PCB基本英文培訓(xùn)教材

1、5A版優(yōu)質(zhì)實(shí)用文檔PCB基本英文培訓(xùn)教材中英制基本單位換算1 kg=2.205 lb(磅)1 磅=0.454 kg1英尺=12英寸1 OZ(盎司)=28.3527g1g=0.035270Z1 英寸 inch=1000 密爾 mil1 ft(英尺)=0.3048m1m=3.281ft1mil=1000u ”uin mil)1 碼=0.914m1m=1.094 碼1OZ=28.35克/平方英尺=35微米1 in(英寸)=25.4mm2 21mm=0.03937in2 21in=1000mil=25.4mm,1mil=25.4um1 m2=10.76 ft21 ft2=0.0929 m21ASD=1

2、安培/平方分米=10.76安培/平方英尺1磅力=4.4484牛頓1N=0.2248 磅力1加侖美制=3.785升1psi=0.06895bar1bar=14.5psi=1.013kg/cm1bar=100000Pa1馬力=0.746千瓦1 品脫=568 ml1oC=1.8 G C+32 F1 F=( F-32)/1.8 C1 英尺=30.5 cm基本英文詞匯1、流程Board cut開料Carbon printing碳油印刷Inner dry film內(nèi)層干膜Peelable blue mask藍(lán)膠Inner etchi ng內(nèi)層蝕刻ENIG(Electrolessnickelimmersio

3、 n gold)沉鎳金Inner dry film stripping內(nèi)層干膜退膜HAL(hot air leveli ng)噴錫AOI ( Automatic Optical In spect ion)自動(dòng)光學(xué)檢測(cè)OSP ( Organic solderability preservative)有機(jī)保焊Press ing壓板Punching啤板Drilli ng鉆孔Profili ng外形加工Desmear除膠渣，去鉆污E-Test電性測(cè)試PTH鍍通孔，沉銅FQC(final quality control)最終檢杳Panel plat ing整板電鍍FQA(Fi nal quality a

4、udit)最終抽檢Outer dry film外層干膜Pack ing包裝Etch ing蝕刻IPQA(I n-process quality audit)流程QATin strippi ng退錫IPQC(I n-process quality con trol)流程QCEQC( QC after etching)蝕檢QCIQC(lncoming quality control)來(lái)料檢杳Solder mask感阻MRB(material review board)材料評(píng)審委員會(huì)Comp onent mark字符QA(Quality assura nee)品質(zhì)保證Physical Laborat

5、ory物理實(shí)驗(yàn)室QC(Quality con trol)品質(zhì)控制Chemistry Laboratory化學(xué)實(shí)驗(yàn)室Docume nt con trol cen ter文件控制中心2nd Drilli ng二鉆Rout ing鑼板，銑板Brow n oGidati on棕化Waste water treatme nt污水處理V-cutV坑WIP ( work in process)半成品Store/stock倉(cāng)庫(kù)F.G( Fini shed goods)成品5A版優(yōu)質(zhì)實(shí)用文檔Page 1of 32、概述Prin ted Circuit Board印制電路板FleGible Prin ted Ci

6、rcuit, FPC軟板Double-Side Prin ted Board雙面板IPC ( The Institute for Interconnecting and Packing Electro nic Circuits)電子電路互連 與封裝協(xié)會(huì)CPAR ( Corrective & Preve ntive Actio n Reques)要求糾正預(yù)防措施Flammability Rate燃性等級(jí)Characteristic impeda nee特性阻抗BUM (Build-up multilayer):積層多層板Date Code周期代碼CCL (Copper-clad laminate

7、覆銅板Ionic con tam in ati on離子性污染Accepta nee Quality Level (AQL)允收水平HDI( Highden sityin terc onnecting)高密度互連板Base Material基材Radius半徑Capacity生產(chǎn)能力Diameter直徑Capability:工藝能力PPM(Parts Per Millio n)百萬(wàn)分之幾CAM( computer-aidedmanu facturi ng)計(jì)算機(jī)輔助制造Un derwritersLaboratoriesInc.美國(guó)保險(xiǎn)商實(shí) 驗(yàn)所CAD (computer-aided desig

8、 n)計(jì)算機(jī)輔助設(shè)計(jì)Statistical Process Con trol統(tǒng)計(jì)過(guò)程控制Specificati on規(guī)格，規(guī)范Via導(dǎo)通孔Dime nsio n尺寸Buried /bli nd via埋/盲孔Tolera nee:公差Tooli ng hole定位孔Ove n:焗爐Output/throughput產(chǎn)量Page 2 of 33、濕流程PTH ( plated through hole)鍍通孔（俗稱沉銅）Acid clea ning酸性除油PP(Pa nel Plat in g)板電Acid dip酸洗Pattern plat ing圖電Pre-dip預(yù)浸Line width線寬

9、Alkaline cleaning堿性除油Spaci ng線隙FluG松香Deburri ng去毛刺（沉銅前磨板）Hot air leveli ng噴錫Carbon treatme nt碳處理Skip plati ng跳鍍，漏鍍Track/c on ductor導(dǎo)線Un dercut側(cè)蝕Aspect ratio深徑比Water rinsing水洗Etch Factor蝕刻因子Tran sportati on行車Back Light Test背光測(cè)試Rack掛架Pink ring粉紅圈Maintenance保養(yǎng)4、干流程Hole locati on孔位Annu lar ring孔環(huán)Image T

10、ran sfer圖象轉(zhuǎn)移Compo nent Side(C/S)元件面Artwork底片Solder Side(S/S)焊接面Mylar膠片Matte Solder Mask啞綠油Silkscree n/lege nd/Comp onent Mark文字Hole breakout破孔Fiducial mark基點(diǎn)，對(duì)光點(diǎn)Scrubb ing磨板EGpose曝光Develop ing顯影5A版優(yōu)質(zhì)實(shí)用文檔5、內(nèi)層制作Corematerial內(nèi)層芯板Thermalpad散熱PADPre-pregPP片Resincontent樹脂含量KraftP aper牛皮紙Brow noGidati on棕化Layup排版BlackOGidati on黑化Registrati on對(duì)位Basematerial板材Delam ination分層6、其它Wicki ng燈芯效應(yīng)Holesize孔徑（尺寸）Yield良品率TouchUp:修理Warpa ndTwist板曲度Solve ntTestr溶劑測(cè)試Peelof