IntroductionofHalogenfree(英文)

1、1,What is halogen?,The halogens are five non metallic elements in Group VIIA, including: Fluorine (F), Chlorine (Cl), Bromine (Br), Iodine (I), Astaine (At),2,What is halogen?,Fluorine: PFC, Teflon, CFC, HCFC，PFOS. Chlorine: PVC, Flame Retardants. Bromine: Brominated Flame Retardants (BFR) such as P

2、olybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE), often found in printed circuit board and component.,3,Why Halogen Free?,More and more e-waste!,4,Worldwide Laws,Organic halide,5,RoHS excludes board-level components Internal Cables: All internal wires/cables including selected-co

3、ntrolled cables and cables within purchased subassemblies (e.g. fan, power supply); excludes connectors Flexible Printed Circuits: All flexes including selected-controlled flexes and flexes within purchased subassemblies (e.g. ODD, camera); excludes connectors,10,Manufacturing roadmap (SGS suggested

4、)September-December 2007 (Phase 2),All items listed above, plus: Plastic Mechanical Parts: All plastic mechanical parts within selected-controlled assemblies and purchased subassemblies (e.g. snubbers, grommets, shields, fans, insulators, tapes, paints, inks); excludes connectors or electrical compo

5、nents,11,Manufacturing roadmap (SGS suggested)January-April 2008 (Phase 3),All items listed above, plus: PCB Laminates: All PCB laminates used in purchased subassemblies (e.g. HDD, display panel, fans); excludes board-level components External Cables and Power Cords,12,Manufacturing roadmap (SGS sug

6、gested)May 2008 and later (Phase 4 100% Halogen-Free),All items listed above, plus: Electrical Components and Connectors: All components and connectors in PCB assemblies, flex assemblies, cable assemblies, and purchased subassemblies,13,Halogen-free course,14,Halogen test method,EN14582:2007 Charact

7、erization of wasteHalogen and sulfur contentOxygen combustion in closed system and determination methods IPC TM650 2.3.28.1 Halide Content of Soldering Fluxes and Paste,15,Halogen test method,IC: Ion Chromatography, can detect ionic halogen instead of halogen contained as organic and inorganic compo

8、unds (離子層析儀或離子色譜儀）,16,The impact to Henkel,Soldering materials Solder paste Solder wire Liquid flux Adhesive materials Underfill Chipbonder Etc,17,Soldering materials,In electronic industry most of the laws or standards focus on the printed circuit boards and assemblies where halogenated flame retar

9、dants primarily based on chlorine and bromine are used. Challenges with EN14582 - Alloy contained in solder paste or solder wire is nonflammable. - Ag in solder alloy react with Cl or Br to produce deposit AgCl or AgBr.,18,Soldering materials,Reflow solder paste or solder wire,EN14582 flow chart,Aft

10、er reflow, scrape off the flux residue,Combust flux residue,Place solder paste into 10% IPA+90% DI Water,Heat the solution for16 hours at 80C,Analyze by IC,Analyze by IC,Reflow solder wire,After reflow, scrape off the flux residue,Dissolve flux residue by 10% IPA+90% DI Water,Analyze by IC,IPC TM650

11、 2.3.28.1,Solder paste Solder wire,19,What is the difference among the methods?,The form of halogen in flux/solder paste - Inorganic halogen compound (Ionic halogen )-can be detected by IC - Organic halogen compound (Covalent halogen )- can not be detected by IC,Halogen content detected by IC,Combus

12、t,Extract by DI water or IPA,Ionic halogen in inorganic halogen compound Ionic halogen converted from organic halogen compound,Pretreatment vs Halogen content,Example: Solder paste,20,Adhesive materials,3rd party laboratory use EN14582:2007 because its combustible in oxygen. Does the sample state (C

13、ured or Uncured) affect the result?,Example: Chipbonder,No obvious difference!,21,Most of adhesive TDS specify one property for cured sample: Extractable ionic content including - Chloride (Cl-) - Sodium (Na+) - Potassium (K+) Why extractable ionic content must be specified? Its not halogen-free consideration but reliability consideration. Metal corrosion and metal migration are the two reliability issues. If excess ionic materials such as chloride and sodium are available in adhesive, it will accelerate metal corrosion and metal migration. So MIL-STD-883E metho