棒所選的程式程式顯示區(qū)取消確定取消確定PressSELECTonscrollbartogoup/down.PressSELECTonscrollbartogoup/down.PressNEXTonscrollbartopageup/down.PressSELECTonscrollbartogoup/down.(在捲軸棒,按SELECT上下捲動)PressNEXTonscrollbartopageup/down.(在捲軸棒,按NEXT翻頁)操作程序：在程式顯示區(qū)找尋你所要刪除的程式,利用捲軸棒來捲動或翻頁程式顯示區(qū),然後點(diǎn)取你所要的程式。點(diǎn)取的程式會顯示在『所選的程式』位置。點(diǎn)取OK〔確定〕按鈕,表示要刪除程式。點(diǎn)取CANCEL〔取消〕按鈕,表示不要刪除程式。4.BackupSystem備份已存入檔案AbouttoBACKUPsystemfilesfrom:AbouttoBACKUPsystemfilesfrom:A：PressNEXTtoContinue,orEXITtoQuit.AbouttoBACKUPsystemfiles(將系統(tǒng)資料與程式檔案備份到A磁碟機(jī))A：PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)1Diskisrequiredforthisbackup.1Diskisrequiredforthisbackup.PressNEXTtoContinue,orEXITtoQuit.1Diskisrequiredforthisbackup.(需要一片磁片)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)※因程式檔案多寡,所需要磁片數(shù)目不同InsertblankdiskindriveA:InsertblankdiskindriveA:Disk1Disk1PressNEXTtoContinue,orEXITtoQuit.InsertblankdiskindriveA:(插入空白磁片到A磁碟機(jī))Disk1Disk1(磁片第一片)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)CheckingdiskdriveCheckingdiskdrive (檢查是否為空白磁片,檢查完後開始備份系統(tǒng)資料與程式檔案)BackupcompleteBackupcompletePressNEXTtoContinueBackupcomplete(備份磁片完成)PressNEXTtoContinue(按NEXT繼續(xù))5.RestoreSystem載回備份檔案磁片AbouttoRESTOREsystemfilesfrom:AbouttoRESTOREsystemfilesfrom:A：PressNEXTtoContinue,orEXITtoQuit.AbouttoRESTOREsystemfilesfrom:(將A磁碟機(jī)資料備份載回到機(jī)器A：內(nèi)硬碟)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)InsertbackupdiskInsertbackupdisk1indriveA:PressNEXTtoContinue,orEXITtoQuit.Insertbackupdisk1indriveA:(插入備份磁片到A:磁碟機(jī))PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)ReadytorestoresystemReadytorestoresystemPressNEXTtoContinue,orEXITtoQuit.Readytorestoresystem(準(zhǔn)備開始載回備份磁片)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)CheckingbackupCheckingbackup(檢查是否為備份磁片,檢查完後開始載回備份系統(tǒng)資料與程式檔案)RestoreRestorecompletePressNEXTtoContinue.Restorecomplete(載回備份磁片完成)PressNEXTtoContinue.(按NEXT繼續(xù))6.FileUpload將已存入程式檔案存到磁片程式顯示區(qū)上、下頁捲軸棒所選的程式程式總數(shù)程式顯示區(qū)上、下頁捲軸棒所選的程式程式總數(shù)取消確定取消確定PressSELECTonscrollbartogoup/down.PressSELECTonscrollbartogoup/down.PressNEXTonscrollbartopageup/down.PressSELECTonscrollbartogoup/down.(在捲軸棒,按SELECT上下捲動)PressNEXTonscrollbartopageup/down.(在捲軸棒,按NEXT翻頁)操作程序：1.在程式顯示區(qū)找尋你所要的程式,利用捲軸棒來捲動或翻頁程式顯示區(qū),然後點(diǎn)取你所要的程式。 2.點(diǎn)取的程式會呈現(xiàn)藍(lán)色。 3.點(diǎn)取OK〔確定〕按鈕,表示要存入磁片。CANCEL〔取消〕按鈕,表示不要存入磁片。Filetransfercomplete.Filetransfercomplete.1filestransferredPressNEXTtoContinue.Filetransfercomplete.(程式檔案存入到磁片已完成)1filestransferred(一個程式檔案存入到磁片)PressNEXTtoContinue.(按NEXT繼續(xù))※因程式檔案多寡,所顯示程式檔案訊息不同7.FileDownload將磁片內(nèi)檔案回存入機(jī)器內(nèi)硬碟程式顯示區(qū)上、下頁捲軸棒程式總數(shù)所選的程式程式顯示區(qū)上、下頁捲軸棒程式總數(shù)所選的程式取消確定取消確定PressSELECTonscrollbartogoup/down.PressSELECTonscrollbartogoup/down.PressNEXTonscrollbartopageup/down.PressSELECTonscrollbartogoup/down.