設(shè)備規(guī)格-cob基礎(chǔ)知識介紹

COBCOB基礎(chǔ)知識4目4什么是2233什么是 COB(ChipOnboard)板 ,無塵室中不論外在空氣條件如何變化，其室內(nèi)均能 控制的因素包括溫度、濕度、氣壓、灰塵等級、防ISOISOISOISOISONumberofParticlesperCubicMeterbyNumberofParticlesperCubicMeterbyMicrometerSize的大小和數(shù)量對 ISO0.10.220.30.515ISO4ISO8ISOISO

DA附

WireBond烤

DADie 材料：基板 、膠DABondingDABondingB/Alowertopicklevelandposition

EjectorrisesupandB/AliftupthediebyvacuumB/AtobondlevelpositionforBondHead (WaferBHZArmArmbondHeadHeadbondtimewithholdBond

HeadpickHeadpicktimewithhold

BHZArmArmpickEjectorupWafersurfaceEjectorpinBHYPatternPatternRecognitionSystem Multi‐greylevelPRS*Camera 512512*GreyScaleAngularAccuracy

256grey±1/4pixelEjectorEjectorEjectorUpwardMovement 0"~0.2"(0~5mm)linear DispensingDispensingXY 2"(50.8mm)inX;3"(76.2mm)in 0.02mil(0.5um)inX, mil/count(3.81um/count)inPick/BondPick/Bond XY 4mminX;142mmin

Workholder Highspeedlinearmotor bleX,Y&ZLeadframeOrientation BondAccuracy

IndexSensor LeadframeVacuum XYtable

Max300mm330mmx330mmEjector DispensingXY 2"(50.8mm)inX;3"(76.2mm)in 0.02mil(0.5um)inX, Multi‐greylevelPRSCamera 512*512Grey

256grey±1/4 DieAngle XYTravel 50mminX;142mminYBondAccuracy atic+

WorkholderPick/BondTransportMethod HighspeedlinearmotorPick/Bond bleX,Y&ZLeadframeOrientationCheck IndexSensor DieDie

Die什么是wire 壓力

振蕩WIREBONDING固態(tài)焊接)的四大基本要素壓力。 振動功率。(BOND。(BOND焊接溫度。

溫 溫BondBond BondPower: FABWireBondingElectronicElectronicflameTouchBallWireBond Clamp Wedge LoopBondBond BQMMode ConstantCurrent,Voltage,PowerandNormal(Progr Loop Normal,LowSquare,Penta,J,XY TrueBond cementAccuracyFinePitchCapability

54mm±3.5um@3sigma35umpitch@0.6milwireNo.ofBonding uptoProgram 1000programsonHardPatternRecognition

MaterialHandling 200~250ms@0.5"Index PatternRecognitionAccuracyLeadLocatorDetectionLeadLocatorAccuracyPostBondInspection

FirstBond,SecondBond&Wire

LeadFramePosition

W=24~73mm@bondingareainY=65mmW=24~90mm@bondingareainY=48mm um]T=0.075~0.8mm um) MaxDieLevel Magazine BondAuwire CopperWire Wire MaxPatternRecognitionTime

Bond 50msBond 2.0um@3Bond 56mmxLoopXY Z No.ofbond UptoProgram 30000programsonhard MaterialHandling 200~250ms@0.5"Index LeadLocatorDetectionLeadLocatorAccuracyPostBondInspection

FirstBond,SecondBond&Wire

LeadFramePosition

um]Max.DieLevel

Magazine BSOB/BBOS/PumpBondBondStitchOnBondBallOnBondBallOnPumpPump –Affectloo ,wirefeeding –Affectballsize,shape –Affectballbond –Affectwedgebond,strengthand –Affectwedgebondstrengthandheel –Affectballheight,ballsize,shearWirePullHA貼附：HolderAttachSpeedSpeed(dependsonepoxyCycle 2.25seconds(lensholdersize 1.6k(lensholdersize 1)Lead 2)Organic 3)Tape4)CarrierboatforsingulatedunitsorFlexDispensing

Bonding

TimeLensholder 5*5mm^toLensholder 2mmtoBond VacuumorGripper

Syringesizecementaccuracy(8mm*8mmcementaccuracy(8mm*8mmholderVision

ThermalorUVcuredx=50.8mm,y=76.2mm10cc,30ccContacttype

Camera 512*512Bond x=6mm,

GreyScaleAngularAccuracy

256grey±1/4pixelSpeed(dependsonepoxyCycle

1.5seconds(lensholdersize2.4k(lensholdersize 1)Lead 2)Organic 4)CarrierboatforsingulatedunitsorFlex BondingBondingLensholder 5*5mm^toLensholder 2mmtoBond VacuumorGrippercementaccuracy(8mm*8mmholdercementaccuracy(8mm*8mmholder

Timepressureorscrew ThermalorUV x=290mm, 10cc,Height ContacttypeVision*Camera 512512*Bond

x=6mm,y=70mm

GreyScale

256grey±1/4

Speed(dependsonepoxyCycletime 1.4seconds(lensholdersize8mm*8mm) 3k(lensholdersize8mm*8mm)SubstrateHandling 1)Lead 2)Organic 3)Tape4)CarrierboatforsingulatedunitsorFlex 2*2mm^toLensholder 2mmtoBond XYZ HighPerformancelinear XY/0.1umTheta

BondingBondingDispensing ThermalorUV x=300mm, 10cc,Height Contacttypecementaccuracy(8mm*8mmcementaccuracy(8mm*8mmholder

x=6mm,y=100mm

Grey

256grey±1/8

Angular

COB設(shè)備介紹-HABondingPickheadpickshousingandmovestoafixed

Pickhead housingontothefixedstageandmovesbacktotray PickandBondusingUp-lookingPRBond-head 3)Bondheadhousingontosubstrate.Pickheadcesanother

housingfromthefixedstageandmovestoup-looking.Pickheadpicksanotherhousing. COB設(shè)備介紹-HABondingPickheadpickshousingandmovestoafixedstage

Pickhead housingontoafixedstage.PRstartsafterthepick