masslaminationpanel預(yù)制內(nèi)層覆箔板corematerial內(nèi)層芯板

1、mass lamination panel 預(yù)制內(nèi)層覆箔板core material 內(nèi)層芯板bonding layer 粘結(jié)層film adhesive 粘結(jié)膜unsupported adhesive film 無支撐膠粘劑膜cover layer (cover lay) 覆蓋層stiffener material增強(qiáng)板材copper-clad surface 銅箔面foil removal surface 去銅箔面unclad laminate surface 層壓板面base film surface 基膜面adhesive faec 膠粘劑面plate finish 原始光潔面matt

2、 finish 粗面length wise direction 縱向cross wise direction 模向cut to size panel 剪切板ultra thin laminate超薄型層壓板A-stage resin A 階樹脂B-stage resin B 階樹脂C-stage resin C 階樹脂epoxy resin 環(huán)氧樹脂phenolic resin 酚醛樹脂polyester resin 聚酯樹脂polyimide resin 聚酰亞胺樹脂bismaleimide-triazine resin雙馬來酰亞胺三嗪樹脂acrylic resin 丙烯酸樹脂melamin

3、e formaldehyde resin 三聚氰胺甲醛樹脂polyfunctional epoxy resin 多官能環(huán)氧樹脂brominated epoxy resin 溴化環(huán)氧樹脂epoxy novolac 環(huán)氧酚醛fluroresin 氟樹脂silicone resin 硅樹脂silane 硅烷polymer 聚合物amorphous polymer 無定形聚合物crystalline polamer 結(jié)晶現(xiàn)象dimorphism 雙晶現(xiàn)象copolymer 共聚物synthetic 合成樹脂thermosetting resin 熱固性樹脂thermoplastic resin 熱塑性

4、樹脂photosensitive resin 感光性樹脂epoxy value 環(huán)氧值dicyandiamide 雙氰胺binder 粘結(jié)劑adesive 膠粘劑curing agent 固化劑flame retardant阻燃劑opaquer 遮光劑plasticizers 增塑劑unsatuiated polyester 不飽和聚酯polyester 聚酯薄膜polyimide film (PI)聚酰亞胺薄膜polytetrafluoetylene (PTFE)聚四氟乙烯reinforcing material增強(qiáng)材料glass fiber 玻璃纖維E-glass fibre E 玻璃纖維

5、D-glass fibre D 玻璃纖維S-glass fibre S 玻璃纖維glass fabric 玻璃布non-woven fabric 非織布glass mats 玻璃纖維墊yarn 紗線filament 單絲strand 絞股weft yarn緯紗warp yarn經(jīng)紗denier 但尼爾warp-wise 經(jīng)向thread count 織物經(jīng)緯密度weave structure 織物組織plain structure 平紋組織grey fabric 壞布woven scrim 稀松織物bow of weave 弓緯end missing 斷經(jīng)mis-picks 缺緯bias 緯斜

6、crease 折痕waviness 云織fish eye 魚眼feather length 毛圈長mark厚薄段split 裂縫twist of yarn 捻度size content 浸潤劑含量size residue 浸潤劑殘留量finish level 處理劑含量size 浸潤劑couplint agent 偶聯(lián)劑finished fabric 處理織物polyarmide fiber聚酰胺纖維aromatic polyamide paper聚芳酰胺纖維紙breaking length 斷裂長height of capillary rise 吸水高度wet strength retent

7、ion 濕強(qiáng)度保留率whitenness 白度ceramics 陶瓷conductive foil 導(dǎo)電箔copper foil 銅箔rolled copper foil 壓延銅箔annealed copper foil 退火銅箔thin copper foil 薄銅箔adhesive coated foil 涂膠銅箔resin coated copper foil 涂膠脂銅箔composite metallic material 復(fù)合金屬箔carrier foil載體箔invar 殷瓦foil profile 箔（剖面）輪廓shiny side 光面matte side 粗糙面treated

8、 side 處理面stain proofing 防銹處理double treated foil 雙面處理銅箔shematic diagram 原理圖logic diagram 邏輯圖printed wire layout印制線路布設(shè)master drawing 布設(shè)總圖computer aided drawing計算機(jī)輔助制圖computer controlled display 計算機(jī)控制顯示placement 布局routing 布線layout 布圖設(shè)計rerouting 重布simulation 模擬logic simulation 邏輯模擬circit simulation 電路模擬

9、timing simulation時序模擬modularization模塊化layout effeciency 布線完成率MDF databse 機(jī)器描述格式數(shù)據(jù)庫design database 設(shè)計數(shù)據(jù)庫design origin 設(shè)計原點(diǎn)optimization (design) 優(yōu)化（設(shè)計）predominant axis 供設(shè)計優(yōu)化坐標(biāo)軸table origin 表格原點(diǎn)mirroring鏡像drive file 驅(qū)動文件intermediate file中間文件manufacturing documentation制造文件queue support database 隊列支撐數(shù)據(jù)庫c

