電子行業(yè)專業(yè)詞匯術(shù)語

1、電子行業(yè)專業(yè)詞匯術(shù)語GRR Gauge Repeatability Reproducibility 量測(cè)的再現(xiàn)性與再生性FPI First Piece Inspection 首件檢查Sampling without replacement 不放回抽樣SQA: Source(Supplier) Quality Audit 供貨商品質(zhì)審核QC : quality control 質(zhì)量管理IQC : incoming quality control 進(jìn)料質(zhì)量管理OQC : output quality control 出貨質(zhì)量管理PQC : process quality control 制程質(zhì)量管

2、理也稱IPQC : in process quality control .AQL : acceptable quality level 允收標(biāo)準(zhǔn)CQA: customer quality assurance客戶品質(zhì)保證MA : major defeat 主要缺點(diǎn)MI : minor defeat 次要缺點(diǎn)CR :critical defeat 關(guān)鍵缺點(diǎn)SMT : surface mounting technology 表面粘貼技術(shù)SMD :surface mounting device 表面粘貼程序SMC : surface mounting component 表面粘貼組件ECN : en

3、gineering change notice 工程變更通矢口DCN : design change notice 設(shè)計(jì)變更通知PCB : printed circuit board 印刷電路板PCBA : printed circuit board assembly 裝配印刷電路板BOM : bill of material材料清單BIOS : basically input and output system 基本輸入輸出系統(tǒng)MIL-STD-105E :美國陸軍標(biāo)準(zhǔn)，也稱單次抽樣計(jì)劃.ISO : international standard organization 國際標(biāo)準(zhǔn)化組織24.

4、Short circuit :短路27 . Excess component :多件29 . Excessive solder :錫多31. Solder ball :錫球24. Short circuit :短路27 . Excess component :多件29 . Excessive solder :錫多31. Solder ball :錫球33 . Sideward :側(cè)立35. Gold finger:金手指25. Missing component : 缺件 26. Wrong component 錯(cuò)件28. Insufficient solder :錫少30. Solder r

5、esidue:錫渣32. Tombstone :墓碑34. Component damage :零件破損36. SOP : standard operation process 標(biāo)準(zhǔn)操作流程37. SIP : standard inspection process 標(biāo)準(zhǔn)檢驗(yàn)流程38 .The good and not good segregation :良品和不良品區(qū)分41. Histogram :直方圖39. OBW : on board writer 41. Histogram :直方圖40 . Simple random sampling :簡(jiǎn)單隨機(jī)抽樣42 . Standard dev

6、iation :標(biāo)準(zhǔn)差45 . Sub-contractors :分包商47. Sampling sample :抽樣計(jì)劃49. QTS: Quality tracking system 45 . Sub-contractors :分包商47. Sampling sample :抽樣計(jì)劃49. QTS: Quality tracking system 質(zhì)量追查系統(tǒng)51. Spare parts:備用品53. Manpower/Tact estimation 工時(shí)預(yù)算SPC : Statistical process control 制程統(tǒng)制46. SQE: Supplier quality e

7、ngineering48. Loader :治具50. Debug :調(diào)試52. Inventory report for : 庫存表Calibration :校驗(yàn)Calibration :校驗(yàn)Corrugated pad :波紋墊Outer box :外包裝箱Sum of square :平方和Conductive bag :保護(hù)袋Base unit :基體Probe :探針Golden card :樣本卡Frame :屏面72 .Wrist wrap :靜電手環(huán)Related department :相關(guān)部門plug hole 孔塞component damage or broken 零件

8、破損flux residue 松香未拭mixed parts 機(jī)種混裝oxidize 零件氧化IC reverse IC 反向Forman 組長90. B.P.非擦除狀態(tài)QP :Quality policy 質(zhì)量政策94. Trend:推移圖UCL: Upper control limit 管制上限CL: Center line 中心線PPM: Parts per million 不良率Resistor:電阻Resistor array :排阻106. DIODE:二極管Crystal:震蕩器Bead:電感 inductanceADM: Administration Departmen t 行

