設(shè)備校正培訓(xùn)

1、SMT設(shè)備製造廠設(shè)備製造廠G200與F130差異SMT設(shè)備製造廠設(shè)備製造廠目錄 G200新特點介紹 G200與F130設(shè)備規(guī)格差異 G200與F130機械結(jié)構(gòu)差異 G200與F130電氣控制差異 G200與F130應(yīng)用軟體差異 G200與F130可以互換之部品SMT設(shè)備製造廠設(shè)備製造廠G200新特點介紹 SI-G200的貼裝速度高達0.08秒不僅傳承了貼裝精度高省空間設(shè)計電力消耗低之細(xì)胞式貼片機的新特點。維護間隔時間比以往機器延長約兩倍。單位面積生產(chǎn)率居同行業(yè)首位,雙頭交替運動貼裝可前后操作機器。SMT設(shè)備製造廠設(shè)備製造廠SI-F 系列系列F130 6F209 29.6mG 系列系列4.8mG

2、200(A+A)x3 +G200(B+B)其他公司產(chǎn)品其他公司產(chǎn)品CM402 x2+ CM402(Multi)生產(chǎn)線的生產(chǎn)能力生產(chǎn)線的生產(chǎn)能力 170,000CPH成本成本 100%生產(chǎn)線的生產(chǎn)能力生產(chǎn)線的生產(chǎn)能力 155,000CPH (91% of SI-F)成本為成本為 SI-F 110%生產(chǎn)線的生產(chǎn)能力生產(chǎn)線的生產(chǎn)能力 163,000CPH (96% of SI-F)成本為成本為SI-F 85%7.5m貼片機貼片機 F系列系列 其他公司產(chǎn)品其他公司產(chǎn)品 G系列系列CPH/成本成本 170,000 140,000 191,000CPH/m2 11,805 8,17521,447與現(xiàn)行機種

3、的比較與現(xiàn)行機種的比較SMT設(shè)備製造廠設(shè)備製造廠2250重量: 2200公斤 SI-G200 的尺寸的尺寸寬度和高度與F系列相同深度比F系列增加了160mmSMT設(shè)備製造廠設(shè)備製造廠 貼裝速度貼裝速度 45,000CPH與SI-F130相比，速度增快了1.7倍 靈活性 可以將高速貼片頭和多功能貼片頭進行自由組合 (AxA, AxB, BxB) 精度 高速貼片頭: +/-45mm (3 sigma) 多功能貼片頭: +/-40mm (3 sigma)SI-G200 的特征的特征SMT設(shè)備製造廠設(shè)備製造廠SI-G200 規(guī)格規(guī)格料架配備數(shù)料架配備數(shù)對象電路板尺對象電路板尺寸寸電源電源/消費電力消費

4、電力空氣壓空氣壓/空氣消費量空氣消費量主體尺寸主體尺寸重量重量高速貼片頭高速貼片頭多功能貼片頭多功能貼片頭前側(cè)40個 + 后側(cè)40個 (共80 個) *前側(cè)40 個 + 后側(cè)40個或 17 料架 + 15 x 2托盤 (*)貼片頭配置貼片頭配置24 吸嘴/2 貼片頭(12 吸嘴/1貼片頭)16 吸嘴/2 貼片頭 (8 吸嘴/1 貼片頭)吸嘴交換吸嘴交換-24種的吸嘴順次交換對象零件尺寸對象零件尺寸0402 12 mm2 (移動攝像機)A 6 25 mm2 (固定攝像機)零件高度: 6 mm1005 100 x 50 mm零件高度: 13 mm貼裝速度貼裝速度（最佳條件）（最佳條件）0.08秒/

5、2 貼片頭/移動攝像機 ( 45,000 CPH )0.16秒/2 貼片頭 (22,500 CPH)裝著精度裝著精度0.045 (3) mm0.040 (3) mmSI-G20050 x 50 460 x 410 mm (但長度超過330 mm的電路板無段式機能)電路板厚度: 0.5 3.0 mm0.49 to 0.5Mpa, 約 10 L/min. (約 50N L/min.)1,220(W) x 1,850(D) x 1,575(H) mm(無托盤轉(zhuǎn)換器)2,200 kgAC 3相 200V10%, 50/60Hz, 4.0 KVASMT設(shè)備製造廠設(shè)備製造廠高速貼片頭高速貼片頭 （A 型貼

6、片頭型貼片頭）多功能貼片頭多功能貼片頭（B型貼片頭型貼片頭)貼片頭貼片頭功能功能12個吸嘴個吸嘴單位貼裝時間：單位貼裝時間：0.16秒秒040225x25, 零件高度零件高度=6與與 F130AI貼片頭相同貼片頭相同8個吸嘴個吸嘴單位貼裝時間單位貼裝時間：0.32秒秒1005100 x50, 零件高度零件高度 ATX MOTHER BOARD 1CPU（ （1HEAD/1CPU） ）SYMC - SYMC2（SI-F130AI & SI-G200）Old type cannot be used.SERIAL DIO MASTER ISA 512pointPCI 1024point(2

