線路板PCB專業(yè)英語詞匯制造、測試、缺陷名等

1、PC吸語t審匚（一）1.綜合詞匯Printed circuit印制電路Printed wiring印制線路Printed circuit board印制電路板Printed wiring board印制線路板Printed component印制元件Printed contact印制接點(diǎn)Single-sided printed circuit board (SSB)單面印制電路板double-sided printed circuit board (SSB)雙面印制電路板Multilayer printed circuit board (MLB)多層印制電路板Rigid printed cir

2、cuit board剛性印制電路板Flexible printed circuit board撓性印制電路板Flex-rigid printed circuit board撓性印制電路板Build-up printed board積層印制板Surface laminar circuit(SLC)表白層合電路板B2it printd board埋入凸塊互連 印制板ALIVH Multilayer printd board層間全內(nèi)導(dǎo)通 多層印制板Chip on board (COB)載心片板Backplane背板Bare board裸板Break-away board可斷拼板nterconnect

3、ion互連Conductor race line導(dǎo)線Substrate基底R(shí)eal estate基板面Conductor side導(dǎo)線面Component side元件面Solder side焊接面Printing印制grid網(wǎng)格pattern圖形Conductive pattern導(dǎo)電圖形Non- conductive pattern非導(dǎo)電圖形Legend字符Mark標(biāo)志2.基材基材的種類和結(jié)構(gòu)Base material基材Laminate層壓板Copper-clad laminate (CCL)覆銅箔層壓板Prepreg預(yù)浸材料Bonding sheet/bonding layer粘結(jié)片E

4、poxy glass substrate環(huán)氧玻璃基板Copper-clad surface銅箔面Foil removal surface去銅箔面Length wise direction縱向cross wise direction橫向Core material內(nèi)層芯材2.2基材的材料A-stage resinA階樹脂B-stage resinB階樹脂C -stage resinC階樹脂epoxy resin環(huán)氧樹脂Polymer聚合物Photosensitive resin感光性樹脂Thermosetting resin熱固性樹脂Thermoplastic resin熱塑性樹脂Adhensiv

5、e.狡粘劑Curing agent固化劑Flame retardant阻燃劑opaquer遮光劑Polyester film (PET)聚酯薄膜Polyimide film (PI)聚酰亞胺薄膜Polytetrafluoetylene (PTFE)聚四氟乙烯Non-woven fabric非織布/無紡布Glass fiber玻璃纖維Glass fabric玻璃布Warp-wise經(jīng)向Weft-wise緯向Copper foil銅箔Eletrodeposited copper foil電解銅箔Rolled copper foil壓延銅箔Resin coated copper foil (RCC)

6、涂樹脂銅箔2.3基材的制造Polymerize聚合Thermoplastic熱塑性Thermoset熱固性Clad覆箔Layup疊層aminating層壓Postcure后固化Curing time固化時(shí)間Resinflow樹脂流動(dòng)度Resin content樹脂含量PC吸語詞匯（二）3設(shè)計(jì)3.1通用術(shù)語Computer-aided design (CAD)計(jì)算機(jī)輔助設(shè)計(jì)Computer-aided manufacturing (CAM)計(jì)算機(jī)輔助制造Routing布線Layout布圖設(shè)計(jì)Component density元件密度Arry陣列3.2形狀與尺寸Conductor導(dǎo)線Conduct

7、or width導(dǎo)線寬度Conductor spacing導(dǎo)線間距Conductor width/space導(dǎo)線寬度/間距Conductor layer導(dǎo)線層Component hole元件孔Mounting hole安裝孔Supported hole支撐孔Unsupported hole非支撐孔Via導(dǎo)通孔Plated through hole鍍通孔Blind via (hole)盲孔Buried via (hole)埋孔Buried/ blind via埋/盲孔Any layer inner via hole (ALIVH)任意層內(nèi)部導(dǎo)通孔Tooling/ pilot hole定位孔Lan

8、dless hole無連接盤導(dǎo)通孔Via-in-pad在連接盤中導(dǎo)通孔Pitch節(jié)距Fine pitch精細(xì)節(jié)距3.3電氣互連nterfacial connection表卸間連接Interlayer connection層間連接nnerlayer connection內(nèi)層連接Pad, land連接盤Component lead3.4其他Primary side主面Secondary side輔面Signal layer信號(hào)層Crosstalk串?dāng)_Capacitance電容Electromagnetic interference (EMT)電磁干擾Electromagnetic shieldin