9、政單位CSD :Customer Service Department 客戶服務(wù)部116.IE: Industrial Engineering 工業(yè)工程ME: Mechanical Engineering 機(jī)構(gòu)工程S/N :serial number 序號(hào)Takeout tray:內(nèi)包裝盒Vericode :檢驗(yàn)碼Range :全距Preventive maintenance :預(yù)防性維護(hù)Fixture :制具Host probe :主探針Diagnostics program :診斷程序Lint-free gloves :靜電手套73. Target value :目標(biāo)值lifted sol

10、der 浮焊Wrong direction 極性反Unmelted solder 熔錫不良wrong label or upside down label 貼反poor solder mask 綠漆不良stand off height 浮高supervisor 課長WI=work instruction 作業(yè)指導(dǎo)91. Internal notification:內(nèi)部聯(lián)絡(luò)單QT: Quality target 品質(zhì)目標(biāo)95.Paret柏拉圖LCL:Lower control limit 管制下限R.T. Rolled throughout yield 直通率DPU: Defects per u

11、nit 單位不良率Capacitor:電容Capacitor array:排容107.SOT:三極管Fuse:保險(xiǎn)絲Connector:聯(lián)結(jié)器CE: Component Engineering 零件工程 115. ID: Industrial Design 工業(yè)設(shè)計(jì)IR: Industrial Relationship 工業(yè)關(guān)系MIS :Management Information System 信息部120. MM: Material Management 資材PCC: Project Coordination/Control 專案協(xié)調(diào)控制PD: Production Department

12、生產(chǎn)部123. PE: Product Engineering 產(chǎn)品工程124. PM: Product Manager 產(chǎn)品經(jīng)理 125. PMC: Production Material Control 生產(chǎn)物料管理126. PSC: Project Support & Control 產(chǎn)品協(xié)調(diào)127. Magnesium Alloy:鎂合金Metal Shearing:裁剪CEM:Contract Electronics Manufacturing 電子制造服務(wù)企業(yè)EMS: Electronics Manufacturing ServicesERP: Enterprise Resourc

13、e Planning 企業(yè)資源規(guī)劃SCM+CRM+ERP+EAI=Network direct TM links procurement, production, Logistics and sales采購，生產(chǎn)，后勤管理及市場(chǎng)營銷的融合 EAI: Enterprise application Integration 企業(yè)應(yīng)用系統(tǒng)整合 CRM: Customer Relationship Planning 客戶服務(wù)規(guī)劃 SCM : Supply chain management 供應(yīng)鏈管理132.Access Time:光盤搜尋時(shí)間企業(yè)對(duì)消費(fèi)者的電子商務(wù)企業(yè)間的電子商務(wù)135. Intrane

14、t:132.Access Time:光盤搜尋時(shí)間企業(yè)對(duì)消費(fèi)者的電子商務(wù)企業(yè)間的電子商務(wù)135. Intranet:企業(yè)內(nèi)部通訊網(wǎng)路B2CEC:Business to consumer electronic commerceB2BEC:Business to business electronic CommerceCCL:Copper Clad Laminate 銅箔基板ISP: Internet Service Provider 網(wǎng)絡(luò)服務(wù)提供者ICP: Internet Content Provider 網(wǎng)絡(luò)內(nèi)容提供者GSM: Global System for Mobile Communic

15、ation 泛歐數(shù)字式行動(dòng)電話系統(tǒng) GPS:全球衛(wèi)星定位系統(tǒng)139.Video Clip:影 像文件141.Domainname:網(wǎng)域名稱143.Notebook:筆記型計(jì)算機(jī)Home Page:網(wǎng)絡(luò)首頁 140. HTML:139.Video Clip:影 像文件141.Domainname:網(wǎng)域名稱143.Notebook:筆記型計(jì)算機(jī)VR: Virtual Reality 虛擬實(shí)境WAP: Wireless Application Protocol無 線應(yīng)用軟件協(xié)議LAN : Local area network 局域網(wǎng)絡(luò)WW World Wide Web世 域網(wǎng) WAN: Wide A

