smt換線指導(dǎo)文件：profilingguidelineinlinechangeover

1、work instruction作業(yè)指導(dǎo)書doc. no. /文件編號(hào)：rev./版本號(hào)：product/產(chǎn)品：ftpei-15101alltitle / 標(biāo)題：profiling guideline in line changeover 在產(chǎn)品轉(zhuǎn)換中溫度檢驗(yàn)指導(dǎo)方計(jì)page/頁數(shù)1 of 4revision history / 版本記錄revision版本change description 修改內(nèi)容issuer發(fā)布者release date 發(fā)行日期01initial release/首次發(fā)行g(shù)ibi feng2005.12.09remark備注distribute the w1 tomb

2、u,qaapprovaldepartmentnametitle部門名字職位b2 meb2 mbub2 qadmp-001-f2.011. 0 purpose/ 目的to provide a profiling guideline for reflow and wave solder in line changeover to reduce line changeover time. 在生產(chǎn)線產(chǎn)品轉(zhuǎn)換中，提供回流爐和波峰爐的溫度檢驗(yàn)的指導(dǎo)方針，以便減少產(chǎn)品轉(zhuǎn)換時(shí)間。2.0 scope/范圍this document applies to all projects of shenzhou new

3、energy resources photo-electronics co.,ltd (fujian and shenzhen )文件適用于神州新能源光電科技有限公司(福建及深圳)制造的所有項(xiàng)口。shenzhou new energy resources photo-electronics technology co.,ltdnote: this procedure is only applied to the model that is ever used at this smt line.注意：該程序只適用于這個(gè)型號(hào)已在這條smt生產(chǎn)線生產(chǎn)過的產(chǎn)品轉(zhuǎn)換.3.0 responsible. /

4、責(zé)任pe: change the program of reflow and wave solder, adjust conveyor chain of reflow, check the temperature, test temperature and provide profile of reflow and wave solder.pr：轉(zhuǎn)換冋流爐和波峰爐的程序，調(diào)整冋流爐的傳送鏈,檢查設(shè)備參數(shù)，測(cè)試冋流爐和波峰爐的溫度及提供 溫度曲線圖。mbu: check the parameter of reflow and wave solder if they match with wl,

5、and record the parameter. mbu:檢查設(shè)備的參數(shù)是否與wi 一致，并作好記錄。ee: adjust the conveyor chain of wave solder; maintain the machine to ensure the function stability of reflow and wave solder.ee:調(diào)整波峰爐的傳送鏈，進(jìn)行設(shè)備的保養(yǎng)及維護(hù)以保證回流爐及波峰爐的穩(wěn)定性。qa: qualify first article as fa procedure.qa:根據(jù)首板質(zhì)量檢查程序進(jìn)行首板檢杳。4.0 procedure. /程序4.1

6、mbu notice pe and ee to change line according to actual production or pmc plan，place correct wi on line.4.1. mbu根據(jù)實(shí)際生產(chǎn)情況或pmc的生產(chǎn)計(jì)劃通知pe和ee對(duì)生產(chǎn)線進(jìn)行產(chǎn)品轉(zhuǎn)換，并成置止確的wi 到生產(chǎn)線上。4.2 pe change the program of reflow and wave solder, adjust conveyor chain of reflow, and check the parameter of program at once according

7、 to wi when they receive notice, and place the last time profile of this model to line.4.2 pe接到通知后，立刻轉(zhuǎn)換冋流爐和波峰爐的程序，調(diào)整冋流爐的傳送鏈和檢查參數(shù)是否與wi 一致，并 放置上一次的該型號(hào)的溫度曲線圖到線上。4.3 ee adjusts the conveyor chain of wave solder at once when they receive notice4.3 ee接到通知后，立刻調(diào)整波峰爐的傳送鏈。4.4 mbu checks if the parameter of ma

8、chine matches with wi and make a record according to relative docume nt. whe n the parameter does n't match with wi, mbu no tice pe at once pe must modify it as wi specified.4.4 mbu檢查設(shè)備參數(shù)是否與wi 一致，并根據(jù)相關(guān)文件做好記錄如果不一致時(shí)，立刻通知pe. pe必須 根據(jù)wi的規(guī)格進(jìn)行更改它。4.5 the first pcba after changeover can go through reflo

9、w and wave process; no need to wait for the profile verification result .after lsl pcba pass fa process, other pcba can be process as normal.4.5生產(chǎn)線轉(zhuǎn)換產(chǎn)品后，首塊pcba可以點(diǎn)接過冋流爐和波峰爐，不需等候爐了溫度檢驗(yàn)結(jié)果。在首塊 pcba按首板檢驗(yàn)程序通過檢驗(yàn)厲，其它的pcba可按正常的程序繼續(xù)生產(chǎn)。4.6. pe must verify the profile in line changeover and publish it out withi

10、n 1 2 hours after line cha ngeover completed 4.6 pe必須在產(chǎn)品轉(zhuǎn)換完成后的1到2個(gè)小吋內(nèi)進(jìn)行對(duì)爐了的實(shí)際溫度進(jìn)行檢驗(yàn)，并打印出溫度iii線圖.4.7 if ifs found that the profile is out of specification after pe verifies the profile, pe will act as below guideline:4.7如果pe檢驗(yàn)實(shí)際溫度時(shí)，發(fā)現(xiàn)實(shí)際溫度偏岀規(guī)格，pe將按下面的指導(dǎo)方針來執(zhí)行：4.7.1 for reflow process, if the peak tempe

11、rature is out of limit specification at +/-10 deg c, or the reflow time is out of limit specification at +/-10s;for wave soldering process, if the pre-heat temperature is out of limit specification at +/-10 deg c, or the solder pot temperature is out of limit specification at +/-10 deg c, line must

12、be stopped to re-set the profile immediately.4.7.1對(duì)于回流爐的工藝，如果回流爐的最高溫度超出限定規(guī)格的+/10度，或回流時(shí)間超出限立規(guī)格的 +/10秒時(shí)；對(duì)于波峰爐的工藝，如果預(yù)熱溫度超出限定規(guī)格的+/10度，或焊接最高溫度超出限定規(guī)格的+/10 度，生產(chǎn)線必須立刻停止生產(chǎn)來巫新設(shè)定溫度。4.7.2 all the processed pcba with out-of-specification profile will be put aside for pe and team's evaluation for passing, rew

13、ork, scrap etc further disposition.4. 7.2所冇超岀溫度規(guī)格并處理過的pcba必須被隔離，由pe和該項(xiàng)目團(tuán)隊(duì)進(jìn)行評(píng)估是否通過/返工/報(bào) 廢等進(jìn)一步處理。4.7.3 for reflow process, if the peak temperature is out of limit specification but within +/-10 deg c (for example, if spec is 230236 deg c, but the actual temperature is in of 220246 deg c),or the reflow

14、 time is out of limit specification but within +/-10s;for wave soldering process, if the pre-heat temperature is out of limit specification but within +/- 10 deg c; if the solder pot temperature is out of limit specification but within +/-10 deg c.but there's no abnormal defect was found in firs

15、t pcba and other pcba which has been processed, don't need stop line, and then pe will continue to monitor the process performance and set the profile to specification when product!on is stop for normal break. but if there's abnormal defects are found, refer to item .7.3對(duì)于回流爐工藝，如果回流爐的最高溫度超岀限定規(guī)格，但沒超出限定規(guī)格z外的+/10度(比 如，如果規(guī)格是23