CCM產(chǎn)品工藝知識(shí)培知識(shí)

1、CCM產(chǎn)品工藝知識(shí)培知識(shí)2o 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用o 產(chǎn)品的類型產(chǎn)品的類型o 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造o 產(chǎn)品的制作工藝產(chǎn)品的制作工藝o 問(wèn)與答問(wèn)與答o 附錄附錄:專業(yè)名詞介紹專業(yè)名詞介紹3Part I 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用4Part I 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用拆解拆解5Part II 產(chǎn)品的類型產(chǎn)品的類型 軟板定焦模式(FF) 1. B-To-B 2.Gold Finger6Part II 產(chǎn)品的類型產(chǎn)品的類型 軟板變焦模式 1.手動(dòng)變焦(MF) 2.自動(dòng)變焦(AF)7Part II 產(chǎn)品的類型產(chǎn)品的類型 插槽模式(Socket)8Part II 產(chǎn)品的類型產(chǎn)品的類型 像素分類 CIF (352*

2、288) 10萬(wàn)像素 (0.1M) VGA (640*480) 30萬(wàn)像素 (0.3M) SXGA (1280*1024) 130萬(wàn)像素 (1.3M) UXGA (1600*1200) 200萬(wàn)像素 (2.0M)9Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 CSP (Chip Scale Package)ChipLensBarrelHolderIR FilterstiffenerFPCSolder BallGlass10Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 COB (Chip On Board)ChipLensBarrelHolderIR FilterFingerGold WireFPCPCB1

3、1Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造鏡頭鏡頭(Lens)鏡座鏡座(Holder)芯片芯片(Chip)電路板電路板(PCB)連接器連接器(Con.)12Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造CMOS CHIPLENS HOLDERLENS BARRELThese 3 items come as an assembly1st LENS ELEMENT2nd LENS ELEMENTIR GLASSSUBSTRATEFPC13Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 材料 1. 晶圓(Wafer) 主要是由硅和鍺組成,是攝像頭模組的核心部分,稱之為影像傳感器。14Part IV 產(chǎn)品的制作工

4、藝產(chǎn)品的制作工藝 2. 線路板 Printed Circuit Board印刷電路板,是電子元器件的支撐體,是電子元器件電氣連接的提供者,簡(jiǎn)稱PCB.15Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 3. 鏡座(Holder) 16Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 4. 鏡頭(Lens)17Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 5. 軟板(FPC) Flexible Circuit Board軟性印制電路是以聚酰亞胺或聚酯薄膜為基材制成的一種具有高度可靠性絕佳的可撓性印刷電路。18Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 工藝流程 Wafer清洗Plasma清洗固晶固晶

5、烘烤邦線金線檢查DAM邦定DAM烘烤二流體清洗CCD檢查Glass貼附CCD檢查固化半成品測(cè)試19ProcessSupply WaferTrayOKOKOKOKN/AOKN/AOKIR Glass Attach ProcessCM800Barrel Insert ProcessCM800dispenseCMOS ChipdispenseIR Glassdispense+Lens BarrelDie Attach ProcessCM800Holder Attach ProcessCM80020Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝Die Bonding:使芯片 與PCB粘合。 21Part

6、 IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝Wire Bonding: 通過(guò)金線焊接使芯片與PCB線路導(dǎo)通。 2. 線弧 22Solder PasteScreen PrintPassive PlacementForDie AttachPassiveSolder PastePassiveSubstrate23Die AttachWire BondingWet CleanChipSensorAreaAu WireChipSensorAreaAu Wire24IR Glass MountIR Glass SAWWafer RingIR GlassIR Glass25Glue DispenseIR Glass

7、 AttachHolderHolderGlueGlueIR cut GlassIR Glass26Glue DispenseHolder AttachGlueGlueBarrel InsertBarrelHolder27Singlationcutcut28Focus adjustBarrelBarrel FixationMotorLighting（ （Percolation Method)chartAchromatic LensND4（ （Adjustment of Light Quantity） ）Laser29Part V 問(wèn)與答問(wèn)與答30Part VI 專業(yè)名詞介紹專業(yè)名詞介紹3132B

8、onding Process33Free air ball is captured in the chamfer34Free air ball is captured in the chamferSEARCH HEIGHT35Free air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 136Free air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 137Free air ball is captured in the chamferSEARCH TOL 1S

9、EARCH SPEED138Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED139Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED140Formation of a first bondSEARCH SPEED1SEARCH TOL 141Formation of a first bondSEARCH SPEED1SEARCH TOL 1IMPACT FORCE42Formation of a first bondContact 43F

10、ormation of a first bondBase 44Capillary rises to loop height position45Capillary rises to loop height position46Capillary rises to loop height position47Capillary rises to loop height position48Capillary rises to loop height position49Capillary rises to loop height position50Formation of a loopRD (

11、Reverse Distance)51Formation of a loop5253Calculated Wire LengthWIRE CLAMP CLOSE54Calculated Wire Length55SEARCH DELAY56TRAJECTORY57TRAJECTORY58TRAJECTORY59TRAJECTORY60TRAJECTORY61TRAJECTORY62TRAJECTORY63TRAJECTORY64TRAJECTORY65TRAJECTORY662nd Search HeightSearch Speed 2Search Tol 267Search Speed 2Search Tol 268Search Speed 2Search Tol 269Formation of a secon