16、rea Network 廣域網(wǎng)絡(luò)3C: Computer, Communication, Consumer electronic 計(jì)算機(jī)，通訊，消費(fèi)性電子三大產(chǎn) 品的整合150.Processed material:流程性材料 152.Quality loop:質(zhì)量環(huán) 154.Corrective action:糾正措施 156.PDCAlan/Do/Check/Action 計(jì)劃 / 實(shí)施 / 檢查 / 處理158.Application program:應(yīng)用程序 160.Auxiliary storage/Second storage:;輔助存儲(chǔ)器 162Diskette drive:軟驅(qū)

17、 164.Foreground:前面150.Processed material:流程性材料 152.Quality loop:質(zhì)量環(huán) 154.Corrective action:糾正措施 156.PDCAlan/Do/Check/Action 計(jì)劃 / 實(shí)施 / 檢查 / 處理158.Application program:應(yīng)用程序 160.Auxiliary storage/Second storage:;輔助存儲(chǔ)器 162Diskette drive:軟驅(qū) 164.Foreground:前面166.Mermory board:內(nèi)存板167.Slot:插槽 168.Busata-bus/a

18、ddress-bus/Control bus:總線/數(shù)據(jù)總線/地址總線/控制總線 169.Plot ter:繪圖170.MPC:Multimedia personal computer 多媒體171.Oscillato r:振蕩器172.Automatic teller termina l:自動(dòng)終端（出納）機(jī)173.Joystick por t:控制端口174.VGA: Video Graphics Array 顯示卡175.Resolution:分辨率176.Register:寄存器177.ISA: Industry Standard Architecture 工業(yè)標(biāo)準(zhǔn)結(jié)構(gòu) 178.EISA

19、: Extended Industry Architecture 擴(kuò)展工業(yè)標(biāo)準(zhǔn)結(jié)構(gòu)179.Adapter:適配器Peripheral:外部設(shè)備181.Faxmodem:調(diào)制解調(diào)器NIC:Network interface card 網(wǎng)絡(luò)接口卡182. SCSI: Small computer system interfaceVESA: Video Electronic Standards AssociationSIMM: Single in-line memory module 單排座存儲(chǔ)器模塊（內(nèi)存條）185.Casing:外箱186.Aluminum:鋁質(zhì)187.Ceramic:陶瓷的18

20、8.Platter:圓盤片189.Actuator:調(diào)節(jié)器190.Spindle:軸心191.Actuation arm:存取臂192.Default code:缺省代碼193.Auxiliary port:輔助端口194.Carriage return :回車Linefeed:換行197.Video analog:視頻模擬ASCII: American Standard Code for Information Interchange 美國信息互換標(biāo)準(zhǔn)代碼TTL: Transistor- Transistor logic 晶體管-晶體管邏輯電路Three-prong plug:三芯電插頭20

21、0.Female connecto r:連接插座201.Floppy disk:軟盤202.Output level:輸出電平203.Vertical/Horizontal synchronization:場(chǎng)/行同步204.H(Horizontal)-Phase:行相位205.Compatible:兼容機(jī)206.Hardware Expansion Card:硬件擴(kuò)充卡207.Buffer:緩沖208.CRM:Customer relationship Management 客戶關(guān)系管理209.WIP: Work in process 半成品210.Waive 匚特別采用211.CXO系列一C

22、EO: Chief Executive Office首席執(zhí)政官；執(zhí)行總裁COO: Chief Operating OfficeCFO: Chief Finance OfficerCBO: Chief Business OfficerCTO: Chief Technology OfficerCIO: Chief Information OfficerCGO: Chief Government OfficerNASDAQ Automated Quotation systemNASDAQ:納斯達(dá)克證券市場(chǎng)NASDAQ Automated Quotation systemVC: Venture Cap

23、ital 風(fēng)險(xiǎn)投資PDA: Personal Date Assistant 個(gè)人數(shù)字助理PLA: Personal Information Assistant 個(gè)人信息助理PPAP: Advanced Product Quality Planning and Control Plan 生產(chǎn)性零組件核準(zhǔn)程序FMEA: Potential Failure Mode and Effects Analysis失效模式與效應(yīng)分析MSA: Measurement Systems Analysis 量測(cè)系統(tǒng)分析QAS: Quality System Assessment 質(zhì)量系統(tǒng)評(píng)鑒219. Cusum:累