9、g電磁屏蔽Impedance特性阻抗nductance電感Coplanarity共面性（度）Core material芯板Thin type multilayer board薄型多層板Buried and blind via hole mutilayer board埋/盲孔多層板Buried bump interconnection technology (B2it)嵌入凸塊互連技術(shù)Multichip module (MCM)多芯片模塊Alignment mark對(duì)準(zhǔn)標(biāo)記Registration mark對(duì)位標(biāo)記Layer to layer registration層間重合度PC吸語詞匯（三）

10、4.制造4.1通用術(shù)語Subtractive process減成法Additive process加成法Semi-additive process半加成法Full-additive process全加成法Build up process積層法Solder mask on bare copper (SMOBC)裸銅覆阻焊工藝Tenting掩蔽法Sequential lamination順序?qū)訅悍╓et process濕處理Panel plating process板面電鍍法Pattern plating process圖形電鍍法Finishing最終修飾Reworking返工Tooling fe

11、ature工藝標(biāo)識(shí)Panel在制板，拼板First article首板Prototype試樣板End product最終產(chǎn)品Process flow工藝流程Process window工藝范圍Lot size/ batch批量Job traveller工作流程單4.2照相底版制作Artwork照相底圖Phototool照相底版Artwork master照相原版Working master工作原版Production master生產(chǎn)底版Photographic film照相底片Silver film銀鹽底片Diazo film重氮底片Positive正像Positive pattern正像圖

12、形Negative負(fù)像Negative pattern負(fù)像圖形Photo plotting光繪圖Laser platting激光繪圖Gerber fileGerber文件Photoplotter光繪機(jī)Laser plotter激光繪圖機(jī)Registration mark定位標(biāo)記4.3圖形轉(zhuǎn)移Printing ink印料Etching resist ink抗蝕印料Plating resist ink耐電鍍印料Resist抗蝕劑Photo resist光致抗蝕劑Dry film photoresist干膜光致抗蝕劑Liquid photoresist液體光致抗蝕劑Positive-acting r

13、esist正性抗蝕劑Negative-acting resist負(fù)性抗蝕劑Plating resist耐電鍍抗蝕劑Plated resist抗蝕鍍層Permanent resist永久性保護(hù)層Electro-deposited photoresist電沉積光致抗蝕劑Mask掩膜Solder resist 、solder mask阻焊劑Solder mask ink阻焊印料Dry film solder mask阻焊干膜Liquid photosensitivesolder resist液體光致阻焊劑Marking ink 、legend ink標(biāo)記印料Conductive paste導(dǎo)電膏Ho

14、le filing ink堵孔油墨Peelable solder mask ink可剝性防焊油墨Thermally curable 、heat cured熱固化Ultraviolet curable (UV cured)紫外線固化Screen printing網(wǎng)版印刷Silk screen絲印網(wǎng)版Stencil網(wǎng)版Screenability網(wǎng)印能力Chase、frame網(wǎng)框Fabric、cloth絲網(wǎng)Mesh count網(wǎng)目數(shù)Squeegee刮板PCB英語詞匯（四）（續(xù)上一頁）Skip printing漏印Thinner、diluent稀釋劑Viscosity粘度Imaging成像Imagin

15、g transfer圖像轉(zhuǎn)移Dry film imaging干膜制圖形Lamination貼膜Wet lamination濕法貼膜Exposure曝光holding time停留時(shí)間developing顯影developer顯影液anti-foamer/消泡劑resolution分辨率anti-foaming agentdefinition逼真度ghost image重影halation暈環(huán)air inclusion夾雜氣泡tackiness粘著性post cure后固化shelf life保存期pot life/ working life適用期dip coating浸涂法roller coa

16、ting輻涂法spray coating噴涂法curtain coating簾幕法laser direct imaging激光直接 成像4.4清洗與蝕刻rinsing / rinse水洗electrolytic cleaning電解清洗alkaline degreasing化學(xué)除油electrolytic degreasing電解除油overflow溢流deionized water去離子水表卸活性 劑surface active agent /surfactantsurface tension表曲張力wetting潤濕wetting agent / wetter潤濕劑tarnish污化dra

