面板制程CF process 簡(jiǎn)介

CFProcess簡(jiǎn)介JerryTFT/LCD材料工程部LCD&CF結(jié)構(gòu)簡(jiǎn)介CF光阻材料簡(jiǎn)介CF製程及檢驗(yàn)手法簡(jiǎn)介

MacroInspection鑒定措施MicroInspection鑒定措施CFProductIDnamingrule課程大綱LCD面板結(jié)構(gòu)圖下玻璃基板上玻璃基板上偏光板PS液晶分子下偏光板框膠配向膜TFT元件彩色濾光板液晶層光線(背光源)LCD:LiquidCrystalDisplay(液晶顯示器)CF結(jié)構(gòu)圖ITO剖面示意圖俯視示意圖實(shí)際圖例素玻璃BMRLayerGBMVAPSCF:ColorFilter(彩色濾光片)光阻材料分類與成份正型光阻:BM(Cr),MVA負(fù)型光阻:ColorResist(R,G,B),PS,RBM彩色光阻溶劑固成份PastePolymerMonomerPhoto-initiatorAdditivePigmentDispersantSolventMonomerInitiator光阻材料成份v.s光阻特征CF製造流程1.廣視角產(chǎn)品(MVA產(chǎn)品):2.非廣視角產(chǎn)品(TN產(chǎn)品):BMRGBITOPSBMRGBITOMVAPS*BM依材質(zhì)類型有Resin及CrBM二種CF製作措施CF製程機(jī)制:PhotolithographyPhotosensitiveMaterialsSubstrateNegativeTypePositiveTypeMMBinderUVPigmentPhoto-initiatorSolubleInsolubleCoatingExposureDevelopmentImagesUV

Photolithography:顯影液:KOHCFProcess優(yōu)點(diǎn):

1.Process減少(設(shè)備簡(jiǎn)化)2.光阻用量減少(1)Spin---轉(zhuǎn)速(rpm)決定膜厚(2)Spinless---

吐出量(PR值)決定膜厚CoaterSpinVCDEBRHP/CPExposureDevelopmentAOIOvenCassetteCoaterVCDHP/CPExposureDevelopmentAOIOvenCassetteCoater:優(yōu)點(diǎn):

塗佈均勻性較好缺點(diǎn)：1.多一道製程

2.光阻用量多(浪費(fèi)光阻,增長(zhǎng)成本)BMProcess(1300)

BM:遮蔽漏光區(qū),增長(zhǎng)對(duì)比RGB:提供色度ITO:提供電場(chǎng)所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGapBMProcess鉻玻璃清洗正光阻塗佈(1)正光阻塗佈(2)Pre-cleanerSlitcoaterSpincoater2.BMphotolineUnpacker&Initialcleaner鉻膜濺鍍素玻璃投入1.Crsputtering鉻玻璃CrsputterCrglassCrOx,CrNy,Cr一.CrBMprocess:XX:

Spinless無BMProcess蝕刻去光阻紫外線曝光顯影烘烤(Oven)去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloperHotplate3.EtchinglineEtchingStrippingBMpatternglass真空乾燥VacuumDryerPre-bake&CoolplateXX:

Spinless無預(yù)烘烤(HP)與冷卻(CP)BMProcess二.RBMprocess:素玻璃清洗負(fù)光阻塗佈(1)負(fù)光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterXX:

Spinless無紫外線曝光顯影烘烤(Oven)去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloperHotplate真空乾燥VacuumDryerPre-bake&CoolplateX預(yù)烘烤(HP)與冷卻(CP)環(huán)保意識(shí)降低設(shè)備及建廠成本(省掉sputtering及Etching旳設(shè)備)簡(jiǎn)化製程流程製程一致性(BM,RGB,PS均使用負(fù)光阻)RBM旳優(yōu)點(diǎn)Blackmatrix旳功用遮蔽TFT防止pixel以外區(qū)域漏光增進(jìn)色彩對(duì)比性降低面板旳反射光Blackmatrix旳需求☆低反射率:減低外來光線旳干擾☆高OD值:阻隔pixel間旳背光(增高對(duì)比)☆膜厚薄(防止角斷差發(fā)生)☆低pinhole數(shù):防止漏光,產(chǎn)生亮點(diǎn)☆低particle數(shù):增長(zhǎng)良率BMInspection1231.TotalPitch(長(zhǎng)寸法)

2.CD(CriticalDimension)

3.MarktoEdge(端寸法)SubstrateR1.OD=-log(I/Io)>42.反射率(CrBM)3.Thickness(ResinBM)顯影後缺陷檢查ADI(AfterDeveloperInspection)巨觀檢查(Macroreview)IoIILSP01:ODStart區(qū)&平坦區(qū)各1點(diǎn),片片檢防止Start區(qū)&平坦區(qū)旳OD值差異太大.MUIN01:Macro確認(rèn)In-lineMacro品質(zhì)狀況(有無mura)PRIN01:AOI,CD確認(rèn)In-lineMicro品質(zhì)狀況防止CD太低,造成LCD漏光RBMLayerIn-lineSamplingRBMLayeroff-lineSamplingSPME01:OD防止OD太低,造成LCD漏光MACR51:Macro確認(rèn)BMoff-lineMacro品質(zhì)狀況CDME01:CD,端寸,Totalpitch防止CD太低,造成LCD漏光防止T/P太大or太小,造成LCD對(duì)組後漏光SUFT01:BMThickness控制角段差及ODRGBProcess(2300,3300,4300)BM:遮蔽漏光區(qū),增長(zhǎng)對(duì)比