24、計(jì)總合圖Overall Equipment Effectiveness 設(shè)備移動(dòng)率Analysis of motion/Ergonomics 動(dòng)作分析/人體工程學(xué)MCR: machine capability ratio Analysis of motion/Ergonomics 動(dòng)作分析/人體工程學(xué)MCR: machine capability ratio 機(jī)器利用率Taguchi methods 田口式方法Surveillance定期追蹤審查Roka Yoke 防錯(cuò)法Mistake Proofing 防呆法Vertical integration 垂直整合EMS: Electronics

25、Manufacturing Supply-chainCause & Effects charts 特性要因圖Scatter:散布圖Fool-Proof System 防呆系統(tǒng)VE: Value Engineering 價(jià)值工程QFD: Quality Function Development 質(zhì)量機(jī)能展開Arrow Chart 箭頭圖法Affiliate Chart 親和圖法PDPC: Process Decision Program Chart System Chart 系統(tǒng)圖法Relation Chart 關(guān)邊圖法Matrix Chart 矩陣圖法Matrix Data Analysis

26、矩陣數(shù)據(jù)分析法Brain-storm 腦風(fēng)暴法JIT: Just In Time:及時(shí)性生產(chǎn)模擬Deming Prize:戴明獎(jiǎng) Prototype 技術(shù)試作BPM: Business Process Management 業(yè)務(wù)流程管 MBO 目標(biāo)管理MBP :方針管理FTA:故障樹分析QSC服務(wù)質(zhì)量IPPB: Information 情況 planning 策劃 Programming 規(guī)劃 Budget 預(yù)算EQ: Emotion Quotient :情商IQ: Intelligence Quotient :智商Implied Needs :隱含要求Specified Requiremen

27、t :規(guī)定要求Probation:觀察期Incoming Product released for urgent production 緊急放彳亍Advanced quality planning先進(jìn)的質(zhì)量策劃AOQ: Average Outgoing Quality 平均檢出質(zhì)量AOQL: Average Outgoing Quality Limit 平均檢出質(zhì)量界限Approved Supplier List經(jīng)核準(zhǔn)認(rèn)可的供應(yīng)商名單Attribute date 特征Benchmarking 基準(zhǔn)點(diǎn)Calibration 校準(zhǔn)Capable process 工序能力Capability Ind

28、ex 序能力指數(shù)Capability ratio 工序能力率Cost of quality 質(zhì)量成本CHANG CYCLE TIME 修改的時(shí)間周期 Continuous improvement持續(xù)改進(jìn)Cost of quality 質(zhì)量成本Control plans 控制策劃Cycle time reduction 減少周期時(shí)間Design of experiments 實(shí)驗(yàn)設(shè)計(jì)Deviation / Substitution 偏差/置換ESD: Electrostatic discharge 靜電釋放EH&S: Environmental, Health, and Safely 環(huán)境，健康

29、.安全ESS: Environmental Stress Screening 環(huán)境應(yīng)力篩選FMEA: Failure Mode Effect Analysis 失誤模式效應(yīng)分析First Article approval 產(chǎn)品的首次論證First pass yield 一次性通過的成品率First sample inspection 第一次樣品檢驗(yàn)FMECA: Failure mode effect and critically analysis 失誤模式，效應(yīng)及后果分析Gauge control測(cè)量?jī)x器控制GR&R: Gauge repeatability and reproducibili

30、ty 測(cè)量?jī)x器重復(fù)性和再現(xiàn)性HALT: Highly Accelerated Life Test 高加速壽命試驗(yàn)HAST: Highly Accelerated Stress Test 高加速應(yīng)力試驗(yàn)IN-CONTROL PROCESS 受控制工序INDUSTRIAL AVERAGE 工業(yè)平均數(shù)266. Key characteristic 關(guān)健特征268. Life Testing 壽命試驗(yàn)JIT (just in time) manufacturing (實(shí)時(shí))266. Key characteristic 關(guān)健特征268. Life Testing 壽命試驗(yàn)267. Key compon

