HDI制程及設計介紹

華通電腦（惠州）Jan,2002HDI制程及設計介紹線路板市場需求及技術(shù)發(fā)展過程

HDIPCB的應用HDI:HighDensityInterconnectionHDIPCB用在商品上較大宗的有3大類﹕資訊類﹕超大型電腦、筆記型電腦、ICSubstructure（FCPGA-FleeChipPinGridArea）等通訊類﹕手機、通訊網(wǎng)絡系統(tǒng)、網(wǎng)際網(wǎng)絡等消費產(chǎn)品﹕數(shù)碼相機HDI及一般PCB用的主要物料介紹LaminatePrepregRCCCopperFoilLaminate:銅箔基板,由中間的FR4等材質(zhì)加兩面銅箔組成,主要用來製作內(nèi)層線路,銅箔厚度主要有0.5oz,1oz等(基材一般還有分一般FR4材質(zhì),HighTg材質(zhì),特殊用途材質(zhì))Prepreg(P/P):玻璃纖維布+環(huán)氧樹脂膠片(未聚合),主要作為PCB內(nèi)層間壓合用的絕緣層,有多種厚度規(guī)格RCC:ResinCoatedCopper,覆樹脂銅箔,一般銅箔厚度為0.5oz,主要用於HDI產(chǎn)品增層用CopperFoil:銅箔,作為一般多層板壓合時外層銅層,主要有0.5ozS/M:SolderMask,或稱SolderResist,主要分為一般/霧面(Matt)兩種,如TaiyoPSR4000(一般)和CibaPR77(霧面)一般PCB製作流程簡介1.內(nèi)層板製作:影像轉(zhuǎn)移,蝕刻出線路(線寬間距)2.將多個內(nèi)層板壓合成多層板,以鑽孔,電鍍來連通各層線路(板厚,層數(shù),最小孔孔徑)3.外層製作:影像轉(zhuǎn)移,電鍍,蝕刻做出外層Pattern,覆蓋S/M4.成品處理:對焊墊進行表面處理,切出成品PCB,進行檢驗及Open/Short的電性測試,包裝出貨內(nèi)層線路﹕裁板前處理壓干膜曝光顯影蝕銅去膜AOI檢驗PCB制造流程(1)壓板﹕氧化鉚釘疊板壓合打靶切型磨邊鑽孔﹕上PIN機械鑽孔雷射鑽孔﹕雷射鑽孔電鍍﹕DesmearPTH（化學銅）電鍍銅（孔銅、面銅）外層線路（1）﹕前處理

壓干膜曝光顯影外層線路（2）﹕電鍍銅（Pattern）電鍍錫去膜蝕銅剝錫AOI檢驗PCB制造流程（2）綠漆（S/M)﹕前處理CC2曝光顯影後烘烤噴錫(HASL)﹕前處理垂直噴錫後續(xù)處理（X-Ray錫厚量測）印字（S/S)﹕全自動網(wǎng)板印字UV烘烤塞孔﹕手動網(wǎng)板印刷塞孔

烘烤成形﹕切外形V-cut等清洗測孔機測孔PCB制造流程（3）目視檢驗﹕100%目視檢驗OQC抽檢O/S測試﹕100%短斷路電性板翹量測﹕100%板翹檢驗（大理石平臺）包裝﹕小包裝外包裝MicroViaDesignRule(HLC+HDI)--BlindviaDesignruleandcapability---BuriedviaDesignruleandcapabilityMINIPRINTERNOTEBOOKPCMCIACARDPORTABLETERM.PORTFAXPORTPHONEMOBILPHONECAMCORDERCOMPACTVCRPORTABLECDCOMPUTERCOMMUNICATIONCONSUMPTIONTECHNOLOGYDEMANDThinnerLayerMoreLayerHigherDensityHDIPROCESSThinDielectricCoatingFlex-RegidCombitionBuried&BlindViaTechnologyViaOnPadTechnologyELECTRONICPRODUCTDEMANDFUNCTIONSMoreFunctionBetterQualityComplexUnionAPPEARANCESmallerLighterThiner