(在捲軸棒,按SELECT上下捲動)PressNEXTonscrollbartopageup/down.(在捲軸棒,按NEXT翻頁)操作程序：1.在程式顯示區(qū)找尋你所要的程式,利用捲軸棒來捲動或翻頁程式顯示區(qū),然後點(diǎn)取你所要的程式。 2.點(diǎn)取的程式會呈現(xiàn)藍(lán)色。 3.點(diǎn)取OK〔確定〕按鈕,表示要從磁片存入機(jī)器內(nèi)硬碟機(jī)。CANCEL〔取消〕按鈕,表示不要從磁片存入機(jī)器內(nèi)硬碟機(jī)。ConfirmoverwriteConfirmoverwriteOKtooverwritefileOKtooverwritefile：FRANK？CANCELSKIPOKCANCELSKIPOK(按OK後從磁片存入機(jī)器內(nèi)硬碟機(jī))Filetransfercomplete.Filetransfercomplete.1filestransferredPressNEXTtoContinue.Filetransfercomplete.(程式檔案存入到磁片已完成)1filestransferred(一個程式檔案存入到磁片)PressNEXTtoContinue.(按NEXT繼續(xù))※因程式檔案多寡,所顯示程式檔案訊息不同8.SaveTimingFile將目前程式檔案有關(guān)時間參數(shù)存入到磁片※此功能是將目前生產(chǎn)程式檔案內(nèi),有關(guān)時間參數(shù)存入到磁碟片中,如印刷完一片所需時間、等待時間等等…..UtilitiesLoadBoardStencilHeightSetStrokeLevelSqueegeeSqueegeeHeightKneadPasteCycleSqueegeeCycleWiperCycleDispenserVerifyStencilCalPrestopPositionECUUtilitiesLoadBoard載入PC板於中心點(diǎn)位置及視覺系統(tǒng)位置,頂?shù)戒摪逦恢肧tencilHeight測PC板到鋼板高度SetStroke設(shè)定刮刀組行程LevelSqueegee測前/後刮刀到鋼板高度(可程式刮刀組用)SqueegeeHeight測前/後刮刀到鋼板高度(標(biāo)準(zhǔn)刮刀組用)KneadPaste手動攪拌錫膏CycleSqueegee手動更換前/後刮刀組方向CycleWiper手動擦拭鋼板一次CycleDispenser手動自動加錫器加錫一次(需有自動加錫器)VerifyStencil辨識鋼板身分CalPrestopPosition重新矯正PC板停止位置ECUUtilities溫溼度控制器設(shè)定使用視窗1.LoadBoard載入PC板於中心點(diǎn)位置及視覺系統(tǒng)位置,頂?shù)戒摪逦恢肔oadBoard進(jìn)板指令集是將PC板送進(jìn)機(jī)器內(nèi),ZAXIS將會升高到不同高度,當(dāng)你在下拉式選項(xiàng)Utilities中選擇時,螢?zāi)簧蠒霈F(xiàn)手動進(jìn)板(ManualLoadBoard)的螢?zāi)蝗缟蠄D。鋼板高度(StencilHeight)：將PC板上升至鋼板的高度,這是可以查看PC板是否完全密和頂?shù)戒摪寮癙C板與鋼板有無對位。鏡頭高度(VisionHeight)：將PC板上升至視覺影像高度,這是可以查看PC板Mark點(diǎn)是否錯誤。定位工具高度(ToolingHeight)：將PC板上升至定位工具高度,這是可以查看PC板吸真空是否定位優(yōu)良及調(diào)整支撐PIN(SupportPIN)位置。4.Begin：開始送板到印刷區(qū)位置並依照上述設(shè)定上升高度5.Detent：載入PC板向前與向後於中心點(diǎn)位置6.Exit：跳出手動進(jìn)板的畫面,回到主畫面2.StencilHeight測PCB板到鋼板厚度ThisutilitywillthesetThisutilitywillthesetSTENCILheight.PressNEXTtoContinue,orEXITtoQuit.ThisutilitywillthesetSTENCILheight.(要開始使用偵測鋼板高度)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息及視窗：CAUTION,Themachineisnowgoingtomove.STAYCLEAR.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingtomove.STAYCLEAR.PressNEXTtoContinue,orEXITtoQuit.CAUTION,Themachineisnowgoingto(警告,機(jī)器現(xiàn)在要移動,內(nèi)部不能有 move.STAYCLEAR.任何東西,需清除)PressNEXTtoContinue,orEXITtoQuit.(按NEXT繼續(xù),按EXIT離開)你按NEXT之後，出現(xiàn)以下訊息及視窗：PressSELECTtoJOGthesensorclearofpasteorstencilapertures,orPressNEXTtoCONTINUE.PressSELECTtoJOGthesensorclearofpasteorstencilapertures,orPressNEXTtoCONTINUE.PressSELECTorNEXTtoContinue.PressSELECTtoJOGthesensorclearof(按SELECT移動偵測感應(yīng)器,以 pasteorstencilapertures,免碰到鋼板上錫膏及鋼板上PAD孔) orPressNEXTtoCONTINUE.(按NEXT馬上開始在本位置偵測鋼板高度