31、ent 關(guān)健構(gòu)件Lot traceability 批量可追溯性MCR: machine capability ratio 機(jī)械能力率272. OUT-OF-CONTROL PROCESS 失控工序274. PPM: Parts per million MCR: machine capability ratio 機(jī)械能力率272. OUT-OF-CONTROL PROCESS 失控工序274. PPM: Parts per million 百萬分之一Preventive maintenance 預(yù)防維護(hù)277. Process control 工序控制279. Process simplific

32、ation 過程簡(jiǎn)化NONCONFORMANCE 不符合273. Pilot Application 試產(chǎn)(試用)Preventive VS detection 預(yù)防與探測(cè)Process capability index 工序能力指278. Process improvement 工序改進(jìn)Quality Clinic Process Chart (QCPC)質(zhì)量診斷過程圖282. Quality manual 質(zhì)量手冊(cè)284. Quality planning 質(zhì)量策劃286. Quality system 282. Quality manual 質(zhì)量手冊(cè)284. Quality planni

33、ng 質(zhì)量策劃286. Quality system 質(zhì)量體系283. Quality plan 質(zhì)量計(jì)劃RUN Chart趨勢(shì)表289. Statistical quality control (SQC)RUN Chart趨勢(shì)表289. Statistical quality control (SQC)統(tǒng)計(jì)質(zhì)量控制291. Total quality management 全面質(zhì)量管理293. Variation 影響變量Reliability 可靠性Skill Matrix 技能表290. Teamwork團(tuán)隊(duì)工作292. Variable data 變量數(shù)據(jù)Value Analysis

34、值分析Survey Instructions 調(diào)查指引Improvement Plan 改進(jìn)計(jì)劃Value Analysis 值分析Survey Instructions 調(diào)查指引Improvement Plan 改進(jìn)計(jì)劃implementation 實(shí)施Supplier Audit Report 供方審核報(bào)告Typical agenda典型的議事日程Visual Factory 形象化工廠Profile 概況Evaluation 評(píng)估Compliance 符合Site Audit 現(xiàn)場(chǎng)審核Failure rate percentage 失誤百分率308. Customer complaint

35、s 客戶投訴310. Root cause analysis of failures 失誤根原分析307. Productivity (output / input)307. Productivity (output / input)生 產(chǎn)率(產(chǎn)出/投入)309. Customer satisfaction indices 客戶滿意度指數(shù)共同原因Condenser聚光鏡消費(fèi)者之風(fēng)險(xiǎn) Control控制Control plan管制計(jì)劃Cost down降低成本Creep漸變Accuracy準(zhǔn)確度 Active主動(dòng) Action評(píng)價(jià).處理Activity活動(dòng) Add力口Addition rule

36、加法運(yùn)算規(guī)則 Analysis Covariance 協(xié)方差分析 Analysis of Variance 方差分析 Appraisal Variation評(píng)價(jià)變差A(yù)pproved承認(rèn) ASQC美國質(zhì)量學(xué)會(huì) Attribute計(jì)數(shù)值A(chǔ)udit審核 Automatic database recovery數(shù)據(jù)庫錯(cuò)誤自動(dòng)回復(fù)Average平均數(shù)balance平衡 Balance sheet資產(chǎn)負(fù)債對(duì)照表 Binomial二項(xiàng)分配 Body機(jī)構(gòu) Brainstorming Techniques 腦力風(fēng)暴法Business Systems Planning 企業(yè)系統(tǒng)規(guī)劃Cable 電纜 Capabili

37、ty 能力 Cause and Effect matrix 因果圖.魚骨圖Center line 中心線 check 檢查 Check Sheets 檢查表 Chi-square Distribution 卡方分布 Clutch spring 離合器彈簧 Coining 壓印加工Common causeComplaint 投訴 Compound factor 調(diào)合因素 Concept 新概念 Conformity 合格 Connection 關(guān)聯(lián)Consumer s riskControl characteristic 管制特性 Control chart 管制圖 Correction 糾正