WhyweneedHDIprocess

BAC.DimensiononMicrovia(L1L2)ItemDescriptionPreferredDimensionCapabilityDimensionAMicroViaDiameter4~104~10BCapturePadA+10A+8(Cpk:1.00)CTargetPadA+12A+10.5(Cpk:1.00)Unit：milBADCUnit：um(mil)*Remark:TomeetminimumSpace4milforminnerlayercoopertoviaholewallDimensiononMicrovia(L1L3)ItemDescriptionPreferredDimensionCapabilityDimensionAMicroViaDia4~104~10BCapturePadA+10A+8(Cpk:1.00)CL2ClearanceA+18*A+16(Cpk:1.00)DTargetPadA+12A+10.5(Cpk:1.00)DBFECOuterlayer(1+N+1)N

ItemPreferredDimensionBBuriedPTHInnerLayer(N)landDiameterA+10CBuriedPTHOuterLayer(N)landDiameterA+8DPTHOuterLayer(1+N+1)landDiameterA+8EPTHOuterLayer(N)landDiameterA+10FPTHInnerLayer(N)landDiameterA+12“A”=Drilldiameter;*unit:milDimensiononBuriedviaandPTHStack-up(1+N+1)ADUnit：(mil)LaserDrill&AspectRatio

TheMaximumaspectratio(D/A)ofMicroViais0.8ThePreferredaspectratio(D/A)ofMicroViais0.6

A=4A=5A=6A=7A=8D(Max.)3.244.85.66.4D(Pre.)2.433.64.24.8BenefitofHDIProcessTracecapabilityof6LwhichapplyHDImaybeequivalenttotraditional10LPTHboard.Reducelayercount-CostdownSolutionofdensepadrequirementSolutionofdensetracerequirement

RegistrationToolingSystemandReliabilityTest

：AlignmentPad：Toolinghole1.Wedesignfouralignmentpadsinallinnerlayerscorner.Afterlaminationprocess,weuseMuraki888(Toolingholemaker)tofigureoutthealignmentpad(allofinnerlayeralignmentmakeup)centerlocationdata.2.Muraki888willputitintocalculate(orcompensate)thenidentifytheoptimatoolingholecenter,thenpunchthetoolingholeforfollow-upprocess.3.UsingX-raymeasureboarddimensionchangeandfeedbacktoAWcompensationfactorsystemPanelSizeToolingholeproducedMuraki880Muraki888(Twodirectioncompensate)(Fourdirectioncompensate)LayertoLayerRegistration1.Wewilldesignfourballpadsineachinnerlayercorner(showlikeabovefigure).2.Afterlaminationprocess,wewilluseMuraki888(Toolingholemaker)tomeasurethecornerballpadsdistanceineachlayers,andcomparetooriginaldesignpadtopaddistanceindifferentlayers.3.Wewillgetthemovementbetweenrealpanelsizeanddesignpanelsize,andwecancompensatetheartworkdimensionsbaseonthedatatogetthetruepanelsize.Designrule:Diameterofpadsize50mil,thepitchbetweenL2~L3is100mil,L3~L4100mil……Distancetolengthside275mil;distancetowidth400milContouringLinePanelSize疊板設計盲埋孔層:依雷射單面向板中心層打孔之特性,孔口是朝外,而孔底則為朝內(nèi).故所謂之盲埋孔層即為孔口所在之層.HDI產(chǎn)品製作流程示意圖發(fā)料Issuematerial內(nèi)層線路Innerlayer黑化Blackoxide壓板MLBLam.鑽孔Drilling除膠渣Desmear化學銅（PTH)

ElectriclessCu埋孔塞孔BuriedViaPlugs全板電鍍PNLplate線路電鍍Pat.plate線路蝕刻Etching外層檢驗OuterLayerAOI暫存?zhèn)}TemporaryStockHDI內(nèi)層板制作流程外層干膜Dryfilm黑化BlackoxideRCC壓板

RCCLam.鑽孔Drilling雷射鑽孔LaserDrill水平黑影HorizontalShadow線路蝕刻Etching綠漆Soldermask浸金ImmersionGold成型Routing檢查測試OQC/FIT/O/S包裝PackHDI增層板制作流程暫存?zhèn)}TemporaryStockConformalMaskDefine水平去膠渣HorizontalDesmear外層干膜Dryfilm盲