wire-bonding-詳細(xì)學(xué)習(xí)資料-課件

wirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料

ASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECTwirebonding詳細(xì)學(xué)習(xí)資料晶片Die金線GoldWire導(dǎo)線架LeadframWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacement

SingulationPackingwirebonding詳細(xì)學(xué)習(xí)資料DejunkTRIMSolderPlatingSolderPlatingDejunkTRIMTRIM/FORMING

BGASURFACEMOUNTPKGTHROUGHHOLEPKGwirebonding詳細(xì)學(xué)習(xí)資料padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3Alwirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料HARDWELDING

Pressure(Force)Amplify&FrequecyWeldingTime(BondTime)WeldingTempature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)wirebonding詳細(xì)學(xué)習(xí)資料LowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith2.5micronperstepresolutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFastresponsevoicecoilwireclampwirebonding詳細(xì)學(xué)習(xí)資料Linear3phaseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-1mmResolutionof0.2mmwirebonding詳細(xì)學(xué)習(xí)資料changeover·Fullyprogrammableindexer&tracks·Motorizedwindowclampwithsoftclosefeature·OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevicewirebonding詳細(xì)學(xué)習(xí)資料BondingSystemBondingMethodThermosonic(TS)BQMModeConstantCurrent,Voltage,PowerandNormal(Programmable)LoopTypeNormal,Low,Square&JXYResolution0.2umZResolution(capillarytravellingmotion)2.5umFinePitchCapability35mmpitch@0.6milwireNo.ofBondingWiresupto1000ProgramStorage1000programsonHardDiskMultimodeTransducerSystemProgrammableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)wirebonding詳細(xì)學(xué)習(xí)資料VisionSystemPatternRecognitionTime70ms/pointPatternRecognitionAccuracy+0.37umLeadLocatorDetection12ms/lead(3leads/frame)LeadLocatorAccuracy+2.4umPostBondInspectionFirstBond,SecondBondWireTracingMax.DieLevelDifferent400–500umFacilitiesVoltage110VAC(optional100/120/200/210/220/230/240VACMACHINESPECIFICATIONS(II)wirebonding詳細(xì)學(xué)習(xí)資料MaterialHandlingSystemIndexingSpeed200–250ms@0.5“pitchIndexerResolution1umLeadframePositionAccuracy+2milApplicableLeadframeW=17–75mm@bondingareainY=65mm=17–90mm@bondingareainY=54mmL=280mm[Maximum]T=0.075–0.8mmApplicableMagazineW=100mm(Maximum)L=140–300mmH=180mm(Maximum)MagazinePitch2.4–10mm(0.09”–0.39“)DeviceChangeover<4minutesPackageChangeover<5minutesNumberofBufferMagazine3(max.435mm)

MACHINESPECIFICATIONS(III)wirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料PREHEATBONDSITECUL/F200+/-10200+/-10ALL/F210+/-10230+/-10BGA150+/-10160+/-10TFBGA150+/-10160+/-10LBGA150+/-10160+/-10NOTINCLUDEDEDICATELINEpadleadwirebonding詳細(xì)學(xué)習(xí)資料padleadwirebonding詳細(xì)學(xué)習(xí)資料SEARCHHEIGHTpadleadwirebonding詳細(xì)學(xué)習(xí)資料SEARCHSPEED1SEARCHTOL1wirebonding詳細(xì)學(xué)習(xí)資料padleadSEARCHSPEED1SEARCHTOL1wirebonding詳細(xì)學(xué)習(xí)資料padleadSEARCHTOL1SEARCHSPEED1wirebonding詳細(xì)學(xué)習(xí)資料padleadSEARCHTOL1SEARCHSPEED1wirebonding詳細(xì)學(xué)習(xí)資料padleadSEARCHTOL1SEARCHSPEED1wirebonding詳細(xì)學(xué)習(xí)資料padleadSEARCHSPEED1SEARCHTOL1wirebonding詳細(xì)學(xué)習(xí)資料padleadSEARCHSPEED1SEARCHTOL1IMPACTFORCEwirebonding詳細(xì)學(xué)習(xí)資料padleadheatPRESSUREUltraSonicVibrationwirebonding詳細(xì)學(xué)習(xí)資料padleadUltraSonicVibrationheatPRESSUREwirebonding詳細(xì)學(xué)習(xí)資料padleadwirebonding詳細(xì)學(xué)習(xí)資料padleadwirebonding詳細(xì)學(xué)習(xí)資料padleadwirebonding詳細(xì)學(xué)習(xí)資料padleadwirebonding詳細(xì)學(xué)習(xí)資料padleadwirebonding詳細(xì)學(xué)習(xí)資料padleadRHwirebonding詳細(xì)學(xué)習(xí)資料padleadRD(ReverseDistance)wirebonding詳細(xì)學(xué)習(xí)資料padleadpadleadpadleadCalculatedWireLengthWIRECLAMP‘CLOSE’padleadCalculatedWireLengthpadleadSEARCHDELAYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadlead2ndSearchHeightSearchSpeed2SearchTol2padleadSearchSpeed2SearchTol2padleadSearchSpeed2SearchTol2wirebonding詳細(xì)學(xué)習(xí)資料padleadheatwirebonding詳細(xì)學(xué)習(xí)資料padleadheatheatpadleadheatheatFormationofasecondbond