38、Correlation Methods 相關(guān)分析法 CPI: continuouse Process Improvement 連續(xù)工序改善 Cross Tabulation Tables 交*表 Cushion 緩沖DSA: Defects Analysis System 缺陷分析系統(tǒng)Data Collection 數(shù)據(jù)收集DCC: Document Control Center 文控中心Defects per unit單位缺點(diǎn)數(shù) Detection難檢度 Digital 數(shù)字DOE: Design of Experiments 實(shí)驗(yàn)設(shè)計(jì)Else否則Entropy 函數(shù) Equipment 設(shè)

39、備 E Equipment Variation 設(shè)備變異 External Failure外部失效，外部缺陷 Fact control事實(shí)管理CS: customer Sevice 客戶中心Customer 顧客DataCS: customer Sevice 客戶中心Customer 顧客Data數(shù)據(jù)Data concentrator資料集中緩存器Decision決策.判定Description 描述Device裝置Do執(zhí)行Element 元素Engineering recbnology 工程技術(shù)Environmental 環(huán)境Estimated accumulative frequency

40、計(jì)算估計(jì)累計(jì)數(shù)Event事件FA: Failure Analysis 壞品分析Fatique 疲勞FQA: Final Quality Assurance 最終品質(zhì)保證 FQC: Final Quality control 最終品質(zhì)控制 Full-steer完全轉(zhuǎn)向function職能Gauge system量測(cè)系統(tǒng)Grade等級(jí)Heat press沖壓粘著hypergeometric超幾何分配Grade等級(jí)Heat press沖壓粘著hypergeometric超幾何分配Inductance 電感Inspection 檢驗(yàn)Gum-roll橡皮滾筒Histogram直方圖hysteresis磁

41、滯現(xiàn)象Information 信息Health meter 體重計(jì)Hi-tech高科技 Improvement 改善Initial review 先期審查Internal Failure內(nèi)部失效，內(nèi)部缺陷IQC: Incomming Quality Control 來料品質(zhì)控制IS International Organization for Standardization 國際標(biāo)準(zhǔn)組織Law of large number 大數(shù)法貝Link 連接LCL: Lower Control limit 管制下限LQC: Line Quality Control 生產(chǎn)線品質(zhì)控制LSL: Lower S

42、ize Limit 規(guī)格下限Machine 機(jī)械 Manage 管理 Materials 物料 Miss feed 漏送 Module,sub-system,sub-unit 單位Monte garlo method原子核分裂熱運(yùn)動(dòng)法MSA: Measurement System Analysis 量測(cè)系統(tǒng)分析NIST美國:標(biāo)準(zhǔn)技術(shù)院Normal常態(tài)分布Measurement 量測(cè) Median 中位數(shù)Momentum 原動(dòng)力Multiplication rule乘法運(yùn)算規(guī)則Measurement 量測(cè) Median 中位數(shù)Momentum 原動(dòng)力Multiplication rule乘法運(yùn)算

43、規(guī)則Occurrence 發(fā)生率On.off system 開,關(guān)系統(tǒng)Parameter參數(shù)Parto柏拉圖Passive消極的，被動(dòng)的 Plan計(jì)劃Population群體 Power力量，能源Practice 實(shí)務(wù)Precision 精密度Pressure 壓縮Prevention 預(yù)防Probability density function 機(jī)率密度函數(shù)Parts 零件Parts per million 不良率Pulse脈沖 Policy方針PQA: Process Quality Assurance 制程品質(zhì)保證preemptive 先 占式多任務(wù)Probability 機(jī)率Proce

44、dure 流程Process 過程Process capability analysis 制程能力分析圖Process control and process capability 制程管制與制程能力Producer s risk 生產(chǎn)者之風(fēng)險(xiǎn) Product 產(chǎn)品Production 生產(chǎn)Program 方案Projects 項(xiàng)目QA: Quality Assurance 品質(zhì)保證QC: Quality Control 品質(zhì)控制QE: Quality Engineering 品質(zhì)工程QFD: Quality Function Desgin 品質(zhì)機(jī)能展開Quality 質(zhì)量Quality ma