10、omponent positioning 元件安置graphics dispaly 圖形顯示scaling factor 比例因子scan filling 掃描填充rectangle filling 矩形填充region filling 填充域physical design 實體設(shè)計logic design 邏輯設(shè)計logic circuit 邏輯電路hierarchical design 層次設(shè)計top-down design 自頂向下設(shè)計bottom-up design 自底向上設(shè)計net 線網(wǎng)digitzing 數(shù)字化design rule checking 設(shè)計規(guī)則檢查router (

11、CAD)走（布）線器net list 網(wǎng)絡(luò)表subnet 子線網(wǎng)objective function 目標(biāo)函數(shù)post design processing (PDP) 設(shè)計后處理interactive drawing design 交互式制圖設(shè)計cost metrix 費(fèi)用矩陣engineering drawing 工程圖block diagram 方塊框圖moze 迷宮component density 元件密度traveling salesman problem 回售貨員問題degrees freedom 自由度out going degree 入度incoming degree 出度ma

12、nhatton distance 曼哈頓距離euclidean distance 歐幾里德距離network 網(wǎng)絡(luò)array陣列segment 段logic 邏輯logic design automation 邏輯設(shè)計自動化separated time 分線separated layer 分層definite sequence 定順序conduction (track) 導(dǎo)線（通道）conductor width 導(dǎo)線（體）寬度conductor spacing 導(dǎo)線距離conductor layer 導(dǎo)線層conductor line/space 導(dǎo)線寬度 /間距conductor laye

13、r No.1 第一導(dǎo)線層round pad 圓形盤square pad 方形盤diamond pad 菱形盤oblong pad 長方形焊盤bullet pad 子彈形盤teardrop pad 淚滴盤snowman pad 雪人盤V-shaped pad V 形盤annular pad環(huán)形盤non-circular pad 非圓形盤isolation pad 隔離盤monfunctional pad 非功能連接盤offset land 偏置連接盤back-bard land腹（背）裸盤anchoring spaur 盤址land pattern連接盤圖形land grid array連接盤網(wǎng)

14、格陣列annular ring孔環(huán)component hole 元件孔mounting hole 安裝孔supported hole 支撐孔u(yù)nsupported hole 非支撐孔via 導(dǎo)通孔plated through hole (PTH)鍍通孔access hole 余隙孔blind via (hole) 盲孔buried via hole 埋孔buried blind via埋 ,盲孔any layer inner via hole 任意層內(nèi)部導(dǎo)通孔all drilled hole 全部鉆孔toaling hole 定位孔landless hole 無連接盤孔interstitial

15、 hole 中間孔landless via hole 無連接盤導(dǎo)通孔pilot hole 引導(dǎo)孔terminal clearomee hole 端接全隙孔dimensioned hole 準(zhǔn)尺寸孔via-in-pad在連接盤中導(dǎo)通孔hole location 孔位hole density 孔密度hole pattern 孔圖drill drawing鉆孔圖assembly drawing 裝配圖datum referan參考基準(zhǔn)微組裝技術(shù) MPT/Microelectronic Packaging echnology 混裝技術(shù) Mixed Component Mounting Technolo

16、gy封裝Package貼片Pick and Place拆焊 Desoldering再流 Reflow浸焊 Dip Soldering拖焊 Drag soldering印制電路 Printed Circuit印制線路 Printed Wiring印制電路板 printed circuit board印制線路板 printed wiring board層壓板 laminate覆銅薄層壓板 copper-clad laminate基材 base material成品板 production board印刷 printing導(dǎo)電圖形 conductive pattern印制組件 printed com

17、ponent單面印制板 single-sided printed board雙面印制板 double-sided printed board多層印制板 multilayer printed board電烙鐵Iron熱風(fēng)嘴hot air reflowing noozle吸錫帶 soldering wick吸錫器 tin extractor焊后檢驗 post-soldering inspection目視檢驗 visual inspection機(jī)器檢驗machine inspection焊點(diǎn)質(zhì)量soldering joint quality焊電缺陷soldering jont defect錯焊sol

18、der wrong漏焊solder skips虛焊pseudo soldering冷焊cold soldering橋焊solder bridge脫焊open soldering焊點(diǎn)剝離solder off不潤濕焊點(diǎn)soldering nonwetting錫珠solder ball拉尖icicle ； solder projection孔洞void焊料爬越solder wicking過熱焊點(diǎn)overheated solder connection不飽和焊點(diǎn)insufficient solder connection過量焊點(diǎn)excess solder connection助焊劑剩余flux res

19、idue焊料裂紋solder crazeing焊角翹起fillet-lifting； lift-offAI :Auto-Insertion自動插件AQL :acceptable quality level允收水平ATE :automatic test equipment自動測試ATM :atmosphere氣壓BGA :ball grid array球形矩陣CCD :charge coupled device 監(jiān)視連接組件(攝影機(jī) )CLCC :Ceramic leadless chip carrier陶瓷引腳載具COB :chip-on-board芯片直接貼附在電路板上cps :centip