17、g in/ drag out帶進(jìn)/帶 出brushing / scrubbing磨刷abrasive磨料scrubber磨刷機(jī)mechanical cleaning機(jī)械清洗chemical clearing化學(xué)清洗浮石粉/ 火山灰pumice powersand blasting噴砂deburring去披峰/ 去毛刺mechanical polishing機(jī)械拋光chemical polishing化學(xué)拋光electropolishing電拋光etchant蝕刻劑/ 蝕刻液under etch側(cè)蝕microetch微蝕over etching過腐蝕stripper剝離液bright dip浸亮

18、4.5電鍍和涂覆Plating鍍覆electrochemistry電化學(xué)electrolyte電解質(zhì)electrolytic solution電解液electrochemical corrosion電化學(xué)腐 蝕chemical corrosion化學(xué)腐蝕onization電離migration遷移solubility溶解度addition agent/additive添加劑brightening agent/brightener光亮劑levelling agent整平劑catalyst/catalyzer催化劑activator/activating agent活化劑acceleration

19、agent/accelerator增速劑chelating agent/chelant螯合劑complex絡(luò)和物swelling agent/sweller膨松齊1Jplasma等離子體electroplating電鍍metal electroplating金屬電沉 積bright plating光亮電鍍PCB英語詞匯（五）alloy plating合金電鍍strike plating沖擊鍍flash/flash plating閃鍍pulse plating脈沖電鍍r(jià)ack plating掛鍍barrel plating滾鍍brush plating刷鍍selective plating選擇性

20、電鍍Auxiliary anode輔助陽極Auxiliary cathode輔助陰極Preplating鍍前處理Postplating鍍后處理Plating up電鍍加厚Pattern plating圖形電鍍Panel plating整板電鍍Copper (electro) plating電鍍銅Tin-lead plating電鍍錫鉛Plating line電鍍線Electroless plating, electroless deposition無電電鍍Immersion plate浸鍍Plated throughElectroless copper了 1仝屋伊holeplatingDire

21、ct plating直接電鍍Roughening粗化Activating敏化Catalyzing催化Mentallization金屬化Acceleration增速Chemisorption化學(xué)吸附Swelling溶脹Hole conditioning整孔Hole cleaning洗孔Desmear, smear去鉆污Etchback凹蝕removalPlasma desmear等離子去鉆污passivation鈍化acid dipping弱浸蝕pickling強(qiáng)浸蝕hot melting熱熔fusing fluid熱熔液solder levelling焊料整平tin immersion浸錫so

22、lder焊錫solder coat焊錫涂層flux助焊劑preflux預(yù)焊劑organic solderability preservatives (OSP)有機(jī)保護(hù)劑black oxidation黑氧化brown oxidation棕氧化Pink ring粉紅圈（環(huán)）pits麻點(diǎn)peeling起皮blister起泡orange peel桔皮pores針孔porosity孔隙率hardness硬度tarnish金屬變色4.6機(jī)械加工和壓制drilling鉆孔numerical control (NC)數(shù)控back-up墊板e(cuò)ntry material蓋板spindle主軸ring / coll

23、ar鉆套feed rate進(jìn)給速率off set鉆面不勻resin smear樹脂鉆污foil burr銅箔毛刺break-out破出hole counter數(shù)孔機(jī)laser via hole激光鉆孔photo via hole光致穿孔plasma via hole等離子穿孔counterboring沉頭孔（埋頭孔）countersinking錐形孔platen熱壓板opening/daylight開檔press plate壓模板bonding layer /粘結(jié)層kraft paper牛皮紙bonding sheetamination void層間空洞dent凹蝕crease皺褶punchi

24、ng沖切bugle hole冷沖die沖模shearing / cutting喇叭孔routing銃切bevelling倒斜邊chamfer倒角scoring刻糟V cutV槽切割Sewing hole縫紉孔Fixture夾具Indexing hole基準(zhǔn)孔Tooling feature定位特征PCB英語詞匯（六）（續(xù)上一頁）5 .檢測5.1通用術(shù)語nspection檢驗(yàn)test試驗(yàn)as received驗(yàn)收態(tài)production board成品板test board測試板coupon附連板qualification testing鑒定試驗(yàn)acceptance tests驗(yàn)收試驗(yàn)acceler

25、ated test加速試驗(yàn)aging老化quality conformance testing質(zhì)量一致性試驗(yàn)storage life貯存期specification規(guī)范standard標(biāo)準(zhǔn)tolerance容差/公差nonconformity不合格nonconforming item (unit)不合格品defect缺陷sampling11inspection抽樣檢驗(yàn)acceptable quality level (AQL)可接收質(zhì)量水平5.2外觀和尺寸visualblister起泡examination/visual目檢nspectionblow hole氣孔bulge凸起cracking