45、nual 品質(zhì)手冊(cè)Quality policy 品質(zhì)政策Random experiment 隨機(jī)試驗(yàn)Random numbers 隨機(jī)數(shù)Range全距 Record記錄 Reflow回流Reject拒收 Repair返修Repeatusility 再現(xiàn)性Reproducibility 再生性Requirement 要求Residual 誤差Response 響應(yīng)Responsibilities 職責(zé)Review 評(píng)審Reword 返工Robustness 穩(wěn)健性 Rolled yield 直通率RPN: Risk Priority Number 風(fēng)險(xiǎn)系數(shù)sample 抽樣，樣本Sample s

46、pace 樣本空間Sampling with replacement 放回抽樣Sampling without peplacement 不放回抽樣Scatter diagram 散布圖分析Scrap報(bào)廢 Screw螺旋Severity嚴(yán)重度 Shot-peening微粒沖擊平面法Simple random sampling簡(jiǎn)單隨機(jī)取樣 Size規(guī)格SL: Size Line規(guī)格中心線Slip 滑動(dòng)Stratified random sampling 分層隨機(jī)抽樣SOP: Standard Operation Procedure 標(biāo)準(zhǔn)作業(yè)書 SPC: Statistical Process Co

47、ntrol 統(tǒng)計(jì)制程管制Special cause 特殊原因Specification 規(guī)范SQA: Source(Supplier) Quality Assurance 供貨商品質(zhì)保證Stage sampling 分段隨機(jī)抽樣Standard Deviation 標(biāo)準(zhǔn)差Sum of squares 統(tǒng)計(jì)表supplier 平方和System 供方systematic sampling 系統(tǒng)，體系Statistical tables 系統(tǒng)抽樣Taguchi-method 田 口方法Technical committees 技術(shù)委員會(huì)Test piece 測(cè)試片Theory 原理 Time st

48、amp 時(shí)間戳印 Time-lag 延遲 Title 題 Torque 轉(zhuǎn)矩 Total 求和 TQC: Total Quality Control 全面品質(zhì)控制TQM: Total Quality Management 全面品質(zhì)管理Traceablity 追溯Training 培訓(xùn)Transaction processing and logging 交易處理 Trouble 困擾Up and down 上和下 UCL: Upper Control Limit 管制上限USL: Upper Size Limit 規(guī)格上限Validation 確認(rèn)Variable 計(jì)量值 Variance 變異

49、和Vector 向量Verification 驗(yàn)證 Version 版本 VOC: voice of Customer 客戶需求VOE: Voice of Engineer 工程需轉(zhuǎn)帖電子行業(yè)相關(guān)的英語詞匯2 Band gap voltage reference 帶隙電壓參考4 Block Diagram 2 Band gap voltage reference 帶隙電壓參考4 Block Diagram 方塊圖6 Bootstrap 自舉8 bucket capcitor 桶形電容10 Combi-sense Combi-sense12 Core Sataration 鐵芯飽和14 curr

50、ent ripple 紋波電流16 cycle skipping 周期跳步18 DIE Temperature 核心溫度20 dominant pole 主極點(diǎn)22 ESD Rating ESD 額定值3 benchtop supply工作臺(tái)電源5 Bode Plot波特圖7 Bottom FET Bottom FET9 chassis 機(jī)架constant current source 恒流源13 crossover frequency 交叉頻率15 Cycle by Cycle 逐周期17 Dead Time死區(qū)時(shí)間19 Disable非使能，無效，禁用，關(guān)斷21 Enable使能，有效，

51、啟用Evaluation Board 評(píng)估板Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied,超過下面的規(guī)格使用可能引起永久的設(shè)備損害或設(shè)備故障。建議不要工作在 電特性表規(guī)定的參數(shù)范圍以外。26 figure of merit 品質(zhì)因數(shù)

52、28 flyback power stage 反馳式功率級(jí)30 free-running 26 figure of merit 品質(zhì)因數(shù)28 flyback power stage 反馳式功率級(jí)30 free-running 自由運(yùn)彳亍32 Full load 滿負(fù)載34 gate drive stage 柵極驅(qū)動(dòng)級(jí)36 ground plane 接地層38 Human Body Model 人體模式40 inrush current 涌入電流42 jittery 抖動(dòng)44 Kelvin connection 開爾文連接46 Lead Free 無鉛48 Line regulation 電源調(diào)