20、oises(黏度單位 ) 百分之一CSB :chip scale ball grid array芯片尺寸BGACSP :chip scale package 芯片尺寸構(gòu)裝CTE :coefficient of thermal expansion熱膨脹系數(shù)DIP :dual in-line package雙內(nèi)線包裝 (泛指手插組件)FPT :fine pitch technology 微間距技術(shù)FR-4 :flame-retardant substrate玻璃纖維膠片(用來制作PCB 材質(zhì) )IC :integrate circuit 集成電路IR :infra-red 紅外線Kpa :kilo

21、pascals( 壓力單位 )LCC :leadless chip carrier引腳式芯片承載器MCM :multi-chip module多層芯片模塊MELF :metal electrode face二極管MQFP :metalized QFP金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference國際電子包裝及生產(chǎn)會議ppm:parts per million指每百萬 PAD( 點(diǎn) )有多少個不良PAD( 點(diǎn) )psi :pounds/inch2 磅 /英吋 2PWB :printed wiring boa

22、rd電路板QFP :quad flat package四邊平坦封裝SIP :single in-line packageSIR :surface insulation resistance 絕緣阻抗SMC :Surface Mount Component表面黏著組件SMD :Surface Mount Device表面黏著組件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏著設(shè)備制造協(xié)會SSOP :shrink small outline package 收縮型小外形封裝TAB :tape automaticed bondi

23、ng帶狀自動結(jié)合TCE :thermal coefficient of expansion膨脹 (因熱 )系數(shù)Tg :glass transition temperature玻璃轉(zhuǎn)換溫度THD :Through hole device須穿過洞之組件 (貫穿孔 )TQFP :tape quad flat package 帶狀四方平坦封裝UV :ultraviolet 紫外線uBGA :micro BGA微小球型矩陣cBGA :ceramic BGA陶瓷球型矩陣PTHlated Thru Hole導(dǎo)通孔IA Information Appliance信息家電產(chǎn)品MESH網(wǎng)目OXIDE氧化物FLUX

24、助焊劑LGA (Land Grid Arry) 封裝技術(shù)LGA 封裝不需植球，適合輕薄短小產(chǎn)品應(yīng)用。TCP (Tape Carrier Package)ACF Anisotropic Conductive Film異方性導(dǎo)電膠膜制程Solder mask 防焊漆Soldering Iron烙鐵Solder balls 錫球Solder Splash 錫渣Solder Skips 漏焊Through hole 貫穿孔Touch up 補(bǔ)焊Briding 穚接 (短路 )Solder Wires 焊錫線Solder Bars 錫棒Green Strength 未固化強(qiáng)度 (紅膠 )Transter

25、 Pressure 轉(zhuǎn)印壓力 (印刷 )Screen Printing 刮刀式印刷Solder Powder 錫顆粒Wetteng ability 潤濕能力Viscosity 黏度Solderability 焊錫性Applicability使用性Flip chip 覆晶Depaneling Machine組裝電路板切割機(jī)Solder Recovery System 錫料回收再使用系統(tǒng)Wire Welder主機(jī)板補(bǔ)線機(jī)X-Ray Multi-layer Inspection System X-Ray孔偏檢查機(jī)BGA Open/Short X-Ray Inspection Machine BGA

26、X-Ray 檢測機(jī) Prepreg Copper Foil Sheeter P.P. 銅箔裁切機(jī)Flex Circuit Connections 軟性排線焊接機(jī)LCD Rework Station液晶顯示器修護(hù)機(jī)Battery Electro Welder電池電極焊接機(jī)PCMCIA Card Welder PCMCIA卡連接器焊接Laser Diode 半導(dǎo)體雷射Ion Lasers 離子雷射Nd: YAG Laser石榴石雷射DPSS Lasers 半導(dǎo)體激發(fā)固態(tài)雷射Ultrafast Laser System 超快雷射系統(tǒng)MLCC Equipment積層組件生產(chǎn)設(shè)備Green Tape C

27、aster, Coater薄帶成型機(jī)ISO Static Laminator積層組件均壓機(jī)Green Tape Cutter組件切割機(jī)Chip Terminator積層組件端銀機(jī)MLCC Tester積層電容測試機(jī)Components Vision Inspection System芯片組件外觀檢查機(jī)高壓恒溫恒濕壽命測試機(jī) High Voltage Burn-In Life Tester電容漏電流壽命測試機(jī) Capacitor Life Test with Leakage Current 芯片打帶包裝機(jī) Taping Machine組件表面黏著設(shè)備Surface Mounting Equipment電阻銀電極沾附機(jī)Silver Electrode Coating MachineTFT-LCD( 薄膜晶體管液晶顯示器) 筆記型用STN-LCD( 中小尺寸超扭轉(zhuǎn)向液晶顯示器行動電話用PDA( 個人數(shù)字助理器)CMP( 化學(xué)機(jī)械研磨)制程研磨液 (Slurry) ，Co