26、裂縫crazing微裂紋burr毛刺dishdown凹陷measling白斑delamination分層dent / indentation壓痕fiber exposure露纖維wrinkle皺褶haloing暈圈hole breakout破環(huán)void空洞hole void孔壁空洞foreign material（基材內(nèi)）外來物ifted land連接盤起翹nail heading釘頭nick缺口nodule結(jié)瘤pin hole針孔pit麻點(diǎn)resin recession樹脂凹縮scratch劃痕bump凸瘤laminate void層壓空洞mealing粉點(diǎn)shadowing / etch

27、back凹蝕陰影5.3電性能Surface insulation resistance (SIR)表明絕緣電阻Dielectric constant介電常數(shù)Dielectricstrength介電強(qiáng)度Dielectric breakdown介電擊穿Dielectric withstanding耐電壓 1Metal migration金屬遷移voltageElectro migration電遷移Known good board (KGB)已知好板PCB英語詞匯（七）（續(xù)上一頁）5.4非電性能Bond strength粘合強(qiáng)度Pull-off strength拉脫強(qiáng)度Pull-out streng

28、th拉出強(qiáng)度Pull strength拉離強(qiáng)度Peel strength剝離強(qiáng)度Flexural strength彎曲強(qiáng)度Tensile strength拉伸強(qiáng)度Shear strength剪切強(qiáng)度Torsional strength抗扭強(qiáng)度Hole pull strength孔拉脫強(qiáng)度Pull away拉禺Tear strength撕裂強(qiáng)度Bow弓曲Twist扭曲Coefficient ofthermalexpansion (CTE)熱導(dǎo)率Dimensional stability尺寸穩(wěn)定性Machinability機(jī)械加工性Heat resistance耐熱性Thermal stress熱

29、應(yīng)力Thermal shock熱沖擊Substrate bending test基板彎曲試驗(yàn)Bendability彎曲能力Fatigue life疲勞壽地Fatigue limit疲勞極限Fatigue strength疲勞強(qiáng)度Abrasion resistance耐磨（擦）性Wear resistance耐磨（損）性Crease褶痕Solderability可焊性Wetting焊料潤濕Dewetting半潤濕Nonwetting不潤濕Microsectioning顯微剖切Porosity test孔隙率試驗(yàn)Cleanliness清潔度Ionic cleanliness離子清潔度cni7ahi

30、a離子污染Nonionic contaminant非離子污染contaminantOrganic contamination有機(jī)污染Outgassing排氣Self-extinguishing自熄性Chemical resistance耐化學(xué)性bleeding滲出6.組裝surface mountsurface mount表卸組裝技術(shù)component表卸組裝兀件technology (SMT)(SMC)chip scale package (CSP) /chip scale mounting芯片級(jí)組裝flip chip package (FCP)倒芯片封裝soldering焊接reflow

31、soldering再流焊wave soldering波峰焊assembly density組裝密度ead引線lead foot / lead引腳（腿）ead pitch引腳節(jié)距fine pitch devices (FPD)精細(xì)節(jié)距器件node連接節(jié)點(diǎn)chip carrier芯片載體ball grid array (BGA)球柵陣列chip / die / dice裸芯片flip chip倒裝芯片active devices (parts)有源器件passive devices (parts)無源器件embedded component埋入元件add-on component附加元件integ

32、rated circuit (IC) |集成電路resin flux樹脂（松香）助焊 劑bond焊（連）接electrical電橋接dross焊渣bridgingresidue殘留物stress relief消除應(yīng)力印制電路技術(shù)英語縮略語ALIVH (any layer inner via hole)任意層內(nèi)部導(dǎo)通孔AOI (automatic optional inspection)自動(dòng)光學(xué)檢驗(yàn)BGA (ball grill array)球柵陣列BUM (build-up multilayer)積層式多層板BUT (build-up technology)積層式技術(shù)CAM (computer aided manufacturing)計(jì)算機(jī)輔助制造CCL (copper clad laminate)覆銅箔層壓板CMT (chip mount technology)芯片安裝技術(shù)CNC (computer numerical control)計(jì)算機(jī)數(shù)字控制COB (chip-on-board)載心片板CPCA (China Printed Circuit Association)中國印制電路行業(yè)協(xié)會(huì)CSP (chip scale packaging)芯片級(jí)封裝DI (direct imagi