53、整率50 Lot Number 批號(hào)52 Miller 密勒27 float charge voltage 浮充電壓29 forward voltage drop 前向壓降31 Freewheel diode 續(xù)流二極管33 gate drive柵極驅(qū)動(dòng)35 gerber plot Gerber 圖37 Henry電感單位：亨利39 Hysteresis 滯回41 Inverting 反相43 Junction 結(jié)點(diǎn)45 Lead Frame引腳框架47 level-shift 電平移動(dòng)49 load regulation 負(fù)載調(diào)整率51 Low Dropout 低壓差53 node節(jié)點(diǎn)54

54、Non-Inverting 非反相55 novel新穎的56 off state關(guān)斷狀態(tài)57 Operating supply voltage 電源工作電壓58 out drive stage 輸出驅(qū)動(dòng)級(jí)59 Out of Phase 異相60 Part Number產(chǎn)品型號(hào)61 pass transistor pass transistor62 P-channel MOSFET P 溝道 MOSFET63 Phase margin 相位裕度64 Phase Node開關(guān)節(jié)點(diǎn)65 portable electronics 便攜式電子設(shè)備66 power down 掉電67 Power Good

55、電源正常68 Power Groud 功率地69 Power Save Mode 節(jié)電模式70 Power up 上電71 pull down 下拉72 pull up 上拉73 Pulse by Pulse 逐脈沖(Pulse by Pulse)74 push pull converter 推挽轉(zhuǎn)換器75 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二極管78 resistive divider 電阻分壓器79 ringing 振鈴80 ripple current 紋波電流81 rising edge 上升沿82 sense resistor

56、 檢測(cè)電阻83 Sequenced Power Supplys 序列電源84 shoot-through 直通，同時(shí)導(dǎo)通85 stray inductances.雜散電感86 sub-circuit 子電路87 substrate 基板88 Telecom 電信89 Thermal Information 熱性能信息90 thermal slug 散熱片91 Threshold 閾值92 timing resistor 振蕩電阻93 Top FET Top FET94 Trace線路，走線，引線95 Transfer function 傳遞函數(shù)96 Trip Point 跳變點(diǎn)97 turns

57、 ratio匝數(shù)比，=Np / Ns。（初級(jí)匝數(shù)/次級(jí)匝數(shù)）98 Under Voltage Lock Out (UVLO)欠壓鎖定 99 Voltage Reference 電壓參考100 voltage-second product 伏秒積101 zero-pole frequency compensation 零極點(diǎn)頻率補(bǔ)償102 beat frequency 拍頻103 one shots單擊電路104 scaling 縮放105 ESR等效串聯(lián)電阻106 Ground地電位107 trimmed bandgap 平衡帶隙108 dropout voltage 壓差109 large

58、bulk capacitance 大容量電容110 circuit breaker 斷路器111 charge pump 電荷泵112 overshoot 過沖1)元件設(shè)備三繞組變壓器：three-column transformer ThrClnTrans并聯(lián)電容器：shunt capacitor 輸電線： TransmissionLine電抗器：Reactor并聯(lián)電容器：shunt capacitor 輸電線： TransmissionLine電抗器：Reactor發(fā)電廠：power plant母線：Busbar斷路器：Breaker刀閘（隔離開關(guān)）：Isolator分接頭：tap電動(dòng)機(jī)：

59、motor（2）狀態(tài)參數(shù)有功：active power無功：reactive power電流：current容量：capacity電壓：voltage檔位：tap position有功損耗：reactive loss 功率：power無功損耗：active loss功率因數(shù)：power-factorresistor susceptanceYC(telemetering)statorlower limitlow voltage雙回同桿并架 resistor susceptanceYC(telemetering)statorlower limitlow voltage雙回同桿并架 double-c

60、ircuit lines on the same tower 補(bǔ)償度 degree of compensation 無功補(bǔ)償 reactive power compensation 調(diào)節(jié) regulation 三相故障 three phase fault 極限切除時(shí)間 critical clearing time 高頂值 high limited value 線路補(bǔ)償器 LDC(line drop compensation) 靜態(tài) static (state)單機(jī)無窮大系統(tǒng) one machine - infinity bus system 電抗 reactance電阻 resistance有