RGB:提供色度ITO:提供電場(chǎng)所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGapRGBProcess---R-Layer紅色光阻塗佈(1)紅色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterBMpatternglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryer預(yù)烘烤(HP)與冷卻(CP)Pre-bake&CoolplateXXX:

Spinless無RGBProcess---G-Layer綠色光阻塗佈(1)綠色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterRglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預(yù)烘烤(HP)與冷卻(CP)X:

Spinless無RGBProcess---B-Layer藍(lán)色光阻塗佈(1)藍(lán)色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterR,Gglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預(yù)烘烤(HP)與冷卻(CP)X:

Spinless無121.PixelCD

2.Overlay

3.厚度(RGB段差)4.RGB色度量測(cè)3RGBInspectionITOProcess(5200)BM:遮蔽漏光區(qū),增長(zhǎng)對(duì)比RGB:提供色度

ITO:提供電場(chǎng)所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGapWhatisITO?ITO=IndiumTinOxide(銦錫氧化物)90wt.%In2O3+10wt.%SnO2

Sputtering(濺鍍)旳原理於真空環(huán)境下,通入高電壓及Ar/O2混合氣體,產(chǎn)生Ar+離子撞擊ITO靶材,形成銦錫離子與O離子反應(yīng)成銦錫氧化物(ITO),濺鍍於產(chǎn)品上.VacuumChamberSubstrateTargetPlasmaAr+e-GasInletVacuumPumps-2kVITOsputteringprocess氧化銦錫膜濺鍍ITOsputterITOpre-cleaner(水洗,清洗無機(jī)物)R,G,B玻璃投入ITO玻璃ITOglassDefectInspection(缺陷檢查機(jī))(Micro1,4560)UVasher(清洗有機(jī)物)紫外線灰化Repair(修補(bǔ))(repair1,4578)ITOInspection1.RGB色度量測(cè)

2.Rs(電阻值)量測(cè)3.光穿透率量測(cè)4.ITO膜厚量測(cè)5.T/P量測(cè)ITOMVAProcess(6300)BM:遮蔽漏光區(qū),增長(zhǎng)對(duì)比RGB:提供色度ITO:提供電場(chǎng)所需之電極

MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGap何謂廣視角?TNtypeSuperMVAMVAProcess

(Multi-domainVerticalAlignment)X:

Spinless無正光阻塗佈(1)正光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterITOglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預(yù)烘烤(HP)與冷卻(CP)MVAInspection1.厚度量測(cè)

2.PixelCD量測(cè)3.Overlay4.Macro膜厚PSProcess(7300)BM:遮蔽漏光區(qū),增長(zhǎng)對(duì)比RGB:提供色度ITO:提供電場(chǎng)所需之電極MVA/DJITO:提供廣視角

PS:支撐TFT/CF所需之CellGap(間距)PSCFTFTPSProcessPS光阻塗佈(1)PS光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&Coolplate預(yù)烘烤與冷卻XXX:

Spinless無PSInspection1.厚度量測(cè)

2.PixelCD量測(cè)3.Overlay4.Macro膜厚最終檢查(FinalInspection)Macroinspection巨觀檢查AOIPre-cleaner光學(xué)檢查前清洗AOI(Auto-OptoInspection)光學(xué)檢查(Micro2,7560)Microreview拍照判CodeJudgement&Sorting鑒定與品質(zhì)分類出貨Shipping非MVA產(chǎn)品MVA產(chǎn)品Repair修補(bǔ)(repair2,7578)MacroInspection鑒定措施日光燈箱

鈉

燈

檯

燈

綠

燈

鹵

素

燈

反射

透過

反射

透過

反射

透過

反射

透過

反射

透過

AlignmentMarkDefect

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Mura

△

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△

EBRResidue

△

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髒

污

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透過暗點(diǎn)

△

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透過亮點(diǎn)

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玻璃缺陷

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殘

膜

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刮

傷

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RGBCoinMura

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DDCoinMura

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PSCoinMura

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Discolor

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△

ColudyMura

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註：○表達(dá)主要檢驗(yàn)與鑒定方式；△表達(dá)輔助檢驗(yàn)方式。MicroInspection鑒定措施Defectcode設(shè)定為三碼,分述如下:

第一碼:群組區(qū)分2InlineMacro3InlineAOI4MeasurementNG5MicroreviewNG6MacroNG7InkRepair8MicroreviewrepairMicroInspection鑒定措施第三碼:Defect類別第二碼:層別1BM-Layer2R-Layer3G-Layer4B-Layer5ITO-Layer6MVA-