CF制程原理介紹yao解析課件

1、RedGreenBlueWhiteGray Scale0816243240485663Color Number of LCDFor color depth 6 bits, There are 26 x 26 x 26 = 262,144 colorsFor color depth 8 bitsThere are 28 x 28 x 28 = 16,777,216 colors第1頁，共25頁。Scan LineData LineTFTPolarizerCFPolarizerPCBLight GuideLampLC cellTFT-LCD Structure第2頁，共25頁。TFT-LCD St

2、ructure第3頁，共25頁。TFT-LCD Structure第4頁，共25頁。The Operation Principles of LCDTake the 90o TN as the exampleData from：SHARPs website第5頁，共25頁。The Operation Principles of LCDTake the 90o TN as the exampleData from：SHARPs website第6頁，共25頁。Color Filter反面正面dotdotdot1個 Pixel第7頁，共25頁。裝可愛!第8頁，共25頁。CR glassAEI gla

3、ss(BM glass)ADI glass第9頁，共25頁。RR+GR+G+B第10頁，共25頁。R+G+B+ITOMVAPS第11頁，共25頁。Unpacker & Initial cleaner鉻膜濺鍍鉻玻璃清洗正光阻塗佈(1)素玻璃投入1.Cr sputtering鉻玻璃正光阻塗佈(2)Cr sputterCr glassPre-cleanerSlit coaterSpin coater2.CNVR05 line ( BM )黑色矩陣製程(BM patterning process)第12頁，共25頁。蝕刻去光阻紫外線曝光顯影去掉邊緣光阻EBR(Edge Bead Rinse)Align

4、erDeveloperDFIN073. PREC01 ( Etching )EtchingStrippingBM pattern glass真空乾燥Vacuum Dryer預烘烤與冷卻Pre-bake & Cool plateTitleDefect insp第13頁，共25頁。RGB製程(RGB process)紅色光阻塗佈(1)紅色光阻塗佈(2)Pre-cleanerSlit coaterSpin coaterBM pattern glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Remove)AlignerDeveloper烘烤Oven1.CNVR06 Line真空乾燥

5、Vacuum Dryer預烘烤與冷卻Pre-bake & Cool plateDefect insp.第14頁，共25頁。RGB製程(RGB process)綠色光阻塗佈(1)綠色光阻塗佈(2)Pre-cleanerSlit coaterSpin coaterR glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Remove)AlignerDeveloper烘烤Oven2.CNVR04 Line真空乾燥Vacuum Dryer預烘烤與冷卻Pre-bake & Cool plateDefect insp.第15頁，共25頁。RGB製程(RGB process)藍色光阻塗佈(1

6、)藍色光阻塗佈(2)Pre-cleanerSlit coaterSpin coaterR,G glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Remove)AlignerDeveloper3.CNVR03 Line真空乾燥Vacuum Dryer預烘烤與冷卻Pre-bake & Cool plateDefect Inspection缺陷檢查機Defect insp.第16頁，共25頁。ITO製程(ITO sputtering process)ITO pre-cleaner氧化銦錫膜濺鍍ITO玻璃ITO sputterITO glassR,G,B璃投入UV asher紫外線

7、灰化烘烤Oven第17頁，共25頁。MVA製程(Multi-domain Vertical Alignment)正光阻塗佈(1)正光阻塗佈(2)Pre-cleanerSlit coaterSpin coaterITO glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Rinse)AlignerDeveloper烘烤Oven4.CNVR01 Line真空乾燥Vacuum DryerPre-bake & Cool plate預烘烤與冷卻Defect insp.第18頁，共25頁。PS製程(Photo Spacer)負光阻塗佈(1)負光阻塗佈(2)Pre-cleanerSlit

8、coaterSpin coaterITO/MVA glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Rinse)AlignerDeveloper烘烤Oven4.CNVR02 Line真空乾燥Vacuum DryerPre-bake & Cool plate預烘烤與冷卻Defect insp.第19頁，共25頁。最終檢查(Final inspection)AOI Pre-cleaner光學檢查前清洗Macro inspection巨觀檢查Judgement判定Sorting&ShippingAOI (Auto -Opto Inspection)光學檢查Micro review

9、微觀檢查Repair修補第20頁，共25頁。CF 製程檢查項目1.黑色矩陣製程(BM patterning process)1.1.BM PHOTO & Etching LINE顯影後缺陷檢查ADI (After Developer Inspection)巨觀檢查( Macro review )1231.Total Pitch ( 長寸法)2.CD (Critical Dimension )3.Mark to Edge ( 端寸法 )蝕刻後缺陷檢查AEI (After Etcher Inspection)1724BAD4CEdcbaRGB第21頁，共25頁。2.RGB製程(RGB process)CF 製程檢查項目121.Pixel CD2.Overlay3.厚度(B之後)4.色度量測34.色度量測巨觀檢查5.巨觀檢查第22頁，共25頁。3.ITO製程(ITO Sputtering process)CF 製程檢查項目1.色度量測 2.阻值 3.Total pitch 4.巨觀檢查第23頁，共25頁。4.MVA製程(Multi-doma