BasepadleadpadleadpadleadpadleadTaillengthpadleadpadleadpadleadwirebonding詳細(xì)學(xué)習(xí)資料padleadwirebonding詳細(xì)學(xué)習(xí)資料padleadwirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料LeadframCapillaryGoldWirewirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料CapillaryManufacturer(SPT,GAISER,PECO,TOTO…)CapillaryData(Tip,Hole,CD,FA&OR,IC)wirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料HowToDesignYourCapillaryTIP..……PadPitchPadpitchx1.3~TIPHole..…..WireDiameterWirediameter+0.3~0.5=HCD………Padsize/open/1stBallCD+0.4~0.6=1stBondBallsizeFA&OR….Padpitch(um)FA >100 0,4 ~90/100 4,8,11<90 11,15 ICtype……looptypewirebonding詳細(xì)學(xué)習(xí)資料GoldWireManufacturer(Nippon,SUMTOMO,TANAKA….

)GoldWireData(WireDiameter,Type,)wirebonding詳細(xì)學(xué)習(xí)資料PadOpen&BondPadPitchBallSizeBallThickness

LoopheightWirePullBallshort

CraterTestwirebonding詳細(xì)學(xué)習(xí)資料

單位:umorMil

BPO:是指Pad內(nèi)層X(jué)方向及Y方向的size,一般是取最小值為我們的data

BPO:是指Pad如左邊內(nèi)層至右邊Pad左邊外層邊緣其它依此類推;或著一個(gè)Die上出現(xiàn)不同Pad大小那就是以兩個(gè)Pad中心距離為BPP,但是一般我們要取一個(gè)Die上最小的BPP

BondPadPitchBondPadOpenBondPadOpenBallSizeBallThicknesswirebonding詳細(xì)學(xué)習(xí)資料

單位:um，Mil量測(cè)倍率:50X

BallThickness計(jì)算公式60umBPP≧1/2WD=50%60umBPP≦1/2WD=40%~50%BallSizewirebonding詳細(xì)學(xué)習(xí)資料

單位:um，Mil量測(cè)倍率:20XLoopHeight線長(zhǎng)wirebonding詳細(xì)學(xué)習(xí)資料1LiftedBond(Rejected)2Breakatneck(Referwire-pullspec)3Breakatwire(Referwire-pullspec)4Breakatstitch(Referstitch-pullspec)5Liftedweld(Rejected)wirebonding詳細(xì)學(xué)習(xí)資料

單位:gramorg/mil2

BallShear計(jì)算公式

Intermetallic（IMC）有75%的共晶,SHEARSTRENGTH標(biāo)準(zhǔn)為＞6.0g/mil2。

SHEARSTRENGTH＝BallShear/Area(g/mil2)BallShear=x;BallSize=y;Area=π(y/2)2

x/π(y/2)2=zg/mil2CBallbondTestspecimenSpecimenclampShearing

ramWireBondshoulderInterfacialcontact

ballbondweldareaBondingpadh(A)UnshearedCLCBallbondCLTestspecimenSpecimenclampBondingpadFullballattachedto

wire-exceptforregions

ofintermetallicvoidingBallseparatedatbondingpad-

Ballinterface-residualintermetallic

(andsometimesportionofunalloyed

ballandmetal)onpadinbond

interactionarea(D)Ballbond-bondingpadinterface

separation(typicalAutoAl)CTestspecimenSpecimenclampShearing

ramWireMinorfragmentofball

attachedtowireBondingpadCLBallshearedtoohigh

(offline,etc.)onlya

portionofshoulderand

balltopremovedInterfacialcontact

ballbondweldarea(B)Wire(balltopand/orside)shearCBallbondCLTestspecimenSpecimenclampShearing

ramBondingpadMajorportion

ofballattachedtowireInterfacialcontact-

ballbondweldarea

intact(C)Belowcenterlineshear,ballshearedthrough(typicallyAutoAu)CBallbondCLTestspecimenSpecimenclampBondingpadPadmetallization

separatesfrom

underlyingsurfaceResidualpadonball

ball-padinterface

remainsintact(E)BondpadliftsTestspecimenSpecimenclampCBallbondCLBondingpadBondingpadlifts,

takingportionofunderlying

substratematerialwithit(F)CrateringResidualpadandsubstrateattached

toball,ball-padinterfaceremains

intactwirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料wirebonding詳細(xì)學(xué)習(xí)資料

UPTime=(TotalActualProductionTimes–TotalRepairTime)TotalActualProductionTimeDOWNTIMERATE=

TotalRepairTimeTotalActualProductionTimesTotalOperatorActualRepairTimeTotalOperatorRepairFrequencyStoppagesTotalActualProductionTimes–TotalOperatorRepairTimeTotalOperatorRepairFrequencyStoppagesTotalTechnicalActualRepairTimesTotalTechnicalRepairFrequencyStoppagesMTTS(MEANTIMETOSTOP)=MTBS(MEANTIMEBETWEENSTOP)=MTTA(MEANTIMETOASSISTANCE)=wirebonding詳細(xì)學(xué)習(xí)資料

MTBA(MeanTimeBetweenAssistance)=

TotalActualProductionTimes–TotalTechnicanRepairTimes

TotalTechnicalRepairFrequencyStoppagesMTBF(MeanTimeBetweenFailure)=

TotalActualProductionTimes–TotalTechnicianRepairTimeTotalChangePartsRepairFrequencyStoppage規(guī)格寬度

製程寬