7、point) Old type cannot be used. Control function addition between PC with RAS board(RAS BOARD 2)shut down control port(COM2)-USB Serial conversion port(COM7)MEMORINK BOARD deletion , RAID Function deletionHDD & FILTER / No need remove PC UNIT for exchange. However,if need exchange only HDD, it i

8、s necessary to change the UPS setting with control panel.Communicates between PC / use LANCPU Pentium4 2.4GHz-2.8GHzMEMORY 512MB(W-CPU)-1GBISA BUS,PICMG is abolition,PCI BUSx5Use AGP GRAPHIC CARD (before use CPU board internal organs VRAM)OS / Windows2000 + Vx Works + KUKA Vx WinSMT設(shè)備製造廠設(shè)備製造廠PC UNIT

9、 layoutTemperature sensorSMT設(shè)備製造廠設(shè)備製造廠PC UNIT layoutSMT設(shè)備製造廠設(shè)備製造廠Change point from SI-F130(2)POWER UNIT The magnet is changed to 30A correspondence. POWER ON/OFF CONTROL BOARD 3 Relay was changed. PC BATTERY separates to another unit (to BATTERY UNIT). DC24V POWERJWS series-HWS series DC12V POWER (f

10、or monitor)30W(for 1 monitor-100W(for 2 monitor) ZWS series -HWS seriesDRIVER UNIT DC24V POWERJWS series - HWS series DC5V,12V POWERLWT50 - SWT65Capacity change DC3.3V POWER Addition(for SY-EX2) DC48V POWERZWS150PF - ZWS240PAF(capacity change & for environment measures) PUSHER/BULK BOARD 2Improv

11、ement (from SI-F130AI Bulk function deletion) Contactpoint output addition (contact point for welding detection )(DV-19)(有效防止24V短路燒壞PUSHER/BULK BOARD 2)SMT設(shè)備製造廠設(shè)備製造廠POWER UNIT layoutSMT設(shè)備製造廠設(shè)備製造廠DRIVER UNIT layoutSMT設(shè)備製造廠設(shè)備製造廠Change point from SI-F130(3)SERVOI/F UINT SY-EX+SY-IF2 SY-EX2 (SI-F130AI a

12、lso) AMP bus MP bus(GPIB I/F IC)Improvement of communication reliabilitySERVO UNIT Sheet metal change depends on change number of axis. FRONT 6 axis,REAR 6 axis(SERVO PACK TYPE same as SI-F130) Array of SERVO PACK / Y-X-H-F-RT-RN(Axis Num.2-1-3-4-6-7) SERVO PACK exchange / Possible to detach by two

13、axis. Resurrection resistance is set up in the unit. EX2 ENCODER UNIT(New) Two EX2 ENCODER BOARD Installed.BATTERY UNIT(New) Backup for FRONT & REAR PC. Two BATTERY Installed. Easy to exchange.SMT設(shè)備製造廠設(shè)備製造廠SERVO I/F UNIT layoutSMT設(shè)備製造廠設(shè)備製造廠SERVO UNIT layoutSMT設(shè)備製造廠設(shè)備製造廠EX2 ENCODER UNIT & BAT

14、TERY UNIT layoutSMT設(shè)備製造廠設(shè)備製造廠Change point from SI-F130(4)IO UNIT1 CONVEYOR CONTROL BOARD 4-A / Relay changed(SI-F130AI also) SAFETY RELAY BOARD / New(CE Agreement measures)IO UNIT2 (for front) EMG BOARD 3-B A part is changed to the relay socket. Relay breakdown measures version(SI-F130AI also)LED CO

15、NTROL BOARD 4 memory data increase, Hangup measures by heat(SI-F130AI also)IO UNIT3 (for rear) Same as IO UNIT2The I/O unit was divided into 3part. SMT設(shè)備製造廠設(shè)備製造廠I/O UNIT13 layoutI/O UNIT 1(UPPER)I/O UNIT 2(MIDDLE)I/O UNIT 3(LOWER)SMT設(shè)備製造廠設(shè)備製造廠Change point from SI-F130(5)Other special notes main brea

16、ker 15A -30A transformer also changes. (NOISE FILTER is no change) A HEAD-B HEAD Exchange is possible only by the wiring change of the head. One-touch exchange is technically impossible now. TRAY CHANGER is designing now. Possible to change to four head specification.However, the data download is separate. (No correspondence schedule) MONITOR Change toTouch panel built-in type. (Product different from SI-F130) Addition two SIGNAL LIGHT For Parts-out warningSMT設(shè)備製造廠設(shè)備製造廠G200與F130電氣控制差異 雙主機分別控制前后貼裝SMT設(shè)備製造廠設(shè)備製造廠SMT設(shè)備製造廠設(shè)備