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目錄TOC\o"1-3"\h\u28094 119041 3219782 31483組件分類Product 36998 317870 413195Binning 422421缺陷分類Defect 417831 4181914.1.2Packing 54461 529247 619706 6Thisstandardspecifiestheterminology,productclassifcaion,techmicalrequiements,marking,packaging,tran:potationandstorageofcrystllinesilicondouble-glasssolarmoduleThisstandardappliestothequalitydeterminationofcrystallinesilicondouble-glasssolarmodules.Whenthecontentbeyondthescopeofthisslandard,theassessmentwillbeconductedinacordancewiththefinalevaluation.組件分類Product為B級品、C級品和報(bào)廢品。在判定時(shí)應(yīng)優(yōu)先采用A1標(biāo)準(zhǔn)進(jìn)行判定,不符合A1標(biāo)準(zhǔn)要求的再按A2-1、A2-2A2BModulesareclasifedasqualifedproductsandunqualifedproducts.QualifedproductsarefurtherclassfedintoGradesAI,A2-1,andA2-2.UnquaifedproductsareclasifedintoGradeB,GradeC,andscrap.DeterminationshallbeprioritizedusingAlductsnotmetingAIrequirementsshallhenbejudgedgainstA2-1,A2-2criteriainsequence.ProductsnotmeetingA2criteriashallbejudgedasGradeB.GradeAlproductshaveexcellentappearanceandELA2-1品為在外觀和(或)ELA2-2GradeA2-1productshaveminordefectsinappearanceand/orELimagingbutarebetterthanA2-2.A2-2)ELGradeA2-2productshavecertaindefectsinappearanceand/orELimagingbutwithnormalelectricalpeiformance.B類組件為有嚴(yán)重外觀缺陷(超出A2-2LGradeBmoduleshaveseiousappearancedefecsexcedingA2-2level)orlargeareaitualsolderingargeareahairlinecracks,shoricuisinELimaging,buhavenotreachedthescraplevel.ScrapreferstomoduleswithbrokenglassorlargeareadelaminationGradeCisonlyapplicabletoagedmodules(includingR&D,workshopsampling.qualitytypetests,etc.)andcuslomerreturnedmodules.BinningModulepowerbinning:Power(Pm)range(0W~+5W),i.e.Ratedpower≤Pm<Ratedpower+5W.組件電流分檔標(biāo)準(zhǔn)見附錄B。4.2.2ModulecurrentbinningstandardsseeAppendixB缺陷分類DefectModuleproductdefectsareclassifiedinto:Criticaldefects,Majordefects,Minordefects.Criticaldefects(Cr):Defecttypesthatsignificantlycompromisethesafetyandreliabilityofthemodule433(Ma):影響組件可靠性、性Majordefects(Ma):Defecttypesthatcompromisethereliability,performanceorinstallationofthemodulewithconsiderablerisks.2.3.4Minordefects(Mi):Appearancedefects.ordefecsthatdoobstructthebesicproperties,functionaliyandoperationoftheproduct.5技術(shù)要求TechnicalRequirementsGroundContinuityTestInstrumentRequirement:Thesafetytestershouldprovideacurrent2.5timesthefusebreakingcurrentofthephotovoltaicmodulebeingtestedbThetescurrentis2.5timesthefusebreakingcurrent,andtestconditonsareasshowninTable6.測量組件長邊對角方向上接地孔(或安裝孔)兩點(diǎn)間的電阻值,電阻值不大于0.1Qc)Measuretheresistancevaluebetveentwopontsofthegroundinghole(ormountingholeinthelongsidediagonaldiccionofhemodule.Thersistancevalueshouldnotexceed0.1Qtopass.I-V測試及分檔1-VTestingandElectricalPerformanceVoc、短路電流IscPmax、工作電壓Vmax工作電流Imax、填充Open-circuitvoltageVoc,shortcircuicurrentsc,maximumpoweroutputPmax,workingvoltageVmax,workingcurentmax,fllfactorFF.特性曲線平滑(特別在Pm<200mA,AlFF≥77%,A2Characteristiccurvesmoothness(especiallyatthePmpoint)withaslephcight200mA.A1moduleFF≥77%,A2moduleFF≥70%組件執(zhí)行功率分檔。ModulePower4.1.2PackingPackagingshouldbeatleastprintedwitfctoryname,trademark,addres,communicationmethod,manufacturebatch,grossveight,netweight,sizeofboxandprintedwiththegraphicidentitiesofface-up,moistureprotection,shock-protectedandlaminatedquantity.Choosesuitableplywoodpeckagingorcartonpackagingaccordingtothedesignparametersoftheactualsize,qualiy,numberofpackages,andsoon.Andaddnecessarybuffermaterialtoprovideadequateedgeprotectionintheinternalpacking,payateniontopreventpresureandshock.Acertaingapshouldbebetweeneachmoduletoavoidglassscratches,abrasionandothervisualModuleshouldbewitouterpackageandgoodshockabsorberduringthetransportationofmodules.Packagebo

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